公开(公告)号：EP1732720A4

公开(公告)日：2007-05-09

申请号：EP05728632

申请日：2005-03-31

Applicant: SENJU METAL INDUSTRY CO

Inventor： UESHIMA MINORU

IPC: B22D1/00 ,  B22D41/05 ,  B22D21/00 ,  B22D41/04 ,  B22D45/00 ,  B23K35/02 ,  B23K35/26 ,  B23K35/40 ,  F27D27/00 ,  H01L21/52

CPC classification number: F27D27/00 ,  B22D1/00 ,  B22D41/04 ,  B23K35/0244 ,  B23K35/262 ,  B23K2201/40 ,  H01L24/743 ,  H01L2224/743 ,  Y10S164/90 ,  H01L2924/00

Abstract: A pouring apparatus for molten metal includes a stirrer installed in a reservoir. The stirrer is rotated by a rotational drive mechanism installed on the reservoir. Molten solder is placed into the reservoir, high melting point metal particles are charged into the molten solder, stirring is performed with the stirrer to uniformly disperse the metal particles in the molten solder, and then the molten solder and dispersed metal particles are cast into a mold. Casting can be performed quickly after charging the metal particles into the molten solder, so the metal particles do not significantly melt into the molten solder.

公开(公告)号：EP2891538A4

公开(公告)日：2016-05-04

申请号：EP13834216

申请日：2013-08-30

Applicant: SENJU METAL INDUSTRY CO

Inventor： UESHIMA MINORU ,  OSAWA ISAMU

IPC: B23K1/00 ,  B23K1/06 ,  B23K1/19 ,  B23K3/02 ,  B23K35/26 ,  C22C13/00 ,  C22C13/02 ,  H01B1/02 ,  H05K3/34

CPC classification number: C22C13/00 ,  B23K1/0006 ,  B23K1/06 ,  B23K1/19 ,  B23K3/02 ,  B23K35/26 ,  B23K35/262 ,  H01B1/02

Abstract: An electroconductive bonding material which has a high bonding strength to an inorganic nonmetal such as glass or a ceramic and which has excellent reliability in that it does not undergo peeling even when exposed to a high temperature has an alloy composition which comprises, in mass %, Zn: 0.1 - 15 %, In: 2 - 16 %, Sb: greater than 0 % to at most 2 %, optionally one or both of Ag: at most 2 % and Cu: at most 1 %, optionally at least one element selected from the group consisting of Ba, Ti, and Ca in a total amount of 0.01 - 0.15 %, and a remainder of Sn. This electroconductive bonding material peels off when it is heated to at least its melting point and can be reused.

公开(公告)号：EP2589459A4

公开(公告)日：2015-08-05

申请号：EP11800638

申请日：2011-06-17

Applicant: SENJU METAL INDUSTRY CO

Inventor： UESHIMA MINORU ,  INAGAWA YOSHIMI ,  TOYODA MINORU

IPC: B23K35/26 ,  B23K1/00 ,  B23K101/40 ,  C22C12/00 ,  H05K3/34

CPC classification number: B23K35/264 ,  B23K1/0016 ,  B23K35/26 ,  B23K2201/42 ,  C22C12/00 ,  H05K3/3463 ,  H05K3/3494

公开(公告)号：EP2275224A4

公开(公告)日：2011-11-09

申请号：EP09734301

申请日：2009-04-23

Applicant: SENJU METAL INDUSTRY CO

Inventor： KAWAMATA YUJI ,  UESHIMA MINORU ,  KANG MIN ,  NAKAGAWA KAYAKO ,  KOKUBU YASUAKI

IPC: B23K35/26 ,  B23K1/00 ,  B23K1/20 ,  B23K35/02 ,  B23K35/362 ,  B23K101/42 ,  C22C13/02 ,  H01L21/60 ,  H01L23/12 ,  H01L23/488 ,  H05K3/34

CPC classification number: B23K1/0016 ,  B23K1/203 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/362 ,  B23K2201/42 ,  C22C13/02 ,  H01L23/488 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/3484 ,  H01L2924/00

公开(公告)号：EP2679334A4

公开(公告)日：2016-06-01

申请号：EP12749274

申请日：2012-02-27

Applicant: SENJU METAL INDUSTRY CO

Inventor： ALBRECHT HANS-JURGEN ,  WILKE KLAUS ,  SUGANUMA KATSUAKI ,  UESHIMA MINORU

IPC: B23K35/26 ,  B23K35/02 ,  C22C1/02 ,  C22C13/00 ,  C22C13/02 ,  H05K3/34

CPC classification number: B23K35/262 ,  B23K35/0244 ,  C22C1/02 ,  C22C13/00 ,  C22C13/02 ,  H05K1/0263 ,  H05K3/3463 ,  Y10T403/479

Abstract: A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn-Ag-Bi-In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2 - 4 mass % of Ag, 2 - 4 mass % of Bi, 2 - 5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one ofNi, Co, and Fe.

