公开(公告)号：EP3167100A4

公开(公告)日：2018-03-14

申请号：EP14897234

申请日：2014-07-11

申请人： SAVROC LTD

发明人： MIETTINEN JUHA ,  RAEISAE JUSSI

IPC分类号： C25D3/06 ,  C23C18/16 ,  C23C18/18 ,  C23C28/02 ,  C25D5/12 ,  C25D5/50

CPC分类号： C25D5/14 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/1834 ,  C23C18/36 ,  C23C28/021 ,  C23C28/322 ,  C23C28/34 ,  C25D3/06 ,  C25D5/12 ,  C25D5/48 ,  C25D5/50

摘要： The invention relates to a chromium-based coating comprising at least one layer rich in crystalline phase or phases of nickel (Ni) and/or Ni compounds, and at least one layer rich in crystal-line phase or phases of chromium (Cr) and/or Cr compounds, Cr being electroplated from a trivalent chromium bath. The coating is characterized in that the it further comprises one or more crystalline phases of chromium-nickel-phosphorus (CrNiP), which CrNiP phase has been produced by heat treating a coating comprising at least one layer of nickel-phosphorus (NiP) and at least one layer of Cr. The invention also relates to a method for producing a chromiumbased coating and to a coated object.

公开(公告)号：EP3181730A1

公开(公告)日：2017-06-21

申请号：EP16204194.1

申请日：2016-12-14

申请人： Rohm and Haas Electronic Materials LLC

发明人： TANG, Qin ,  TONG, Kitho ,  CHAN, Chit Yiu ,  YEE, Kwok Wai Dennis

IPC分类号： C23F11/08 ,  C23F11/14 ,  C23C22/58 ,  H05K3/28

CPC分类号： H05K3/282 ,  C09D5/08 ,  C23C18/1637 ,  C23C18/168 ,  C23C18/1834 ,  C23C22/58 ,  C23F11/08 ,  C23F11/149 ,  H05K2203/0591 ,  H05K2203/0703

摘要： A method for forming an organic coating on a surface of nickel or nickel alloy is disclosed. The method includes contacting the nickel surface with a composition comprising a specific pyrazine derived compound to prevent corrosion of nickel without forming known gold immersion film on the surface of the nickel.

摘要翻译： 公开了一种在镍或镍合金表面上形成有机涂层的方法。 该方法包括使镍表面与包含特定吡嗪衍生化合物的组合物接触以防止镍的腐蚀，而不在镍的表面上形成已知的金浸渍膜。

公开(公告)号：EP3048186A4

公开(公告)日：2017-05-31

申请号：EP14846487

申请日：2014-09-11

申请人： TOYO KOHAN CO LTD

发明人： MUKAI NOBUAKI ,  YOSHIDA TAKAHIRO

IPC分类号： C23C28/00 ,  B32B15/01 ,  C23C18/18 ,  C23C18/31 ,  C23C18/38 ,  C23C18/42 ,  C23C18/48 ,  C23C22/50

CPC分类号： C23C18/1827 ,  B32B15/013 ,  B32B15/018 ,  C23C18/1834 ,  C23C18/31 ,  C23C18/38 ,  C23C18/42 ,  C23C18/48 ,  C23C22/50 ,  C23C28/322 ,  C23C28/34 ,  C25D3/46

摘要： There is provided a metal plate coated stainless material (100) which includes a stainless steel sheet (10) having formed thereon a passivation film (11) having a Cr/O value in the range of 0.05 to 0.2 and a Cr/Fe value in the range of 0.5 to 0.8 at the surface as measured by an Auger electron spectroscopy analysis and a metal plated layer (20) formed on the passivation film (11) of the stainless steel sheet (10), in which the metal plated layer (20) is a plated layer formed from any one metal selected from among Ag, Pd, Pt, Rh, Ru, Cu, Sn and Cr, or an alloy of these metals.

