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    Pressure sensor
    2.
    发明公开
    Pressure sensor 审中-公开
    压力传感器

    公开(公告)号：EP2871455A1

    公开(公告)日：2015-05-13

    申请号：EP13005235.0

    申请日：2013-11-06

    申请人： Sensirion AG

    发明人： Mayer, Felix ,  von Waldkirch, Marc ,  Bühler, Johannes ,  Hummel, René ,  Braun, Stephan ,  Lin, Chung-Hsien , 

    IPC分类号： G01L19/14 ,  B81B3/00

    摘要： A pressure sensor comprises a first substrate (1) containing a processing circuit integrated thereon and a cap (4) attached to the first substrate (1). The cap (4) includes a container (41), a holder (42), and one or more suspension elements (45) for suspending the container (41) from the holder (42). The container (41) includes a cavity (411) and a deformable membrane (412) separating the cavity (411) and a port open to an outside of the pressure sensor. The container (41) is suspended from the holder (42) such that the deformable membrane (412) faces the first substrate (1) and such that a gap (6) is provided between the deformable membrane (412) and the first substrate (1) which gap (6) contributes to the port. Sensing means (116) are provided for converting a response of the deformable membrane (412) to pressure at the port into a signal capable of being processed by the processing circuit.

    摘要翻译： 压力传感器包括其上集成有处理电路的第一衬底（1）和附接到第一衬底（1）的帽（4）。 帽（4）包括容器（41），保持器（42）以及用于将容器（41）从保持器（42）悬挂的一个或多个悬挂元件（45）。 容器（41）包括空腔（411）和将空腔（411）分隔开的可变形膜（412）和通向压力传感器外部的端口。 容器（41）从支架（42）悬挂，使得可变形膜（412）面向第一基板（1）并且使得在可变形膜（412）与第一基板（1）之间提供间隙（6） 1）哪个缝隙（6）有助于港口。 提供感测装置（116），用于将可变形膜（412）的响应转换成端口处的压力，以转换成能够由处理电路处理的信号。

    Sensor device
    3.
    发明公开
    Sensor device 有权
    传感器设备

    公开(公告)号：EP2871152A1

    公开(公告)日：2015-05-13

    申请号：EP13005237.6

    申请日：2013-11-06

    申请人： Sensirion AG

    发明人： Hunziker, Werner ,  Braun, Stephan

    IPC分类号： B81B7/00 ,  B81C1/00

    CPC分类号： G01N33/0009 ,  B81B7/0029 ,  B81C1/00896 ,  G01N2033/0095 ,  Y10T156/1052

    摘要： A sensor device comprises a sensitive element (1) and a support (2) for the sensitive element, the support having a surface (3) with an access opening (4) to the sensitive element (1). A layer of adhesive material (5) covers at least parts of the surface (3). A venting medium (6) extends over the entire surface (3) of the support (2) and the access opening (4) and is attached to the support (2) by the layer of adhesive material (5).

    摘要翻译： 传感器装置包括敏感元件（1）和用于敏感元件的支撑件（2），支撑件具有带敏感元件（1）的进入开口（4）的表面（3）。 一层粘合材料（5）覆盖表面（3）的至少一部分。 通风介质（6）在支撑件（2）和进入开口（4）的整个表面（3）上延伸并且通过粘合材料层（5）附接到支撑件（2）。

    METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE
    6.
    发明公开
    METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：EP3355348A1

    公开(公告)日：2018-08-01

    申请号：EP17153301.1

    申请日：2017-01-26

    申请人： Sensirion AG

    发明人： Böller, Matthias ,  Brugger, Thomas ,  Braun, Stephan

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49582 ,  H01L2224/48247 ,  H01L2224/49171

    摘要： In a method for manufacturing a semiconductor package an electrically conducting leadframe (2) is provided including a front side (fs) and a back side (bs), and including a die pad (21), a set of contact pads (22) and a support lead (24) connected to the contact pads (22) of the set. A semiconductor chip (3) is mounted on the front side (fs) of the die pad (21) resulting in a leadframe assembly (4). The leadframe assembly (4) is at least partially encapsulated. The support lead (24) is separated from the contact pads (22) thereby generating at least an exposed side face (sf) of each contact pad (22). An electroless immersion plating process is applied resulting in a semiconductor package (10) having contact pads (22) with at least a side face (sf) each plated with a silver plating (81) and a gold plating (82) on top of the silver plating (81).

