公开(公告)号：EP3076143B1

公开(公告)日：2018-06-13

申请号：EP15200458.6

申请日：2015-12-16

申请人： STMicroelectronics S.r.l.

发明人： VAIANA, Michele ,  CASELLA, Daniele ,  BRUNO, Giuseppe

IPC分类号： G01K7/01 ,  G01K7/34

CPC分类号： G01K7/343 ,  G01K7/01 ,  G01K7/34

摘要： A sensing element (25) is integrated in a semiconductor material chip (60) and has a sensing diode (3), of a junction type, configured to be reverse biased so that its junction capacitance is sensitive to the local temperature. A reading stage (28) is coupled to the sensing element for detecting variations of the junction capacitance of the sensing diode and outputting a reading acquisition signal proportional to the local temperature of the sensing diode. The sensing diode (3) has a cathode terminal (K) coupled to a biasing node (2) and an anode terminal (A) coupled to a first input (7) of the sensing stage (28). The biasing node (2) receives a voltage (DRH) positive with respect to the first input (7) of the sensing stage (28) for keeping the sensing diode reverse biased.

公开(公告)号：EP4001866A1

公开(公告)日：2022-05-25

申请号：EP21209147.4

申请日：2021-11-18

申请人： STMicroelectronics S.r.l.

发明人： VAIANA, Michele ,  DUQI, Enri ,  CASTAGNA, Maria Eloisa

IPC分类号： G01J3/02 ,  G01J3/28 ,  G01J3/18 ,  G02B26/02

摘要： Radiation sensor including a detection assembly (102; 202) and a chopper assembly (101), which are mechanically coupled to delimit a main cavity (61; 216); and wherein the chopper assembly (101) includes: a suspended movable structure (55), which extends in the main cavity (61; 261); and an actuation structure (63, 65), which is electrically controllable to cause a change of position of the suspended movable structure (55). The detection unit (102; 202) includes a detection structure (80; 180; 280; 380), which faces the main cavity (61; 261) and includes a number of detection devices (94; 194). The suspended movable structure (55) includes a first shield (34) of conductive material, which shields the detection devices (94) from the radiation, the shielding of the detection devices (94) being a function of the position of the suspended movable structure (55).

公开(公告)号：EP3076143A1

公开(公告)日：2016-10-05

申请号：EP15200458.6

申请日：2015-12-16

申请人： STMicroelectronics S.r.l.

发明人： VAIANA, Michele ,  CASELLA, Daniele ,  BRUNO, Giuseppe

IPC分类号： G01K7/01 ,  G01K7/34

CPC分类号： G01K7/343 ,  G01K7/01 ,  G01K7/34

摘要： A sensing element (25) is integrated in a semiconductor material chip (60) and has a sensing diode (3), of a junction type, configured to be reverse biased so that its junction capacitance is sensitive to the local temperature. A reading stage (28) is coupled to the sensing element for detecting variations of the junction capacitance of the sensing diode and outputting a reading acquisition signal proportional to the local temperature of the sensing diode. The sensing diode (3) has a cathode terminal (K) coupled to a biasing node (2) and an anode terminal (A) coupled to a first input (7) of the sensing stage (28). The biasing node (2) receives a voltage (DRH) positive with respect to the first input (7) of the sensing stage (28) for keeping the sensing diode reverse biased.

摘要翻译： 感测元件（25）集成在半导体材料芯片（60）中并且具有结型的感测二极管（3），其被配置为反向偏置，使得其结电容对于局部温度敏感。 读取级（28）耦合到感测元件，用于检测感测二极管的结电容的变化，并输出与感测二极管的局部温度成比例的读取采集信号。 感测二极管（3）具有耦合到偏置节点（2）的阴极端子（K）和耦合到感测级（28）的第一输入端（7）的阳极端子（A）。 偏置节点（2）接收相对于感测级（28）的第一输入端（7）为正的电压（DRH），用于保持感测二极管反向偏置。

公开(公告)号：EP4006509A1

公开(公告)日：2022-06-01

申请号：EP21211154.6

申请日：2021-11-29

申请人： STMicroelectronics S.r.l.