摘要翻译： 本发明提供一种金属板包覆不锈钢材料（100），其包括一个不锈钢薄片（10），其上具有在0:05的范围内，以0.2的铬/ O值和在铬/铁值的钝化膜 - （11）而形成 的0.5至0.8在表面如在俄歇电子能谱分析和金属镀敷层（20）测量由形成在不锈钢板（10）的钝化膜 - （11）的范围内，（其中金属镀层20 ）是从银，钯，铂，铑，钌，铜，锡和Cr，或合成的金属的合金中的任何一种金属形成的镀层。

公开(公告)号：EP2559485B1

公开(公告)日：2017-03-29

申请号：EP12180773.9

申请日：2012-08-17

申请人： Rohm and Haas Electronic Materials, LLC

发明人： Liu, Feng ,  Rzeznik, Maria Anna

IPC分类号： B01J37/16 ,  B01J37/02 ,  B01J31/28 ,  B01J31/06 ,  B01J23/44 ,  B01J35/00 ,  C23C18/30 ,  C23C18/18 ,  C23C18/20 ,  C23C18/38

CPC分类号： C23C18/1834 ,  B01J23/44 ,  B01J31/061 ,  B01J31/28 ,  B01J35/0013 ,  B01J35/006 ,  B01J37/0201 ,  B01J37/0209 ,  B01J37/0213 ,  B01J37/16 ,  B01J2531/0272 ,  B01J2531/824 ,  C23C18/1831 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/32 ,  C23C18/34 ,  C23C18/38 ,  C23C18/40 ,  C23C18/50 ,  H05K3/422

公开(公告)号：EP2921038A1

公开(公告)日：2015-09-23

申请号：EP13805977.9

申请日：2013-11-13

申请人： Eastman Kodak Company

发明人： SCHUSTER, Israel

IPC分类号： H05K3/18 ,  C23C18/20 ,  C23C18/18

CPC分类号： H05K3/10 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/182 ,  C23C18/1831 ,  C23C18/1834 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/204 ,  C23C18/2066 ,  C23C18/30 ,  H05K3/182 ,  H05K3/185 ,  H05K2203/087

摘要： A method for forming a conductive pattern on a substrate (208) includes providing an image pattern for imaging on the substrate; imaging the image pattern on the substrate creating imaged areas; spraying functional material (232) on the substrate that diffuse molecules of the functional material into the imaged areas; and applying electro-less copper coating that build conductive material traces on the imaged areas on the substrate.

公开(公告)号：EP2078062A1

公开(公告)日：2009-07-15

申请号：EP07844447.8

申请日：2007-10-19

申请人： Northwestern University

发明人： MESSERSMITH, Phillip B. ,  LEE, Haeshin

IPC分类号： C09D133/24 ,  C09D201/00

CPC分类号： C09D5/1662 ,  A61L2420/00 ,  A61L2420/08 ,  B05D1/185 ,  B05D5/00 ,  B05D7/5483 ,  C02F1/281 ,  C02F1/285 ,  C02F1/288 ,  C02F2101/20 ,  C08J7/123 ,  C09D5/1681 ,  C09D179/04 ,  C23C18/1608 ,  C23C18/1803 ,  C23C18/1834 ,  C23C18/1844 ,  C23C18/2006 ,  C23C18/2066 ,  C23C18/31 ,  C23C18/40 ,  C23C18/42

摘要： The present invention provides a surface-independent surface-modifying multifunctional biocoating and methods of application thereof. The method comprises contacting at least a portion of a substrate with an alkaline solution comprising a surface-modifying agent (SMA) such as dopamine so as to modify the substrate surface to include at least one reactive moiety. In another version of the invention, a secondary reactive moiety is applied to the SMA-treated substrate to yield a surface-modified substrate having a specific functionality.

摘要翻译： 本发明提供了一种与表面无关的表面改性多功能生物涂层及其应用方法。 该方法包括使至少一部分底物与包含表面改性剂（SMA）如多巴胺的碱性溶液接触，以便改变底物表面以包括至少一个反应性部分。 在本发明的另一个方案中，将次级反应性部分施加到经SMA处理的基底上以产生具有特定官能度的表面改性的底物。

公开(公告)号：EP1825021A2

公开(公告)日：2007-08-29

申请号：EP05810475.3

申请日：2005-10-11

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： FREY, Matthew H., ,  NGUYEN, Khanh P.,

IPC分类号： C23C18/16

CPC分类号： H05K3/108 ,  B82Y30/00 ,  C23C18/1603 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/1806 ,  C23C18/1834 ,  C23C18/1889 ,  C23C18/208 ,  C23C18/31 ,  C23C18/405 ,  H01L21/288 ,  H05K3/184 ,  H05K2201/0382 ,  H05K2203/0195 ,  H05K2203/072 ,  H05K2203/124 ,  Y10T428/12 ,  Y10T428/12514 ,  Y10T428/261 ,  Y10T428/31544

摘要： A method of selectively and electrolessly depositing a metal onto a substrate having a metallic microstructured surface is disclosed. The method includes forming a self-assembled monolayer on the metallic microstructured surface, exposing the self-assembled monolayer to an electroless plating solution including a soluble form of a deposit metal, and depositing electrolessly the deposit metal selectively on the metallic microstructured surface. Articles formed from this method are also disclosed.

