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    SEALING AGENT FOR OPTICAL SEMICONDUCTOR DEVICES, AND OPTICAL SEMICONDUCTOR DEVICE
    2.
    发明公开
    SEALING AGENT FOR OPTICAL SEMICONDUCTOR DEVICES, AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
    DICHTUNGSMITTELFÜROPTISCHE HALBLEITERBAUELEMENTE UND OPTISCHES HALBLEITERBAUELEMENT

    公开(公告)号：EP2733178A1

    公开(公告)日：2014-05-21

    申请号：EP12810683.8

    申请日：2012-07-11

    申请人： Sekisui Chemical Co., Ltd.

    发明人： YAMAZAKI, Ryosuke ,  TANIKAWA, Mitsuru ,  WATANABE, Takashi ,  INUI, Osamu ,  KUNIHIRO, Yoshitaka ,  KIMU, Chizuru ,  KOBAYASHI, Yusuke ,  YASUI, Hidefumi ,  SUEZAKI, Minoru ,  KUSAKA, Yasunari ,  YAMADA, Tasuku

    IPC分类号： C08L83/07 ,  C08G77/12 ,  C08G77/20 ,  C08L83/05 ,  H01L33/56

    CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08K5/56 ,  C08L83/04 ,  C08L83/00

    摘要： The present invention provides an encapsulant for optical semiconductor devices, which is capable of suppressing surface tackiness of a cured product and is also capable of enhancing the heat resistance and thermal cycle characteristics of the cured product. An encapsulant for optical semiconductor devices according to the present invention which includes: a first organopolysiloxane which is represented by formula (1A) or formula (1B) and has an alkenyl group and a methyl group bonded to a silicon atom; a second organopolysiloxane which is represented by formula (51A) or formula (51B) and has a hydrogen atom bonded to a silicon atom and a methyl group bonded to a silicon atom; and a catalyst for hydrosilylation reaction, and the content ratios of methyl groups bonded to silicon atoms in the first and second organopolysiloxanes each are 80 mol% or more.

             (R1R2R3SiO 1/2 ) a (R4R5SiO 2/2 ) b (R6SiO 3/2 ) c       Formula (1A)

             (R1R2R3SiO 1/2 ) a (R4R5SiO 1/2 ) b (R6SiO 3/2 ) c       Formula (1B)

             (R51R52R53SiO 1/2 ) p (R54R55SiO 2/2 ) q (R56SiO 3/2 ) r       Formula (51A)

             (R51R52R53SiO 1/2 ) p (R54R55SiO 2/2 ) q (R56SiO 3/2 ) r       Formula (51B)

    摘要翻译： 本发明提供一种能够抑制固化物的表面粘性的光半导体装置用密封剂，能够提高固化物的耐热性和热循环特性。 根据本发明的光学半导体器件的密封剂，其包括：由式（1A）或式（1B）表示并具有与硅原子键合的烯基和甲基的第一有机聚硅氧烷; 由式（51A）或式（51B）表示的具有与硅原子键合的氢原子和与硅原子键合的甲基的第二有机聚硅氧烷; 和氢化硅烷化反应的催化剂，第一和第二有机聚硅氧烷中与硅原子键合的甲基的含量比分别为80摩尔％以上。 €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ（R1R2R3SiO 1/2）a（R4R5SiO 2/2）b（R6SiO 3/2）c€ƒ€ƒ€ƒ€ƒ方程式（1A ）€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ（R1R2R3SiO 1/2）a（R4R5SiO 1/2）b（R6SiO 3/2）c€ƒ€ƒ€ƒ€ƒFormula 1B）€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ（R51R52R53SiO 1/2）p（R54R55SiO 2/2）q（R56SiO 3/2）r€ƒ€ƒ€ƒ€ƒ （51A）€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ（R51R52R53SiO 1/2）p（R54R55SiO 2/2）q（R56SiO 3/2）r€ƒ€ƒ€ƒ€ 式（51B）

    ENCAPSULANT FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE USING SAME
    3.
    发明公开
    ENCAPSULANT FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE USING SAME 有权
    VERKAPSELUNGSSTOFFFÜROPTISCHE HALBLEITERBAUELEMENTE UND OPTISCHES HALBLEITERBAUELEMENT DAMIT

    公开(公告)号：EP2586832A1

    公开(公告)日：2013-05-01

    申请号：EP11798176.1

    申请日：2011-06-22

    申请人： Sekisui Chemical Co., Ltd.

