公开(公告)号：EP0418749A2

公开(公告)日：1991-03-27

申请号：EP90117744.4

申请日：1990-09-14

申请人： SGS-THOMSON MICROELECTRONICS S.r.l.

发明人： Cini, Carlo ,  Massironi, Angelo ,  Sisti, Luigi

IPC分类号： H01L21/607 ,  H01L23/49

CPC分类号： H01L24/85 ,  H01L23/49541 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48799 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49505 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45147 ,  H01L2924/00012 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2224/85399

摘要： An integrated device with improved connections between the pins (5) and the semiconductor material chip (2) which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads (10,11) and with high reliability of the connections, the connecting wires (8,9) are made of different materials. Advantageously, the wires (9) for the power connections are based on aluminum and have large diameters, and the wires (8) for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends (7) of the pins (5) on which the connecting wires (8,9) are to be soldered are gold-plated.

公开(公告)号：EP0418749B1

公开(公告)日：1995-11-29

申请号：EP90117744.4

申请日：1990-09-14

申请人： SGS-THOMSON MICROELECTRONICS s.r.l.

发明人： Cini, Carlo ,  Massironi, Angelo ,  Sisti, Luigi

IPC分类号： H01L21/607 ,  H01L23/49

CPC分类号： H01L24/85 ,  H01L23/49541 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48799 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49505 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45147 ,  H01L2924/00012 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2224/85399

公开(公告)号：EP0418749A3

公开(公告)日：1991-05-29

申请号：EP90117744.4

申请日：1990-09-14

申请人： SGS-THOMSON MICROELECTRONICS S.r.l.

发明人： Cini, Carlo ,  Massironi, Angelo ,  Sisti, Luigi

IPC分类号： H01L21/607 ,  H01L23/49

CPC分类号： H01L24/85 ,  H01L23/49541 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48799 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49505 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45147 ,  H01L2924/00012 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2224/85399

摘要： An integrated device with improved connections between the pins (5) and the semiconductor material chip (2) which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads (10,11) and with high reliability of the connections, the connecting wires (8,9) are made of different materials. Advantageously, the wires (9) for the power connections are based on aluminum and have large diameters, and the wires (8) for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends (7) of the pins (5) on which the connecting wires (8,9) are to be soldered are gold-plated.

摘要翻译： 一种具有改进的引脚（5）和半导体材料芯片（2）之间的连接的集成器件，其集成了电子元件。 为了允许将信号部件和功率部件集成在相同的装置中，减少了对焊盘（10,11）的面积的使用并且具有高可靠性的连接，连接线（8,9）由 不同的材料。 有利地，用于电力连接的电线（9）基于铝并且具有大的直径，并且用于信号连接的电线（8）是金基的并且具有小直径。 为了确保焊接良好，要焊接连接线（8,9）的销（5）的端部（7）镀金。