公开(公告)号：EP3004416A4

公开(公告)日：2017-02-15

申请号：EP14804120

申请日：2014-05-09

Applicant: SAMSUNG ELECTRONICS CO LTD

Inventor： CHO JIN HYUN ,  KIM JIN SUB ,  YOO HYONG JUN ,  LEE SEO JOON ,  JUNG MIN CHUL

IPC: C23C14/35 ,  C23C14/02 ,  C23C14/06 ,  C23C14/20 ,  C23C28/00

CPC classification number: C23C14/0641 ,  C23C14/0015 ,  C23C14/022 ,  C23C14/205 ,  C23C14/35 ,  H05K5/0243 ,  Y10T428/31544 ,  Y10T428/31678

Abstract: A method of manufacturing a multi-layer thin film is provided. The method includes modifying a surface of a plastic object by plasma treatment, depositing at least one hardness-enhancing layer on the plastic object, and depositing a color layer on the hardness-enhancing layer. The method may further include depositing a protective layer on the color layer.

公开(公告)号：EP2482123B1

公开(公告)日：2017-05-03

申请号：EP12152428

申请日：2012-01-25

Applicant: SAMSUNG ELECTRONICS CO LTD

Inventor： CHO JIN HYUN

IPC: G02F1/1335 ,  G02F1/1333 ,  G02F1/13363 ,  H05K7/20

CPC classification number: G02F1/133385 ,  G02F1/133308 ,  G02F1/133502 ,  G02F1/133528 ,  G02F1/13363 ,  G02F2001/133331 ,  G02F2001/133531 ,  G02F2001/133541 ,  G02F2001/133562 ,  G02F2001/133638 ,  G02F2202/22 ,  H05K7/20972

公开(公告)号：EP2961861A4

公开(公告)日：2016-11-30

申请号：EP14804026

申请日：2014-05-13

Applicant: SAMSUNG ELECTRONICS CO LTD

Inventor： KIM JIN SUB ,  YOO HYONG JUN ,  JUNG MIN CHUL ,  JUNG HYUN JUN ,  CHO JIN HYUN

IPC: C23C28/00 ,  C23C14/00 ,  C23C14/34 ,  C23C30/00

CPC classification number: C23C28/34 ,  C23C14/0015 ,  C23C14/3485 ,  C23C28/00 ,  C23C28/322 ,  C23C30/005 ,  Y10T428/264 ,  Y10T428/31522 ,  Y10T428/31544 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31699

Abstract: Disclosed herein is a method of forming a multilayer thin film by depositing target particles, detached from a target by plasma discharge of inert gas, on a metal object using a multilayer thin film deposition apparatus and a multilayer thin film formed by the method. More specifically, a sputtering deposition apparatus is used as the multilayer thin film deposition apparatus. The method includes coating a metal object with a coating layer, depositing at least one hardness-enhancing layer on the coating layer, and depositing a color layer on the at least one hardness-enhancing layer.

Abstract translation: 在是通过使用多层薄膜沉积设备和多层薄膜由本发明公开的方法形成沉积的目标粒子，通过惰性气体的等离子体放电从目标分离，金属物体上形成的多层薄膜的方法。 更具体地，溅射沉积装置被用作多层薄膜沉积设备。 该方法包括：涂覆有涂层的金属物体，在沉积涂层上的至少一个硬度增强层，以及在沉积至少一个硬度增强层上的滤色层。

公开(公告)号：EP2652729A4

公开(公告)日：2015-06-17

申请号：EP11848748

申请日：2011-12-14

Applicant: SAMSUNG ELECTRONICS CO LTD

Inventor： CHO JIN HYUN ,  BAI YOUNG JAI

IPC: G09G3/36 ,  G02F1/1333

CPC classification number: G02F1/133382 ,  G09G3/3648 ,  G09G2320/0252 ,  G09G2320/041 ,  Y10S977/742 ,  Y10S977/949

公开(公告)号：EP2648883A4

公开(公告)日：2015-01-21

申请号：EP11847808

申请日：2011-11-25

Applicant: SAMSUNG ELECTRONICS CO LTD

Inventor： CHO JIN HYUN ,  KIM JIN SUB ,  LEE JONG WON

IPC: B29C45/73 ,  B29C45/72 ,  B29C45/82 ,  H05B3/14 ,  H05B3/22

CPC classification number: B29C45/73 ,  B29C45/7312 ,  B29C2045/7368 ,  B29C2045/7393 ,  H05B3/141 ,  H05B3/145 ,  H05B3/46 ,  H05B2203/013 ,  H05B2214/04