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17 条记录 (耗时 0.015 秒)

    Wire saw
    2.
    发明公开
    Wire saw 失效
    Drahtsägevorrichtung

    公开(公告)号：EP0743140A2

    公开(公告)日：1996-11-20

    申请号：EP96302607.5

    申请日：1996-04-10

    申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED ,  Mimasu Semiconductor Industry Company Limited

    发明人： Toyama, Kouhei ,  Kiuchi, Etsuo ,  Hayakawa, Kazuo

    IPC分类号： B24B27/06

    CPC分类号： B28D5/045 ,  B28D5/0058

    摘要： A wire saw 22 for slicing a semiconductor single crystal ingot G with which alignment of the crystallographic orientation of the ingot G is simple and easy in a slicing process and a method for slicing the ingot G by means of the wire saw 22. Main rollers 24a, 24b, 24c are three-dimensionally arranged with a predetermined distance between each other, and a wire 28 runs over the main rollers 24a, 24b, 24c to form arrays of wire portions parallel to each other, with said wire saw 22 an ingot G being sliced into rods R by pressing it to an array of wire portions between a pair of main rollers 24b, 24c that are used to slice the ingot G, while the wire 28 is being driven and slurry is fed to the array of wire portions between the pair of main rollers 24b, 24c, wherein the wire 28 runs over the pair of main rollers 24b, 24c used for slicing in a ratio of one turn over the pair of main rollers 24b, 24c to more than one turn over the other main roller 24a or rollers 24a 24d so that the array of wire portions running over the pair of main rollers 24b, 24c used for slicing can be arranged at a desired pitch.

    摘要翻译： 用于切割半导体单晶锭G的线锯22，其中在切割过程中晶锭G的晶体取向的取向是简单和容易的，以及通过线锯22切割锭G的方法。主辊24a ，24b，24c以相互间的预定距离三维地排列，并且线28在主辊24a，24b，24c上方延伸，以形成彼此平行的线部阵列，所述线锯22为锭G 通过将其压入到用于切割锭G的一对主辊24b，24c之间的线阵列阵列中，同时将线28驱动并且浆料被馈送到线阵列之间 一对主辊24b，24c，其中线28在用于在一对主辊24b，24c上的一圈的比例切割的一对主辊24b，24c上延伸超过另一个主辊 辊24a或辊24a 24d使得阵列 在用于切片的一对主辊24b，24c上运行的丝线部分可以以期望的间距布置。

    Wire saw
    6.
    发明公开
    Wire saw 失效
    线锯

    公开(公告)号：EP0743140A3

    公开(公告)日：1997-04-23

    申请号：EP96302607.5

    申请日：1996-04-10

    申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED ,  Mimasu Semiconductor Industry Company Limited

    发明人： Toyama, Kouhei ,  Kiuchi, Etsuo ,  Hayakawa, Kazuo

    IPC分类号： B24B27/06

    CPC分类号： B28D5/045 ,  B28D5/0058

    摘要： A wire saw 22 for slicing a semiconductor single crystal ingot G with which alignment of the crystallographic orientation of the ingot G is simple and easy in a slicing process and a method for slicing the ingot G by means of the wire saw 22. Main rollers 24a, 24b, 24c are three-dimensionally arranged with a predetermined distance between each other, and a wire 28 runs over the main rollers 24a, 24b, 24c to form arrays of wire portions parallel to each other, with said wire saw 22 an ingot G being sliced into rods R by pressing it to an array of wire portions between a pair of main rollers 24b, 24c that are used to slice the ingot G, while the wire 28 is being driven and slurry is fed to the array of wire portions between the pair of main rollers 24b, 24c, wherein the wire 28 runs over the pair of main rollers 24b, 24c used for slicing in a ratio of one turn over the pair of main rollers 24b, 24c to more than one turn over the other main roller 24a or rollers 24a 24d so that the array of wire portions running over the pair of main rollers 24b, 24c used for slicing can be arranged at a desired pitch.

    摘要翻译： 用于切割半导体单晶锭G的线锯22，在切割过程中，晶锭G的晶体取向的对准简单且容易，并且用线锯22切割锭G.主辊24a ，24b，24c以预定距离彼此三维布置，并且线28在主辊24a，24b，24c上方延伸以形成彼此平行的线部分阵列，所述线锯22为锭G 通过将其压到用于切割锭G的一对主辊24b，24c之间的一系列线部分而被切成棒R，同时线28被驱动并且浆料被供给到线材部分阵列之间 一对主滚筒24b，24c，其中，导线28在一对主滚筒24b，24c上以一圈的比率在用于切片的一对主滚筒24b，24c上滑动超过一圈 滚子24a或滚子24a，24d使得该阵列 在用于切片的一对主辊24b，24c上延伸的线部分可以以期望的间距布置。

