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公开(公告)号：EP3420196A1
公开(公告)日：2019-01-02
申请号：EP17714666.9
申请日：2017-03-22
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公开(公告)号：EP1670613B1
公开(公告)日：2008-04-23
申请号：EP04765255.7
申请日：2004-09-15
CPC分类号： B23P6/007 , C23C4/02 , C23C26/00 , C23C28/021 , C23C28/022 , C23C28/023 , C23C28/028 , C23C28/321 , C23C28/3215 , C23C28/322 , C23C28/3455 , C23C28/36 , F01D5/005 , F05D2230/80 , F05D2230/90 , Y10T428/12389 , Y10T428/12576 , Y10T428/12847 , Y10T428/12931 , Y10T428/24273
摘要： Conventionally, cavities and cracks are filled with a solder metal which forms brittle phases with a subsequently applied coating, which have a negative effect on the mechanical properties. According to the invention, the components which form brittle phases are removed from the solder metal (13). The above is achieved, whereby a second material (22) is applied which reacts with said component and which is removed again with the brittle phases (16), before the coating (7).
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公开(公告)号：EP3658316A1
公开(公告)日：2020-06-03
申请号：EP18793564.8
申请日：2018-10-09
发明人： ANTON, Reiner , GALANDER, Uwe , KRABIELL, Kay
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公开(公告)号：EP3420196B1
公开(公告)日：2019-11-20
申请号：EP17714666.9
申请日：2017-03-22
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5.发明公开FORMKÖRPER ZUM LÖTEN, ANORDNUNG VON FORMKÖRPERN, EIN VERFAHREN SOWIE EIN BAUTEIL 审中-公开体形用于焊接，设备形体，方法与配件
公开(公告)号：EP2358497A1
公开(公告)日：2011-08-24
申请号：EP09756484.3
申请日：2009-11-19
CPC分类号： B23K1/0018 , B23K3/08 , B23K26/03 , B23K26/211 , B23K26/702 , B23K37/06 , B23K2201/001 , B32B3/26 , B32B3/30 , B32B15/00 , B32B15/01 , F01D5/005 , F05D2230/22 , F05D2230/237 , F05D2250/131 , F05D2250/70 , F05D2260/36 , Y02T50/67 , Y10T428/12229 , Y10T428/12361 , Y10T428/12375 , Y10T428/12382 , Y10T428/12479 , Y10T428/12486 , Y10T428/12493 , Y10T428/12931 , Y10T428/12944 , Y10T428/249953 , Y10T428/249981
摘要： The use of pre-sintered soldering plates, referred to as PSPs, frequently proceeds without a continuous, cohesive soldering connection between individual grains in the sinter material and between the sinter and base material. For this reason, the invention relates to the soldering of prefabricated, perforated, porous or drilled plates (sinter, cast or rolled material) or porous, spongy, laminar material that can be laid full-surfaced on a base element as a plurality of tiles or as individual porous, drilled or perforated inlay elements designed contour-close on a recess in the base material. To this end, the selected plate materials can be mechanically equal to the base material or otherwise set off for the particular requirements of the component insert. The solder can be offset by specific diffusible, melting-point-lowering components. The invention further relates to a mould (4) that has an open, continuous porosity (perforation) (5) so that melted or fluid solder can flow through from the one surface (19) to the other surface (22).
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公开(公告)号：EP1670613A1
公开(公告)日：2006-06-21
申请号：EP04765255.7
申请日：2004-09-15
CPC分类号： B23P6/007 , C23C4/02 , C23C26/00 , C23C28/021 , C23C28/022 , C23C28/023 , C23C28/028 , C23C28/321 , C23C28/3215 , C23C28/322 , C23C28/3455 , C23C28/36 , F01D5/005 , F05D2230/80 , F05D2230/90 , Y10T428/12389 , Y10T428/12576 , Y10T428/12847 , Y10T428/12931 , Y10T428/24273
摘要： Conventionally, cavities and cracks are filled with a solder metal which forms brittle phases with a subsequently applied coating, which have a negative effect on the mechanical properties. According to the invention, the components which form brittle phases are removed from the solder metal (13). The above is achieved, whereby a second material (22) is applied which reacts with said component and which is removed again with the brittle phases (16), before the coating (7).
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公开(公告)号：EP1573090A2
公开(公告)日：2005-09-14
申请号：EP03813080.3
申请日：2003-12-16
IPC分类号： C25D1/00
摘要： In previously known electrodeposition methods, alloys can be deposited only badly on a substrate from the components thereof. The inventive method allows an alloy layer to be deposited on a substrate (13) by pulsing the current/voltage used for electrode position.
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