摘要:
In a microelectromechanical device (1), a mobile mass (2) is suspended above a substrate (3) via elastic suspension elements (5), and is rotatable about said elastic suspension elements (5), a cover structure (10) is set above the mobile mass (2) and has an internal surface (10a) facing the mobile mass (2), and a stopper structure (12, 14) is arranged at the internal surface (10a) of the cover structure (10) and extends towards the mobile mass (2) in order to stop a movement of the mobile mass (10) away from the substrate (3) along an axis (z) transverse to the substrate (3). The stopper structure (12, 14) is arranged with respect to the mobile mass (2) so as to reduce an effect of reciprocal electrostatic interaction, in particular so as to minimize a resultant twisting moment of the mobile mass (2) about the elastic suspension elements (5).
摘要:
In a micro-electromechanical structure (1; 30; 60; 70) of semiconductor material, a detection structure (19; 31) is formed by a stator (5; 35; 61) and by a rotor (4; 34), which are mobile with respect to one another in presence of an external stress and are subject to thermal stress; a compensation structure (24; 46) of a micro-electromechanical type, subject to thermal stress and invariant with respect to the external stress, is connected to the detection structure (19; 31) thereby the micro-electromechanical structure (1; 30; 60; 70) supplies an output signal (ΔC, V OUT ) correlated to the external stress and compensated in temperature.
摘要:
A planar inertial sensor (1), comprising a first region and a second region (3, 2) of semiconductor material, the second region (2) being capacitively coupled and being mobile with respect to the first region (3), which is fixed. The second region (2) extends in a plane and has second portions (4), which face respective first portions (11) of the first region (3) and are mobile with respect to these so as to modify the distance between them the second region (2) translate with respect to the first region (3) in any direction belonging to the plane of the second region (2).
摘要:
A driving mass (3) of an integrated microelectromechanical structure (1) is moved with a rotary motion about an axis of rotation (z), and a first sensing mass (16a) is connected to the driving mass (3) via elastic supporting elements (20) so as to perform a first detection movement in the presence or a first external stress. The driving mass (3) is anchored to an anchorage (7) arranged along the axis of rotation by elastic anchorage elements (8); an opening (9a) is provided within the driving mass, and the first sensing mass (16a) is arranged within the opening. The elastic supporting and anchorage elements render the first sensing mass (16a) fixed to the driving mass (3) in the rotary driving motion, and substantially decoupled from the driving mass in the detection movement.
摘要:
In a micro-electromechanical structure, in particular an accelerometer (1;30;60), a movable mass or rotor (4;34;61) has a centroidal axis (G;G') and includes a suspended structure (8;38;62) which carries mobile electrodes (10;40). A stator (5;35;77) carries fixed electrodes (12;42) facing the mobile electrodes. The suspended structure (4;34;61) is connected to a rotor-anchoring region (16;44) via elastic elements (15;45;65). The stator includes at least one stator element (20;55;67),which carries a plurality of fixed electrodes (12;42) and is fixed to a stator-anchoring region (21;54). One of the rotor-anchoring regions and stator-anchoring regions extends along the centroidal axis (G;G') which is an axis perpendicular to the plane of the structure, through its centre of gravity, and at least another of the rotor-anchoring regions and stator-anchoring regions extends in the proximity of the centroidal axis (G;G'). Due to the small distance of all anchoring regions to each other, and to the centre of gravity, stresses due to thermal mismatches can be reduced.
摘要:
A process for the fabrication of an inertial sensor with failure threshold, including the steps of: forming, on top of a substrate (2) of a semiconductor wafer (1), at least one sample element (6) embedded in a sacrificial region (3, 12); forming, on top of the sacrificial region (3, 12), a body (18) connected to the sample element (6); and etching the sacrificial region (3, 12), so as to free the body (18) and the sample element (6).
摘要:
The inertial sensor (1) comprises an inner stator (2) and an outer rotor (3) which are electrostatically coupled together by means of mobile sensor arms (5) and fixed sensor arms (9a, 9b). The rotor (3) is connected to a calibration microactuator (12) comprising four sets (27) of actuator elements (13) arranged one for each quadrant of the inertial sensor. There are two actuator elements (13) making up each set, which are identical to each other, are angularly equidistant, and each of which comprises a mobile actuator arm (15) connected to the rotor (3) and bearing a plurality of mobile actuator electrodes (16), and a pair of fixed actuator arms (17a, 17b) which are set on opposite sides with respect to the corresponding mobile actuator arm and bear a plurality of fixed actuator electrodes (19a, 19b). The mobile actuator electrodes (16) and fixed actuator electrodes (19a, 19b) are connected to a driving unit (20) which biases them so as to cause a preset motion of the rotor (3), the motion being detected by a sensing unit (24) connected to the fixed sensor arms (9a, 9b).