RESIN COMPOSITION
    3.
    发明公开
    RESIN COMPOSITION 审中-公开
    树脂组合物

    公开(公告)号:EP1473329A1

    公开(公告)日:2004-11-03

    申请号:EP03737474.1

    申请日:2003-02-04

    摘要: Aresin composition, substratematerial, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties.
    A resin composition containing 100 parts by weight of a thermosetting resin and 0.1 - 65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of up to 17 x 10 -3 [°C -1 ] over the temperature range from a temperature 10 °C higher than a glass transition temperature of the resin composition to a temperature 50 °C higher than the glass transition temperature of the resin composition.

    摘要翻译: 提供了具有改进的机械性能,尺寸稳定性,耐热性和阻燃性,特别是高的耐热性和阻燃性的树脂组合物,基材,片材,层压板,含树脂铜箔,覆铜箔层压板,TAB带,印刷板, 温度物理性质。 树脂组合物含有100重量份热固性树脂和0.1-65重量份无机化合物,树脂组合物的平均线性膨胀系数(α2)高达17×10-3 [℃-1] 在比树脂组合物的玻璃化转变温度高10℃的温度至比树脂组合物的玻璃化转变温度高50℃的温度范围内。

    RESIN COMPOSITION
    5.
    发明授权
    RESIN COMPOSITION 有权
    树脂组合物

    公开(公告)号:EP1473328B1

    公开(公告)日:2011-05-04

    申请号:EP03737473.3

    申请日:2003-02-04

    摘要: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1 - 65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient ( alpha 2) of 1.0x10 Ä DEG C Ü or below over the temperature range from a temperature 10 DEG C higher than a glass transition temperature of the resin composition to a temperature 50 DEG C higher than the glass transition temperature of the resin composition.

    摘要翻译: 优选机械特性,尺寸稳定性,耐热性,阻燃性等特别是高温特性优异的树脂组合物,基材,片材,层压体,带树脂铜箔,覆铜箔层压板,TAB用胶带, 印刷线路板,预浸料和粘合片。 该树脂组合物含有热塑性树脂100重量份和无机化合物0.1〜65重量份,平均线膨胀系数(α2)为1.0×10-3 [℃]以下, 从比树脂组合物的玻璃化转变温度高10℃的温度到比玻璃化转变温度高50℃的温度范围。

    RESIN COMPOSITION
    6.
    发明公开
    RESIN COMPOSITION 有权
    HARZZUSAMMENSETZUNG

    公开(公告)号:EP1473328A1

    公开(公告)日:2004-11-03

    申请号:EP03737473.3

    申请日:2003-02-04

    摘要: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties.
    A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1 - 65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of 1.0x10 -3 [°C -1 ] or below over the temperature range from a temperature 10 °C higher than a glass transition temperature of the resin composition to a temperature 50 °C higher than the glass transition temperature of the resin composition.

    摘要翻译: 提供树脂组合物,基材,片,层压板,含树脂铜箔,覆铜层压板,TAB带,印刷电路板,预浸料和粘合片,其具有改进的物理性能,尺寸稳定性,耐热性和阻燃性 ,特别是高温物理性能。 含有100重量份热塑性树脂和0.1-65重量份无机化合物的树脂组合物,该树脂组合物的平均线性膨胀系数(α2)为1.0×10 -3Ä 在比树脂组合物的玻璃化转变温度高10℃的温度到高于树脂组合物的玻璃化转变温度的温度50℃的温度范围内,C <-1>或更低。