    Wire saw and method of slicing a cylindrical workpiece
    7.
    发明公开
    Wire saw and method of slicing a cylindrical workpiece 失效
    Drahtsägeund Verfahren zum Zerschneiden eines zylindrischenWerkstücks

    公开(公告)号：EP1371467A1

    公开(公告)日：2003-12-17

    申请号：EP03019947.5

    申请日：1997-03-26

    申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED

    发明人： Kiuchi, Etsuo ,  Hayakawa, Kazuo ,  Toyama, Kohei

    IPC分类号： B28D5/04 ,  B28D5/00

    CPC分类号： B28D5/0064 ,  B28D5/007 ,  B28D5/045 ,  Y02P70/179

    摘要： In a wire saw for slicing a cylindrical workpiece such as a silicon ingot so as to obtain wafers or the like, the feed rate of slurry, fed to the workpiece, the viscosity of the slurry, or the feed rate of a wire is varied according to the cutting length in the workpiece or the angle between the wire and the circumference of the workpiece. It becomes possible to obtain wafers or the like, each having a uniform thickness.

    摘要翻译： 在用于切割诸如硅锭的圆柱形工件以获得晶片等的线锯中，馈送到工件的浆料的进料速率，浆料的粘度或者丝的进给速率根据 到工件的切割长度或者线与工件的圆周之间的角度。 可以获得各自具有均匀厚度的晶片等。

    Method of Manufacturing wire for use in a wire saw and wire for use in a wire saw
    8.
    发明公开
    Method of Manufacturing wire for use in a wire saw and wire for use in a wire saw 失效
    一种用于生产线用于在金属丝使用过程中锯和钢丝用于钢丝锯使用

    公开(公告)号：EP0799655A1

    公开(公告)日：1997-10-08

    申请号：EP97301966.4

    申请日：1997-03-24

    申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED

    发明人： Kiuchi, Etsuo ,  Hayakawa, Kazuo ,  Toyama, Kohei

    IPC分类号： B21C1/00 ,  B21C37/04

    CPC分类号： B21C37/042 ,  B21C1/003 ,  B23D61/185 ,  B23D65/00 ,  Y10T29/49812

    摘要： A method of manufacturing wire for use in a wire saw used for slicing a semiconductor ingot into wafers is disclosed. A starting wire, which is an iron or iron alloy wire plated with copper or copper alloy, is drawn into a fine wire in a finish drawing step. Subsequently, copper or copper alloy plating is removed from the fine wire surface through chemical polishing with an acid treatment solution or a like solution, physical polishing with polishing cloth or the like, or electropolishing, or through combined polishing thereof. The method makes it possible to manufacture wire having excellent quality characteristics without raising a problem such as metal contamination of product wafers sliced from the ingot.

    摘要翻译： 锯用于切割半导体晶锭为晶片是光盘制造游离缺失线用于在使用丝的方法。 这是在铁或铁合金导线甲启动用导线，都用铜或铜合金镀层，被吸入在拉拔精加工工序的细金属丝。 随后，铜或铜合金镀层，从细金属丝表面通过化学抛光用酸处理溶液或类似的溶液中，用抛光布或类似物，或电抛光物理抛光移除，或者通过它们的组合抛光。 该方法使得有可能制造出具有优良品质特性不提高的问题电线：比如自晶棒切产品晶片的金属污染。

    A roller
    10.
    发明公开
    A roller 失效
    伊恩瓦尔泽

    公开(公告)号：EP0689891A1

    公开(公告)日：1996-01-03

    申请号：EP95304272.8

    申请日：1995-06-20

    申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED

    发明人： Kiuchi, Etsuo ,  Hayakawa, Kazuo ,  Toyoma, Kouhei, c/o Shin-Etsu Handotai Co., Ltd.

    IPC分类号： B23D57/00

    CPC分类号： B23D57/0053 ,  Y10T83/293 ,  Y10T83/9292

    摘要： A roller (40) with grooves (43a) for a wire saw around which a cutting wire is wrapped comprises a hollow core member (42) having its inside divided into two with a boundary (40a) at the centre in the longitudinal direction. Each of the internal halves has a passage (60) for circulation of a coolant and the inlet (45a) and outlet (45b) of each passage (60) are provided in the vicinity of the outer end of the half including the passage (60).

    摘要翻译： 具有用于线锯周围的用于切割线的线锯的槽（43a）的辊（40）包括一个中空芯构件（42），其内部被分为两个，在纵向方向上的中心具有边界（40a）。 每个内部半部具有用于循环冷却剂的通道（60），并且每个通道（60）的入口（45a）和出口（45b）设置在包括通道（60）的一半的外端附近 ）。