公开(公告)号：EP2716401A4

公开(公告)日：2015-02-25

申请号：EP12864679

申请日：2012-08-08

Applicant: SENJU METAL INDUSTRY CO

Inventor： UESHIMA MINORU ,  FUJIMAKI REI

IPC: B23K35/26 ,  B23K35/28 ,  C22C12/00 ,  C22C13/02 ,  C22C30/02 ,  C22C30/04

CPC classification number: B23K35/262 ,  B23K35/025 ,  B23K35/24 ,  B23K35/28 ,  C22C12/00 ,  C22C13/02 ,  C22C30/02 ,  C22C30/04 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2912 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/351 ,  Y10T403/479 ,  H01L2224/45099 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/013 ,  H01L2924/01028 ,  H01L2924/20107 ,  H01L2924/20106 ,  H01L2924/00012 ,  H01L2924/00

公开(公告)号：EP2177304A4

公开(公告)日：2011-07-20

申请号：EP08791141

申请日：2008-07-14

Applicant: SENJU METAL INDUSTRY CO

Inventor： KAWAMATA YUJI ,  UESHIMA MINORU ,  TAMURA TOMU ,  MATSUSHITA KAZUHIRO ,  SAKAMOTO MASASHI

IPC: B23K35/26 ,  C22C13/00 ,  C22C13/02 ,  H05K3/34

CPC classification number: C22C13/00 ,  B23K35/262 ,  C22C13/02 ,  H05K3/3463

公开(公告)号：EP1930117A4

公开(公告)日：2009-03-11

申请号：EP06796561

申请日：2006-08-18

Applicant: SENJU METAL INDUSTRY CO

Inventor： UESHIMA MINORU

IPC: B23K35/26 ,  C22C12/00 ,  C22C28/00 ,  H05K3/34

CPC classification number: C22C28/00 ,  B23K35/26 ,  B23K35/264 ,  C22C12/00 ,  H05K3/3463

Abstract: The conventional low temperature solders have caused pollution issues and the conventional low-temperature lead-free solders have liquidus temperatures too high for low heat resistant components having a heat resistant temperature of 130°C or weak in mechanical strength due to brittleness. A lead-free low-temperature solder is composed of an In of 48-52.5 mass% and a Bi for the rest, and is mostly composed of a BiIn 2 intermetallic compound having no brittleness. Furthermore, Zn and La can be added to improve solderability, and a small amount of P can be added to prevent corrosion at a high temperature and a high humidity.

公开(公告)号：EP2883649A4

公开(公告)日：2016-03-09

申请号：EP13828210

申请日：2013-07-29

Applicant: SENJU METAL INDUSTRY CO

Inventor： FUJIMAKI REI ,  UESHIMA MINORU

IPC: B23K35/26 ,  B23K1/00 ,  B23K35/02 ,  B23K35/22 ,  B23K35/28 ,  B23K101/40 ,  C22C12/00 ,  C22C13/02 ,  C22C30/02 ,  C22C30/04 ,  C22C30/06 ,  H05K3/34

CPC classification number: B23K35/28 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K2201/40 ,  C22C12/00 ,  C22C13/02 ,  C22C30/02 ,  C22C30/04 ,  C22C30/06 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/3463 ,  Y10T403/479 ,  H01L2924/00014

公开(公告)号：EP2261964A4

公开(公告)日：2011-12-07

申请号：EP09718356

申请日：2009-03-03

Applicant: SENJU METAL INDUSTRY CO

Inventor： UESHIMA MINORU ,  SUZUKI MASAYUKI ,  YAMANAKA YOSHIE ,  YOSHIKAWA SHUNSAKU ,  YAMAKI TOKURO ,  OHNISHI TSUKASA

IPC: H01L23/485 ,  B23K35/26

CPC classification number: H01L24/11 ,  B23K35/262 ,  B23K35/268 ,  C22C13/00 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2224/8191 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/3511 ,  H01L2924/05432 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Solder used for flip chip bonding inside a semiconductor package was a Sn-Pb solder such as a Pb-5Sn composition. Lead-free solders which have been studied are hard and easily form intermetallic compounds with Sn, so they were not suitable for a flip chip connection structure inside a semiconductor package, which requires stress relaxation properties. This problem is dissolved by a flip chip connection structure inside a semiconductor package using a lead-free solder which is characterized by consisting essentially of 0.01 - 0.5 mass percent of Ni and a remainder of Sn. 0.3 - 0.9 mass percent of Cu and 0.001 - 0.01 mass percent of P may be added to this solder composition.