公开(公告)号：EP0747507A4

公开(公告)日：1997-01-02

申请号：EP95932961

申请日：1995-10-03

IPC分类号： C23C18/18 ,  C23C18/28 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  C23C18/52

CPC分类号： H05K3/244 ,  C23C18/1651 ,  C23C18/166 ,  C23C18/1834 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K3/184 ,  H05K2201/0344 ,  H05K2203/0392 ,  H05K2203/072

摘要： A plating method for applying a secondary plating (electroless plating) onto a primary plated film (or a metal film) formed on a substrate for reliably executing the plating reaction at a higher deposition rate without requiring Pd-substitution treatment. The surface potential of the primary plated film is adjusted to be baser than the basest surface potential at which the surface current density of the primary plated film becomes 0 in the electroless plating solution for the secondary plating and, then, the secondary plating is effected. The invention further covers a pH-adjusting agent that is suited for carrying out the electroless plating method, a pretreatment solution for electroless plating that contains a reducing agent and a complexing agent, and an electroless plating bath.

摘要翻译： 一种镀覆方法，用于在形成于基板上的一次镀膜（或金属膜）上施加二次镀覆（无电镀），以用于以较高的沉积速率可靠地执行镀覆反应而不需要Pd置换处理。 一次镀膜的表面电位被调整为比二次镀敷用无电解镀液中的一次镀膜的表面电流密度变为0的最基表面电位低，然后进行二次镀敷。 本发明还包括适合于进行化学镀方法的pH调节剂，包含还原剂和络合剂的化学镀的预处理溶液以及无电镀浴。

公开(公告)号：EP2078062B1

公开(公告)日：2018-12-05

申请号：EP07844447.8

申请日：2007-10-19

申请人： Northwestern University

发明人： MESSERSMITH, Phillip B. ,  LEE, Haeshin

IPC分类号： C09D133/24 ,  C09D201/00

CPC分类号： C09D5/1662 ,  A61L2420/00 ,  A61L2420/08 ,  B05D1/185 ,  B05D5/00 ,  B05D7/5483 ,  C02F1/281 ,  C02F1/285 ,  C02F1/288 ,  C02F2101/20 ,  C08J7/123 ,  C09D5/1681 ,  C09D179/04 ,  C23C18/1608 ,  C23C18/1803 ,  C23C18/1834 ,  C23C18/1844 ,  C23C18/2006 ,  C23C18/2066 ,  C23C18/31 ,  C23C18/40 ,  C23C18/42

摘要： The present invention provides a surface-independent surface-modifying multifunctional biocoating and methods of application thereof. The method comprises contacting at least a portion of a substrate with an alkaline solution comprising a surface-modifying agent (SMA) such as dopamine so as to modify the substrate surface to include at least one reactive moiety. In another version of the invention, a secondary reactive moiety is applied to the SMA-treated substrate to yield a surface-modified substrate having a specific functionality.

公开(公告)号：EP3359306A2

公开(公告)日：2018-08-15

申请号：EP16794688.8

申请日：2016-10-07

申请人： Aveni ,  Commissariat à l'Energie Atomique et aux Energies Alternatives

发明人： VIEL, Pascal ,  SUHR, Dominique ,  BARRAL, Geoffrey

IPC分类号： B05D1/18 ,  C23C18/18

CPC分类号： B05D1/18 ,  C23C18/1653 ,  C23C18/1834 ,  C23C18/1893 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/34 ,  C25D5/18 ,  C25D7/123

摘要： One subject of the present invention is a non-electrochemical process for radical grafting of a polymer to a solid, organic or inorganic and insulating, electrically conductive or electrically semiconductive substrate, which process comprises - bringing said substrate into contact with the polymer in solution via an immersion-emersion, a contact coating, or a spray coating, and - heat treating the polymer-covered substrate obtained in the preceding step at a temperature between 70°C and 450°C; said polymer not being a polymer based on acrylic acid. The invention also relates to a process for metallizing the solid, organic or inorganic substrate coated by the polymer film, which metallizing may be carried out via a dry or wet route. This process particularly finds an application in the metallization of through vias for the manufacture of semiconductor devices.