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公开(公告)号:EP4455223A1
公开(公告)日:2024-10-30
申请号:EP22911327.9
申请日:2022-12-22
摘要: The present invention aims to provide a curable resin composition that can planarize bonding surfaces and connect elements without leaving surface voids even when the elements have irregularities on the surface, thus imparting high bonding reliability between the elements, a cured film formed using the curable resin composition, a stack including the cured film, an imaging device including the stack, an semiconductor device including the stack, a method for producing the stack, and a method for producing an element including a bonding electrode for use in production of the stack. Provided is a curable resin composition containing: an organosilicon compound; and a solvent, the curable resin composition having a viscosity at 25°C of 2,000 cP or less, the solvent being contained in an amount of 50% by weight or less in the curable resin composition, the curable resin composition having an adhesion of a score of 0 to 2 as measured by a cross-cut method in conformity with JIS K5600-5-6 using a measurement sample obtained by spin-coating a silicon wafer with the composition, evaporating the solvent, and then heat curing at 300°C for one hour to form a film.
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公开(公告)号:EP4455224A1
公开(公告)日:2024-10-30
申请号:EP22911329.5
申请日:2022-12-22
摘要: The present invention aims to provide a curable resin composition capable of forming a film which, even when made thick, is less likely to crack at high temperature under a nitrogen atmosphere, a cured film formed using the curable resin composition, a stack including the cured film, an imaging device including the stack, an semiconductor device including the stack, a method for producing the stack, and a method for producing an element including a bonding electrode for use in production of the stack. Provided is a curable resin composition containing: a polyimide; and a silsesquioxane, the polyimide being contained in an amount of 0.5 parts by weight or more and 50 parts by weight or less relative to 100 parts by weight of the silsesquioxane.
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公开(公告)号:EP1473329A1
公开(公告)日:2004-11-03
申请号:EP03737474.1
申请日:2003-02-04
发明人: AKAHO, Kazunori , YONEZAWA, Koji , YAGI, Motohiro , FUJIWARA, Akihiko , SHIBAYAMA, Koichi , DEGUCHI, Hidenobu
IPC分类号: C08L101/00 , C08K3/00 , B32B15/08 , H05K3/46 , H05K1/03
CPC分类号: C08K3/346 , H05K1/0373 , H05K1/0393 , H05K3/4626 , H05K3/4635 , H05K2201/0129 , H05K2201/0209 , H05K2201/0358 , H05K2201/068 , Y10T428/25 , Y10T428/254 , Y10T428/26 , Y10T428/269
摘要: Aresin composition, substratematerial, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties.
A resin composition containing 100 parts by weight of a thermosetting resin and 0.1 - 65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of up to 17 x 10 -3 [°C -1 ] over the temperature range from a temperature 10 °C higher than a glass transition temperature of the resin composition to a temperature 50 °C higher than the glass transition temperature of the resin composition.摘要翻译: 提供了具有改进的机械性能,尺寸稳定性,耐热性和阻燃性,特别是高的耐热性和阻燃性的树脂组合物,基材,片材,层压板,含树脂铜箔,覆铜箔层压板,TAB带,印刷板, 温度物理性质。 树脂组合物含有100重量份热固性树脂和0.1-65重量份无机化合物,树脂组合物的平均线性膨胀系数(α2)高达17×10-3 [℃-1] 在比树脂组合物的玻璃化转变温度高10℃的温度至比树脂组合物的玻璃化转变温度高50℃的温度范围内。
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公开(公告)号:EP4169971A1
公开(公告)日:2023-04-26
申请号:EP21829982.4
申请日:2021-06-18
发明人: SHIOJIMA, Taro , SATO, Kenichiro , DEGUCHI, Hidenobu , ISHIZAWA, Hideaki , HATAI, Munehiro , SHICHIRI, Tokushige
IPC分类号: C08G77/04 , C08G77/44 , C08L83/10 , H01L21/02 , H01L21/312 , H01L21/60 , H01L21/768 , H01L23/532 , H01L27/146 , B32B7/025
摘要: The present invention aims to provide a stack having high electrical connection reliability, a curable resin composition used for the stack, a method for producing the stack, a method for producing a substrate having a bonding electrode used for producing the stack, a semiconductor device including the stack, and an imaging device including the stack. Provided is a stack sequentially including: a first substrate having an electrode; an organic film; and a second substrate having an electrode, the electrode of the first substrate and the electrode of the second substrate are electrically connected via a through-hole extending through the organic film.
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公开(公告)号:EP1473328B1
公开(公告)日:2011-05-04
申请号:EP03737473.3
申请日:2003-02-04
IPC分类号: C08L101/00 , C08K3/00 , B32B15/08 , H05K3/46 , H05K1/03
CPC分类号: H05K1/0373 , C08K3/01 , H05K1/0393 , H05K3/4626 , H05K3/4635 , H05K2201/0129 , H05K2201/0209 , H05K2201/0358 , H05K2201/068
摘要: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1 - 65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient ( alpha 2) of 1.0x10 Ä DEG C Ü or below over the temperature range from a temperature 10 DEG C higher than a glass transition temperature of the resin composition to a temperature 50 DEG C higher than the glass transition temperature of the resin composition.
摘要翻译: 优选机械特性,尺寸稳定性,耐热性,阻燃性等特别是高温特性优异的树脂组合物,基材,片材,层压体,带树脂铜箔,覆铜箔层压板,TAB用胶带, 印刷线路板,预浸料和粘合片。 该树脂组合物含有热塑性树脂100重量份和无机化合物0.1〜65重量份,平均线膨胀系数(α2)为1.0×10-3 [℃]以下, 从比树脂组合物的玻璃化转变温度高10℃的温度到比玻璃化转变温度高50℃的温度范围。
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公开(公告)号:EP1473328A1
公开(公告)日:2004-11-03
申请号:EP03737473.3
申请日:2003-02-04
IPC分类号: C08L101/00 , C08K3/00 , B32B15/08 , H05K3/46 , H05K1/03
CPC分类号: H05K1/0373 , C08K3/01 , H05K1/0393 , H05K3/4626 , H05K3/4635 , H05K2201/0129 , H05K2201/0209 , H05K2201/0358 , H05K2201/068
摘要: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties.
A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1 - 65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of 1.0x10 -3 [°C -1 ] or below over the temperature range from a temperature 10 °C higher than a glass transition temperature of the resin composition to a temperature 50 °C higher than the glass transition temperature of the resin composition.摘要翻译: 提供树脂组合物,基材,片,层压板,含树脂铜箔,覆铜层压板,TAB带,印刷电路板,预浸料和粘合片,其具有改进的物理性能,尺寸稳定性,耐热性和阻燃性 ,特别是高温物理性能。 含有100重量份热塑性树脂和0.1-65重量份无机化合物的树脂组合物,该树脂组合物的平均线性膨胀系数(α2)为1.0×10 -3Ä 在比树脂组合物的玻璃化转变温度高10℃的温度到高于树脂组合物的玻璃化转变温度的温度50℃的温度范围内,C <-1>或更低。
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