-
1.发明公开RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR ENCAPSULATION METHOD USING SAME 有权树脂组合物用于封装半导体和SO HALBLEITERVERKAPSELUNGSVERFAHREN的
公开(公告)号：EP3029083A1
公开(公告)日：2016-06-08
申请号：EP15197520.8
申请日：2015-12-02
CPC分类号： C08L63/00 , C08G59/24 , C08G59/42 , C08K3/01 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： Provided are a resin composition for semiconductor encapsulation being fluid and exhibiting a low viscosity at a room temperature; and a semiconductor encapsulation method resulting in a small warpage even after performing molding through resin encapsulation i.e. a wafer level package-encapsulation method.
The resin composition includes:
(A) an alicyclic epoxy compound represented by formula 1:
(B) an epoxy resin being liquid at a room temperature and an epoxy resin other than the alicyclic epoxy compound represented by formula 1;
(C) an acid anhydride curing agent;
(D) a curing accelerator; and
(E) an inorganic filler, wherein
the component (A) is in an amount of 30 to 95 parts by mass with respect to 100 parts by mass of all the epoxy resins in the total amount of the resin composition, and the component (E) is contained in the total amount of the resin composition by 80 to 95% by mass.摘要翻译： 提供了用于半导体封装是流体并且呈现在室温下具有低粘度的树脂组合物; 和半导体封装的方法的一个小翘曲甚至通过树脂封装即进行成型后得到的 晶片级封装封装方法。 该树脂组合物包括：（A）由式1表示脂环族环氧化合物：（B）在室温下，以环氧树脂为液体并以环氧比由化学式1表示的脂环环氧化合物以外的树脂; （C）在酸酐固化剂; （D）固化促进剂; 和（E）无机填料，worin组分（A）是在（一个质量与由在树脂组合物的总量中的全部环氧树脂的相对于100组质量份的量为30至95份，和组分 e）中所含的树脂组合物的由80〜95％的总量（质量）。
-
公开(公告)号：EP3401346A1
公开(公告)日：2018-11-14
申请号：EP18170802.5
申请日：2018-05-04
CPC分类号： C08G59/5033 , C08G59/68 , C08G59/70 , C08K5/0025 , C08K5/55 , C08L81/06 , C08L2203/20
摘要： An epoxy resin composition is provided comprising (A) an epoxy resin, (B) an aromatic amine-based curing agent in such amounts that an equivalent ratio of amino groups in component (B) to epoxy groups in component (A) ranges from 0.7/1 to 1.5/1, and (C) a curing accelerant in the form of arylborate salt. The composition has low-temperature curability and workability and is also improved in adhesion and adhesion retention.
-
公开(公告)号：EP3127933B1
公开(公告)日：2018-02-07
申请号：EP16182287.9
申请日：2016-08-02
CPC分类号： C08L63/04 , C08G59/42 , C08G59/4207 , C08G59/5033 , C08G59/621 , C08K5/09 , C08K5/18 , C08K5/29 , C08K5/3445 , C08L61/06 , C08L63/00
摘要： The invention provides a curable epoxy resin composition having a superior workability and capable of forming a cured product with a thermal expansion resistance, a heat resistance, an adhesiveness and a low water absorbability. The composition is a heat-curable resin composition comprising: (A) an epoxy resin; (B) a carboxyl group-free curing agent; and (C) an annular carbodiimide compound, in which an equivalent ratio of the carboxyl group-free curing agent (B) to the epoxy resin (A) is 0.5 to 1.5, and the annular carbodiimide compound (C) is in an amount of 2 to 50 parts by mass with respect to a total of 100 parts by mass of the epoxy resin (A) and the carboxyl group-free curing agent (B).