    发明人： TANIKAWA, Mitsuru ,  WATANABE, Takashi ,  MORIGUCHI, Shintaro ,  INUI, Osamu ,  KUNIHIRO, Yoshitaka ,  YAMAZAKI, Ryosuke ,  OKI, Ayuko

    IPC分类号： C08L83/05 ,  C08L83/07 ,  C09K3/10 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

    CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08L83/04 ,  C09K3/1018 ,  C08L83/00

    摘要： The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity.
    The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound. The ratio of the number of the alkenyl group bound to a silicon atom in the organopolysiloxane to the number of the hydrogen atom bound to a silicon atom in the organopolysiloxane in the sealant is not less than 1.0 and not more than 2.5.

    摘要翻译： 本发明提供了一种用于光学半导体器件的密封剂，其不太可能降低其亮度，并且即使在高温和高湿度的恶劣环境中的通电状态下使用也不太可能改变其颜色。 用于光学半导体器件的密封剂，包括：不包含第一有机聚硅氧烷结合到硅原子的氢原子，但含有与硅原子的链烯基和键合到硅原子上的芳基，含有一个氢原子的第二有机聚硅氧烷 结合到硅原子和与硅原子结合的芳基，以及铂 - 烯基复合物。 铂 - 烯基复合物是通过使氯铂酸六水合物与不少于6当量的双官能或更多官能的烯基化合物反应而获得的反应产物。 与有机聚硅氧烷中的硅原子结合的烯基的数量与密封剂中的有机聚硅氧烷中与硅原子结合的氢原子数的比例为1.0以上且2.5以下。

    SEALANT FOR OPTICAL SEMICONDUCTORS AND OPTICAL SEMICONDUCTOR DEVICE
    5.
    发明公开
    SEALANT FOR OPTICAL SEMICONDUCTORS AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开
    DICHTUNGSMITTELFÜROPTISCHE HALBLEITER UND OPTISCHES HALBLEITERBAUELEMENT

    公开(公告)号：EP2554601A1

    公开(公告)日：2013-02-06

    申请号：EP11765365.9

    申请日：2011-03-18

    申请人： Sekisui Chemical Co., Ltd.

    发明人： TANIKAWA, Mitsuru ,  WATANABE, Takashi ,  MORIGUCHI, Shintaro ,  INUI, Osamu ,  KUNIHIRO, Yoshitaka ,  YAMAZAKI, Ryosuke ,  OKI, Ayuko ,  IEDA, Yasuyuki ,  KIMU, Chizuru ,  KOBAYASHI, Yusuke

    IPC分类号： C08L83/07 ,  C08L83/05 ,  C08L83/14 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

    CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08G77/52 ,  C08G77/80 ,  C08L83/04 ,  C08L83/14 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

    摘要： The present invention provides a sealant for an optical semiconductor device which has high gas barrier property against corrosive gas, and is less likely to crack or is less likely to peel off even when used in harsh environments.
    The sealant for an optical semiconductor device includes: a first silicone resin component including at least one of a first silicone resin A represented by formula (1A) shown below and a first silicone resin B represented by formula (1B) shown below, the first silicone resin A not containing a hydrogen atom bound to a silicon atom, but containing an aryl group and an alkenyl group, the first silicone resin B not containing a hydrogen atom bound to a silicon atom, but containing an aryl group and an alkenyl group; a second silicone resin component including at least one of a second silicone resin A represented by formula (51A) shown below and a second silicone resin B represented by formula (51B) shown below, the second silicone resin A containing an aryl group and a hydrogen atom directly bound to a silicon atom, the second silicone resin B containing an aryl group and a hydrogen atom directly bound to a silicon atom; and a catalyst for hydrosilylation reaction.

    摘要翻译： 本发明提供一种用于光学半导体器件的密封剂，其对腐蚀性气体具有高阻气性，并且即使在恶劣环境中使用也不太可能破裂或不太可能剥离。 光学半导体装置用密封剂包括：第一有机硅树脂成分，其含有下述式（1A）所示的第一有机硅树脂A和下述式（1B）所示的第一有机硅树脂B中的至少一种，第一硅氧烷 不含有与硅原子但含有芳基和烯基的氢原子的第一有机硅树脂A不含有与硅原子结合但含有芳基和烯基的氢原子; 第二有机硅树脂组分，其包含以下所示的由式（51A）表示的第二有机硅树脂A和由下式（51B）表示的第二有机硅树脂B中的至少一种，第二有机硅树脂A含有芳基和氢 直接与硅原子结合的原子，第二有机硅树脂B含有与硅原子直接结合的芳基和氢原子; 和氢化硅烷化反应的催化剂。