    MICROFLUIDIC CATRIDGE
    7.
    发明公开
    MICROFLUIDIC CATRIDGE 审中-公开

    公开(公告)号：EP4393593A1

    公开(公告)日：2024-07-03

    申请号：EP23150066.1

    申请日：2023-01-02

    申请人： Sensirion AG

    发明人： Braun, Stephan ,  Lendenmann, Tobias ,  Bürgi, Lukas ,  Streiff, Matthias

    IPC分类号： B01L3/00

    CPC分类号： B01L3/502715 ,  B01L2300/0420130101 ,  B01L2300/063620130101 ,  B01L2200/0420130101 ,  B01L2200/1020130101 ,  B01L2300/088720130101 ,  B01L2300/081920130101

    摘要： The present invention relates to a cartridge (1) that is configured to perform an assay, when it is in use, to evaluate at least a parameter of a fluid sample, the cartridge (1) being electrically connected to a reader when it is in use, comprising: a planar substrate (2) with a top substrate surface (3) comprising at least substrate electrical contacts (6) and a bottom substrate surface (4) that is disposed opposite to the top substrate surface (3), at least a microfluidic channel (5, 5a, 20a, 21a) that is configured to receive the fluid sample to be evaluated, a biochip (7) comprising: a top biochip surface (8) and a bottom biochip surface (9) disposed opposite to the top biochip surface (8), biochip electrical contacts (12), biochip electrical connectors (12a) that are electrically coupled to at least some of the biochip electrical contacts (12) and formed on at least one of the top and the bottom biochip surfaces (8, 9), and a sensing aspect (10) comprising at least a biosensor (11) that is disposed relative to the microfluidic channel (5, 5a, 20a, 21a) to receive the fluid sample, and a sealing layer (13, 20, 2127) that forms a substantially fluid-tight sealant relative to at least one of the biochip (7) and the substrate (2) when the cartridge is in use, wherein the biochip (7) and the substrate (2) are in one of: an alignment configuration, in which the biochip electrical connectors (12a) and substrate electrical contacts (6) are in geometrical alignment with each other, and a compression configuration, when the cartridge (1) is in use, in which the aligned biochip electrical connectors (12a) and the substrate electrical contacts (6) are compressed together and are electrically connected.

    SENSOR PACKAGE
    8.
    发明公开
    SENSOR PACKAGE 审中-公开

    公开(公告)号：EP3396329A1

    公开(公告)日：2018-10-31

    申请号：EP17168692.6

    申请日：2017-04-28

    申请人： Sensirion AG

    发明人： Hunziker, Werner ,  Braun, Stephan ,  Pustan, David ,  Boeller, Matthias

    IPC分类号： G01D11/24 ,  G01D5/12

    CPC分类号： G01D11/245 ,  G01D5/12

    摘要： A sensor package comprises a sensor chip (3) with a sensitive element (31) exposed to an environment of the sensor package, and contact pads (2) for electrically contacting the sensor package. Electrical connections (5) are applied between the sensor chip (3) and the contact pads (2). A molding compound (1) at least partially encloses the sensor chip (3) and the contact pads (2). A unit (3,73) consisting of the sensor chip (3) and optionally of a die pad (73) supporting the sensor chip (3) is arranged such that a top surface (ts) of the unit (3,73) does not protrude from a level defined by a top surface (ts) of the contact pads (2), and a bottom surface (bs) of the unit (3,73) does not protrude from a level defined by a bottom surface (bs) of the contact pads (2).