-
4.发明公开LIQUID UNDERFILL MATERIAL COMPOSITION FOR SEALING SEMICONDUCTOR AND FLIP-CHIP SEMICONDUCTOR DEVICE 审中-公开现金馅料成分，用于密封半导体和倒装芯片半导体元件的
公开(公告)号：EP3037492A1
公开(公告)日：2016-06-29
申请号：EP15201773.7
申请日：2015-12-21
IPC分类号： C09D179/04 , C08G73/06 , C08L61/12 , C08G8/22 , C08G59/40
CPC分类号： C09J175/04 , C08G8/22 , C08G59/4014 , C08G73/0644 , C08K3/36 , C08K3/40 , C08K9/06 , C08K2201/005 , C08K2201/011 , C08L61/12 , C08L63/00 , C08L2203/206 , C09J11/04 , C09J11/06 , C09J161/12 , C09J179/00 , H01L23/22 , H01L2924/0002 , H01L2924/00
摘要： Provided is a liquid underfill material composition which has a favorable curing property without adding a curing catalyst; a favorable thin film penetration ability derived from its low viscosity; a favorable adhesiveness; and a high heat resistance property. The liquid underfill material composition for sealing a semiconductor contains specific amounts of:
(A) a cyanate ester resin having at least two cyanate groups in one molecule;
(B) a phenolic curing agent including a resorcinol type phenol resin; and
(C) an inorganic filler including (C-1) an inorganic filler (A) which is a silica having an average particle size of 0.1 to 3 µm; and (C-2) an inorganic filler (B) which comprises an amorphous nanosilica having an average particle size of 5 to 70 nm.摘要翻译： 本发明提供一种具有在不添加固化催化剂有利的固化性的液体底部填充材料组合物; 从它的低粘度得到的有利的薄膜渗透能力; 有利的粘合性; 和高耐热性。 用于密封半导体的液体底部填充材料组合物含有特定量的：（A）一个分子中具有至少两个氰酸酯基团的氰酸酯树脂; （B）酚类固化剂包括间苯二酚型酚醛树脂; 和（C）无机填料包括：（C-1）无机填料（A），它是具有上的0.1粒径平均值以3微米的二氧化硅; 无机（B）的和（C-2）填料上具有5至70纳米的平均粒径的无定形纳米二氧化硅的，其包括。
-
公开(公告)号：EP2952539B1
公开(公告)日：2018-01-31
申请号：EP15170468.1
申请日：2015-06-03
CPC分类号： C08L79/00 , C08G8/22 , C08G73/0655 , C08G73/0661 , C08K5/0025 , C08K5/0091 , C08K5/29 , C08K5/3465 , C08K5/55 , C08L61/12 , C08L79/04 , C08L2201/02 , C08L2203/20
摘要： The present invention can provide a heat-curable resin composition which is excellent in insulation property, heat resistance, and preservation stability. The heat-curable resin composition includes (A) cyanate ester compound having at least two cyanate groups in a molecule, (B) phenol curing agent including a resorcinol type phenol resin represented by the formula (1), (In the formula, n represents an integer from 0 to 10, each of R 1 and R 2 independently represents a monovalent group selected from a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an allyl group, and a vinyl group.), and (C) at least one compound selected from a tetraphenylborate of a tetra-substituted phosphonium compound and a tetraphenylborate represented by the formula (2). (In the formula, R 3 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group, and n represents an integer from 1 to 3.)
-
6.发明公开METHOD FOR ENCAPSULATING A BASE MATERIAL WITH A LARGE-AREA SEMICONDUCTOR ELEMENT 审中-公开用大面积半导体元件包封基材的方法
公开(公告)号：EP3242321A1
公开(公告)日：2017-11-08
申请号：EP17166464.2
申请日：2017-04-13
IPC分类号： H01L23/29
CPC分类号： H01L21/56 , B29C70/72 , B29C70/882 , B29K2063/00 , B29K2105/20 , B29K2995/0005 , B29L2009/00 , B29L2031/3481 , C08G59/4238 , C08G59/621 , C08L63/00 , C08L2203/206 , H01L23/29 , H01L23/293 , H01L2924/186
摘要： Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175°C, (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.
