摘要:
A latent curing agent that can cure a thermosetting epoxy resin in a relatively short period of time and at a relatively low temperature has a structure in which an aluminum chelating agent is held by a porous resin carrier obtained through interfacial polymerization of a polyfunctional isocyanate compound. The aluminum chelating agent is preferably a complex compound comprising ²-ketoenolate anion ligands coordinated to aluminum. The latent curing agent can be produced by dissolving the aluminum chelating agent and the polyfunctional isocyanate compound in a volatile organic solvent, adding the resulting solution to an aqueous phase containing a dispersing agent, and stirring the resulting mixture to cause interfacial polymerization of the isocyanate compound while the mixture is being heated.
摘要:
Impregnating resin, especially a catalytically hardenable impregnating resin for the conductor of an electrical machine, comprising at least one reactive resin mixed with at least one reactive diluent and a hardening catalyst, especially for cationic, anionic or coordinate polymerization of the impregnating resin, wherein the properties of the impregnating resin on use thereof are improved by virtue of the reactive diluent containing a heterocyclic four-membered ring. The impregnating resin is part of a main insulation (12) of the conductor arrangement (2), which is in turn installed in an electrical coil or generally in an electrical machine.
摘要:
A low temperature curable epoxy resin composition which comprises: an epoxy component that contains an epoxy compound having per molecule at least two epoxy groups and that is liquid at 25°C; an aromatic amine based curing agent that contains an aromatic amine compound having per molecule at least two amino groups directly bonded to the aromatic ring and that is liquid at 25°C; andMg(II) acetylacetonate as a cure accelerator. The composition, which contains a novel cure accelerator using a metal complex, exhibits high stability at room temperature while lowering a cure temperature or shortening a cure time.
摘要:
An aluminum chelating agent-based latent curing agent is provided that can rapidly cure thermosetting epoxy resins at relatively low temperatures. A method for producing the aluminum chelating agent-based latent curing agent is also provided that enables relatively facile control of the curing conditions therefor. The latent curing agent holds an aluminum chelating agent in a porous resin obtained by the interfacial polymerization of a polyfunctional isocyanate compound, and when the latent curing agent is incorporated in a curable epoxy resin composition for differential scanning calorimetric (DSC) measurement, the DSC exothermic peak temperature of the curable epoxy resin composition for DSC measurement that contains the latent curing agent that has been treated by immersion in a nonaqueous polar solvent can be brought to not less than the DSC exothermic peak temperature of the curable epoxy resin composition for DSC measurement that incorporates the latent curing agent that has not been subjected to the immersion treatment.
摘要:
A photostable adhesive composition comprises: a) an aromatic polyepoxide; b) a heat activated curative for polyepoxide; c) a thermoplastic polymer; d) a polyfunction (meth)acrylate; and e) optionally, a bireactive compound that contains at least one (meth)acrylate group and at least one group that is reactive with aromatic polyepoxide. The adhesive compositions can be used to prepare adhesive bonding films in a process that uses electron beam irradiation.
摘要:
A tin catalyst constituting an organotin compound modified with an amine is used to catalyze the hydrolysis of latent amine curing agents in amine-curable polymeric compositions. The tin catalyst is formed from the reaction product of a stannous alkanoate and an amine, optionally in the form of an adduct with water. A preferred catalyst is the reaction product of stannous octoate and ethylenediamine.
摘要:
A resin composition is provided that is suitable for impregnating sheet material, including fabrics, films, paper and tapes of the type employed to form prepregs, such as tapes used to form electrical insulation layers on electrical components. The resin composition includes a solid or semi-solid epoxy resin having an epoxide functionality of at least 2.5, a metal acetylacetonate for catalyzing the epoxy resin, and an accelerator of bisphenol A-formaldehyde novolac catalyzed by an acidic catalyst and having a hydroxyl equivalent weight of 120. The resin composition is essentially unreactive at room temperature and at elevated temperatures sufficient to enable permeation of the sheet material by the resin in its manufacture, is essentially unreactive at temperatures required to remove moisture and volatiles during processing of articles wrapped or taped with the sheet material, and cures at a higher temperature without adversely affecting the cure characteristics of the resin composition. The resin composition of this invention achieves the desirable reactivity characteristics noted above, while exhibiting enhanced mechanical, thermal and electrical properties necessary for its use within an electrical insulation composite.
摘要:
Procédé de polymérisation à l'aide d'une base de Lewis qui accélère la réaction. Un composé époxyde, par exemple un éther diglycidyle de bisphénol-A est mélangé avec un composé métallique complexe des formules générales MLxBy ou M [SR]xBz et de l'énergie thermique est fournie. M est un ion métallique, L un ligand, SR un résidu acide d'un acide inorganique, B une base de Lewis, x un entier analogue à la valence de l'ion métallique, y un entier naturel et z un entier naturel supérieur à 6.
(a) mindestens einen Bisphenoldiglycidylether auf Basis von Bisphenol A, hydriertem Bisphenol A oder Bisphenol F, (b) als Härtungskatalysator eine farblose oder schwachgelbe Lösung einer Metallkomplexverbindung der Formel I [ Me (H₂O) x (Lm) y ]²⁺ (A ⊖ ) ₂ (I), worin Me ein zweiwertiges Metall aus der Gruppe Zn, Cd, Sn, Pb, Ca oder Mg, Lm einen gesättigten cyclischen Ether mit 5 bis 7 Ringatomen, eine lineare oder cyclische gesättigte aliphatische Etherverbindung oder ein Gemisch aus dem Ether und der Etherverbindung, wobei der Ether und die Etherverbindung einen Siedepunkt von mindestens 60°C aufweisen, und A ein Anion der Formel BF₄ ⊖ , PF₆ ⊖ , AsF₆ ⊖ oder SbF₆ ⊖ bedeuten, x für die Zahl 4, 5 oder 6 und y für Null oder die Zahl 1 oder 2 stehen, wobei die Summe aus x und y jeweils 6 ist, gelöst im Ueberschuss des entsprechenden Ethers oder der entsprechenden Etherverbindung, (c) ein sterisch gehindertes ein- oder mehrkerniges Phenol, ein Phosphit der Formel II oder III
worin R₁, R₂ und R₃ unabhängig voneinander je für ein Phenyl, alkylsubstituiertes Phenyl mit 1-12 C-Atomen im Alkylrest oder ein Alkyl mit 1 bis 20 C-Atomen stehen, oder ein Gemisch aus einem sterisch gehinderten ein- oder mehrkernigen Phenol und einem Phosphit der Formel II oder III und gegebenenfalls (d) als reaktiven Verdünner bis zu 25 Gew.-Teile, bezogen auf 100 Gew.-Teile (a), mindestens einen Diglycidylether von Butandiol-1,4, Hexandiol-1,6 oder Neopentylglykol oder ein Kresolglycidylether und gegebenenfalls (e) als Haftvermittler ein organisches Silan, Titanat oder Zirkonat, lassen sich schnell aushärten und ergeben transparente, vergilbungsstabile Formstoffe. Sie eignen sich insbesondere zum Umhüllen oder Einbetten von optoelektronischen Bauelementen.