    FLOW SENSOR
    9.
    发明公开
    FLOW SENSOR 审中-公开
    DURCHFLUSSSENSOR

    公开(公告)号：EP3150976A1

    公开(公告)日：2017-04-05

    申请号：EP15188247.9

    申请日：2015-10-02

    申请人： Sensirion AG

    发明人： Braun, Stephan ,  Kostner, Stefan ,  Mahler, Lukas

    IPC分类号： G01F1/692

    CPC分类号： G01F1/692 ,  G01F1/684

    摘要： The invention relates to a flow sensor for measuring the flow of a medium, particularly a liquid, comprising: a semiconductor module (1) on which at least one temperature sensor (13a, 13b), a heat source (12) and electrical connection points (18) are integrated, a substrate (5) on which conductor paths (19) are provided, wherein the substrate (5) is configured to be at least partially arranged between the semiconductor module (1) and said medium, wherein each connection point (18) is connected to an associated conductor path, and wherein the heat source and the at least one temperature sensor is configured to be in thermal contact with said medium via said substrate (5) such that said substrate (5) forms a thermally conducting partition wall between the semiconductor module (1) and said medium. According to the invention, the partition wall (5a) comprises or is formed as a liquid crystal polymer. Furthermore, the invention relates to a method for manufacturing such a flow sensor.

    摘要翻译： 本发明涉及一种用于测量介质，特别是液体的流动的流量传感器，包括：半导体模块（1），至少一个温度传感器（13a，13b），热源（12）和电连接点 （18）被集成在其上设置有导体路径（19）的基板（5），其中所述基板（5）被配置为至少部分地布置在所述半导体模块（1）和所述介质之间，其中每个连接点 （18）连接到相关联的导体路径，并且其中所述热源和所述至少一个温度传感器被配置为经由所述衬底（5）与所述介质热接触，使得所述衬底（5）形成导热 半导体模块（1）和所述介质之间的分隔壁。 根据本发明，分隔壁（5a）包括或形成为液晶聚合物。 此外，本发明涉及一种制造这种流量传感器的方法。

    Gas sensor package
    10.
    发明公开
    Gas sensor package 审中-公开
    Sensorbaustein

    公开(公告)号：EP2765410A1

    公开(公告)日：2014-08-13

    申请号：EP14001973.8

    申请日：2014-06-06

    申请人： Sensirion AG

    发明人： Hunziker, Werner ,  Pustan, David ,  Braun, Stephan

    IPC分类号： G01N27/12 ,  G01N33/00 ,  H01L23/31 ,  H01L21/56 ,  G01D11/24 ,  G01L19/14

    CPC分类号： G01N27/26 ,  G01N27/123 ,  G01N27/128 ,  G01N33/0009 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A gas sensor package comprises a gas sensor chip (3) with a layer (31) sensitive to a gas, and with a heater (34) for heating the sensitive layer (31). Contact pads (22-27) are provided for electrically contacting the gas sensor package and a die pad (21) is provided for mounting the gas sensor chip (3) to. Electrical connections connect the gas sensor chip (3) and the contact pads (22-27). A molding compound (1) at least partially encloses the gas sensor chip (3). An opening (11) in the molding compound (1) provides access to the sensitive layer (31) of the gas sensor chip (3). One of the contact pads (26) serves as a pin for supplying electrical current to the heater (34) of the gas sensor chip (3).

    摘要翻译： 气体传感器组件包括具有对气体敏感的层（31）的气体传感器芯片（3）和用于加热敏感层（31）的加热器（34）。 提供接触焊盘（22-27）用于电气接触气体传感器封装，并且提供用于将气体传感器芯片（3）安装到的管芯焊盘（21）。 电气连接连接气体传感器芯片（3）和接触垫（22-27）。 至少部分地包围气体传感器芯片（3）的模塑料（1）。 模塑料（1）中的开口（11）提供了进入气体传感器芯片（3）的敏感层（31）的通路。 接触焊盘（26）中的一个用作用于向气体传感器芯片（3）的加热器（34）供应电流的引脚。