发明人： BRUNO, Giuseppe ,  VAIANA, Michele ,  CASTAGNA, Maria Eloisa ,  RECCHIA, Angelo

IPC分类号： G01J5/02 ,  G01J5/12 ,  G01J5/14 ,  G01J5/20 ,  H01L27/146

摘要： A thermographic sensor (105) is proposed. The thermographic sensor (105) comprises one or more thermo-couples (305), each for providing a sensing voltage depending on a difference between a temperature of a hot joint (H) and a temperature of a cold joint (P-N) of the thermo-couple (305); the thermographic sensor (105) further comprises one or more sensing transistors (310), each driven according to the sensing voltages of one or more corresponding thermo-couples (305) for providing a sensing electrical signal depending on its temperature and on the corresponding sensing voltages. A thermographic device (100) comprising the thermographic sensor (105) and a corresponding signal processing circuit (110), and a system (700) comprising one or more thermographic devices (100) are also proposed.

公开(公告)号：EP4339628A1

公开(公告)日：2024-03-20

申请号：EP23194464.6

申请日：2023-08-31

申请人： STMicroelectronics S.r.l.

发明人： NICOLLINI, Germano ,  VAIANA, Michele

IPC分类号： G01R27/26

摘要： A measurement system is described. The measurement system comprises a first capacitance (C 1 ), a second capacitance (C 2 ), a switching circuit (32a), a control circuit (36a) and a measurement circuit (34a). During a normal operating phase, the measurement system charges and discharges the first and second capacitances. For this purpose, the switching circuit (32a) and the control circuit (36a) periodically connect a first terminal of the first capacitance (C 1 ) to a first voltage (V 1 ) and a reference voltage (V ref ), and similarly a first terminal of the second capacitance (C 2 ) to a second voltage (V 2 ) and the reference voltage (V ref ). Conversely, the second terminal of the first capacitance (C 1 ) and the second terminal of the second capacitance (C 2 ) are connected to the input terminals of a differential operational amplifier (3440) of the differential integrator, whereby the charge difference between the capacitances (Ci, C 2 ) is transferred to the differential integrator. In this respect, a comparator with hysteresis (3446) triggers when the output signal of the differential integrator exceeds the hysteresis threshold of the comparator with hysteresis (3446).
In particular, two decoupling capacitances (C DEC1 , C DEC2 ) are connected between the input of the comparator with hysteresis (3446) and the output of the differential integrator, and the measurement systems uses two reset phases in order to store various disturbances to these decoupling capacitances (C DEC1 , C DEC2 ), thereby improving the precision of the measurement during the normal operating phase.

公开(公告)号：EP3098195A1

公开(公告)日：2016-11-30

申请号：EP15200289.5

申请日：2015-12-15

申请人： STMicroelectronics S.r.l.

发明人： BRUNO, Giuseppe ,  CONTI, Sebastiano ,  CHIRICOSTA, Mario ,  VAIANA, Michele ,  IPPOLITO, Calogero Marco ,  MAIORE, Mario ,  CASELLA, Daniele

IPC分类号： B81B7/00 ,  G01L19/00

CPC分类号： B81B7/007 ,  B81B7/02 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2207/094 ,  G01L19/0092 ,  G01N27/223 ,  H01L23/3121 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A packaged sensor assembly includes: a packaging structure (2), having at least one opening (18); a humidity sensor (5) and a pressure sensor (10), which are housed inside the packaging structure (2) and communicate fluidically with the outside through the opening (18), and a control circuit (7), operatively coupled to the humidity sensor (5) and to the pressure sensor (10);
wherein the humidity sensor (5) and the control circuit (7) are integrated in a first chip (3), and the pressure sensor (10) is integrated in a second chip (8) distinct from the first chip (3) and bonded to the first chip (3).

摘要翻译： 包装传感器组件包括：具有至少一个开口（18）的包装结构（2）; 湿度传感器（5）和压力传感器（10），其容纳在所述包装结构（2）内并通过所述开口（18）与所述外部流体连通;以及控制电路（7），其可操作地耦合到所述湿度 传感器（5）和压力传感器（10）; 其中所述湿度传感器（5）和所述控制电路（7）集成在第一芯片（3）中，并且所述压力传感器（10）集成在与所述第一芯片（3）不同的第二芯片（8）中并且 到第一芯片（3）。