摘要翻译： 本发明提供一种封装方法，当用树脂组合物共同封装大面积硅晶片或基板时，不会导致填充失败和流痕等成型失败。 具体而言，提供使用含有环氧树脂（A），固化剂（B），预凝胶化剂（C）和填充剂（C）的固化性环氧树脂组合物来密封安装半导体元件的基材的方法。 d）。 （a）成型方法：压缩成型，（b）成型温度：100〜175℃，（c）成型时间：2〜20分钟，（d）成型压力 ：50至350kN。
-
公开(公告)号：EP3135722A1
公开(公告)日：2017-03-01
申请号：EP16185322.1
申请日：2016-08-23
IPC分类号： C08K5/3415 , C08G73/12 , C08L79/08 , C08L79/04 , C08L63/00
CPC分类号： C08K5/3415 , C08G59/42 , C08G59/4238 , C08G59/5033 , C08G59/621 , C08G73/12 , C08G73/124 , C08G73/128 , C08K5/09 , C08K5/18 , C08L63/00 , C08L63/04 , C08L79/085 , C08L79/08 , C08L61/14
摘要： Provided is a heat-curable resin composition for use in electric and electronics industry which is suitable as an underfill and for performing potting, and is superior in fluidity, moisture resistance reliability and adhesiveness at a high temperature. The heat-curable resin composition of the invention contains
(A) a heat-curable resin; and
(B) a bismaleimide compound in liquid form at 25°C, and exhibits a viscosity of 1 mPa·s to 850 Pa·s when measured at 25°C in accordance with a method described in JIS Z8803:2011.摘要翻译： 本发明提供一种适用于电气电子工业的热固性树脂组合物，其适用于底部填充剂和灌封，并且在高温下具有优异的流动性，耐湿性可靠性和粘合性。 本发明的热固性树脂组合物含有（A）热固性树脂; 和（B）在25℃下为液态的双马来酰亚胺化合物，根据JIS Z8803：2011中记载的方法，在25℃下测定时，粘度为1mPa·s〜850Pa·s。
-
公开(公告)号：EP3127933A1
公开(公告)日：2017-02-08
申请号：EP16182287.9
申请日：2016-08-02
CPC分类号： C08L63/04 , C08G59/42 , C08G59/4207 , C08G59/5033 , C08G59/621 , C08K5/09 , C08K5/18 , C08K5/29 , C08K5/3445 , C08L61/06 , C08L63/00
摘要： The invention provides a curable epoxy resin composition having a superior workability and capable of forming a cured product with a thermal expansion resistance, a heat resistance, an adhesiveness and a low water absorbability. The composition is a heat-curable resin composition comprising:
(A) an epoxy resin;
(B) a carboxyl group-free curing agent; and
(C) an annular carbodiimide compound, in which
an equivalent ratio of the carboxyl group-free curing agent (B) to the epoxy resin (A) is 0.5 to 1.5, and the annular carbodiimide compound (C) is in an amount of 2 to 50 parts by mass with respect to a total of 100 parts by mass of the epoxy resin (A) and the carboxyl group-free curing agent (B).摘要翻译： 本发明提供一种具有优异的加工性能并且能够形成具有耐热膨胀性，耐热性，粘合性和低吸水性的固化产物的可固化环氧树脂组合物。 该组合物是一种热固性树脂组合物，其包含：（A）环氧树脂; （B）无羧基固化剂; 和（C）环状碳二亚胺化合物，其中无羧基固化剂（B）与环氧树脂（A）的当量比为0.5〜1.5，环状碳二亚胺化合物（C）的量为 相对于100质量份的环氧树脂（A）和无羧基固化剂（B），为2〜50质量份。
-
公开(公告)号：EP3290460B1
公开(公告)日：2020-03-04
申请号：EP17187236.9
申请日：2017-08-22
-
公开(公告)号：EP3257898B1
公开(公告)日：2019-11-27
申请号：EP17175980.6
申请日：2017-06-14
-
-
-
-
-
-
-
-
-
搜索结果
19 条记录 (耗时 0.017 秒)
