公开(公告)号：EP3001186B1

公开(公告)日：2018-06-06

申请号：EP14186534.5

申请日：2014-09-26

申请人： Sensirion AG

发明人： Mayer, Felix ,  Bartsch, Ulrich ,  Winger, Martin ,  Gerner, Pascal ,  Graf, Markus

IPC分类号： G01N27/22 ,  G01N27/12

CPC分类号： G01N27/048 ,  G01N27/128 ,  G01N27/14 ,  G01N27/225 ,  G01N33/0036 ,  H01L2224/18

摘要： A sensor chip comprises a substrate (1) with a front side (11) and a back side (12), and an opening (13) in the substrate (1) reaching through from its back side (12) to its front side (11). A stack (2) of dielectric and conducting layers is arranged on the front side (11) of the substrate (1), a portion of which stack (2) spans the opening (13) of the substrate (1). Contact pads (32) are arranged at the front side (11) of the substrate (1) for electrically contacting the sensor chip. A sensing element (4) is arranged on the portion of the stack (2) spanning the opening (13) on a side of the portion facing the opening (13).

公开(公告)号：EP3001186A1

公开(公告)日：2016-03-30

申请号：EP14186534.5

申请日：2014-09-26

申请人： Sensirion AG

发明人： Mayer, Felix ,  Bartsch, Ulrich ,  Winger, Martin ,  Gerner, Pascal ,  Graf, Markus

IPC分类号： G01N27/22

CPC分类号： G01N27/048 ,  G01N27/128 ,  G01N27/14 ,  G01N27/225 ,  G01N33/0036 ,  H01L2224/18

摘要： A sensor chip comprises a substrate (1) with a front side (11) and a back side (12), and an opening (13) in the substrate (1) reaching through from its back side (12) to its front side (11). A stack (2) of dielectric and conducting layers is arranged on the front side (11) of the substrate (1), a portion of which stack (2) spans the opening (13) of the substrate (1). Contact pads (32) are arranged at the front side (11) of the substrate (1) for electrically contacting the sensor chip. A sensing element (4) is arranged on the portion of the stack (2) spanning the opening (13) on a side of the portion facing the opening (13).

摘要翻译： 传感器芯片包括具有前侧（11）和后侧（12）的基板（1）和基板（1）中的从其背面（12）到其前侧（12）到达的开口（13） 11）。 电介质和导电层的堆叠（2）布置在基板（1）的前侧（11）上，其一部分堆叠（2）跨越基板（1）的开口（13）。 接触焊盘（32）布置在基板（1）的前侧（11）处，用于电接触传感器芯片。 感测元件（4）布置在跨过开口（13）的面向开口（13）的一侧的叠层（2）的部分上。

公开(公告)号：EP4108330A1

公开(公告)日：2022-12-28

申请号：EP21181054.4

申请日：2021-06-23

申请人： Sensirion AG

发明人： Winger, Martin ,  Streiff, Matthias ,  Huber, Deborah

IPC分类号： B01L3/00 ,  G01N33/48

摘要： The present invention relates to a microfluidic device (1) that is configured to determine a concentration of a target analyte (2) in a host liquid (3) using functionalized beads (4), the device (1) comprising: at least a receptacle (6) that is configured to receive the host liquid (3) and the functionalized beads (4), the receptacle (6) being implemented to have a closed surface (7), in relation to which a functionalized surface (9) is provided that is in communication with the host liquid (3), and to define a boundary surface (11) in respect of the host liquid (3), and an ultrasonic transducer (16) that is accessible to the microfluidic device (1) when it is in use, which can be positioned relative to a region of the receptacle (6) such as to produce acoustic waves in the host liquid (3) when it is operated, wherein: at least an acoustic boundary condition configured at a distinct region of the receptacle (6) and an operational frequency at which the ultrasonic transducer (16) is operated depending on at least a dimensional configuration (14, 15) of the receptacle (6), collectively define respective first and second modes of device operation, in which first and second acoustic wave configurations are correspondingly produced, so that the functionalized beads (4) are positioned differently in the receptacle (6) in respective first and second incubation events.

公开(公告)号：EP3462149A1

公开(公告)日：2019-04-03

申请号：EP17193760.0

申请日：2017-09-28

申请人： Sensirion AG

发明人： Zäch, Nicolas ,  Winger, Martin

IPC分类号： G01J5/08 ,  G01J3/10 ,  G01J5/02 ,  G01J5/12 ,  G01J5/20 ,  H01L27/144

摘要： An infrared device comprises a substrate (1). A configuration (3) for one of absorbing and emitting infrared radiation is supported by the substrate (1). The configuration (3) comprises an electrically conducting layer arrangement (31) of less than 50 nm thickness between dielectric layers (34,35). In addition, one or more of a thermal sensor (5) arranged for sensing the infrared radiation absorbed by the configuration (3), and a heater (7) arranged for heating the configuration (3) to emit the infrared radiation is supported by the substrate (1)