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公开(公告)号：EP2205383B1
公开(公告)日：2018-12-26
申请号：EP08836501.0
申请日：2008-09-29
申请人： Mircona Ab
发明人： MIHIC, Ragnhild , MIHIC, Peter
IPC分类号： B23B31/00 , B23B29/04 , C23C28/02 , C23C28/00 , B23B27/00 , C23C14/00 , C23C14/06 , C23C16/34
CPC分类号： C23C14/0658 , B23B27/002 , B23B27/007 , B23B29/043 , B23B31/005 , B23B2226/18 , B23B2228/10 , C23C14/0057 , C23C16/347 , C23C28/023 , C23C28/322 , C23C28/34 , C23C28/345 , C23C28/347 , C23C28/42 , Y10S428/9088 , Y10T407/1906 , Y10T407/22 , Y10T408/76 , Y10T409/304312 , Y10T428/12535 , Y10T428/12576 , Y10T428/249921 , Y10T428/26 , Y10T428/2982 , Y10T428/31678
摘要： The present invention provides an appliance for chip removal applications comprising a vibration-damping material wherein the vibration-damping material is a material arranged by nano-dimensional cluster form. The present invention additionally provides a method for manufacturing said appliance. The present invention provides also an appliance obtainable by said method. Additionally the present invention provides an article or work piece for use in an appliance for chip removal applications. Also a computer program is provided for controlling the above method.
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公开(公告)号：EP3050997B1
公开(公告)日：2018-07-18
申请号：EP13894771.8
申请日：2013-09-25
发明人： NISHIDA, Hidetaka
CPC分类号： C23C4/12 , C21D9/08 , C21D9/50 , C21D2251/00 , C23C4/06 , C23C4/10 , C23C4/11 , C23C4/16 , C23C4/18 , Y10T428/12576 , Y10T428/12583 , Y10T428/1259 , Y10T428/12931
摘要： A creep reinforcement material containing one or a plurality of elements selected from B, W, Cr, Mo, Nb, V, Hf, Zr, Ti, Cu, and Co is coated or thermally sprayed onto a surface of a heat-resistant metal member manufactured using a heat-resistant metal material, and a section coated or thermally sprayed with the creep reinforcement material is covered by a heat-resistant covering member and secured so as to contact the section. The heat-resistant metal member covered by the heat-resistant covering member is heated to a temperature of 1000°C or greater, and thus compressive force accordingly acts on the heat-resistant metal member as it thermally expands in a direction toward the outer periphery, restraining thermal expansion of the heat-resistant metal member in the direction toward the outer periphery, and enabling the creep reinforcement material on the surface of the heat-resistant metal member to be efficiently diffused and permeated into the heat-resistant metal member.
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公开(公告)号：EP2486164B1
公开(公告)日：2017-12-06
申请号：EP10774113.4
申请日：2010-09-02
CPC分类号： C23C16/36 , C23C16/403 , C23C30/005 , Y10T407/27 , Y10T428/12576
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公开(公告)号：EP1915227B2
公开(公告)日：2016-08-24
申请号：EP06801708.6
申请日：2006-08-17
申请人： Kennametal Inc.
CPC分类号： B22F7/062 , B22F2998/00 , C22C29/00 , C22C29/08 , Y10T407/27 , Y10T428/12576 , Y10T428/12611 , Y10T428/12771 , Y10T428/12806 , Y10T428/12812 , Y10T428/24942 , Y10T428/24983 , Y10T428/252 , Y10T428/30 , Y10T428/31678 , B22F2207/01 , B22F2207/11 , B22F2207/13
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公开(公告)号：EP1726383B1
公开(公告)日：2016-05-25
申请号：EP06011969.0
申请日：1998-12-08
发明人： Sasai, Katsuhiro , Takeuchi, Eiichi , Harada, Hiroshi , Hasegawa, Hajime , Toh, Takehiko , Fujisaki, Keisuke
IPC分类号： B22D11/10 , B22D11/115 , B22D11/20 , B22D11/041
CPC分类号： B22D11/041 , B22D11/115 , B22D11/20 , Y10T428/12 , Y10T428/12458 , Y10T428/12472 , Y10T428/12576 , Y10T428/12958 , Y10T428/12965
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公开(公告)号：EP2734484A1
公开(公告)日：2014-05-28
申请号：EP12740830.0
申请日：2012-07-19
发明人： EASLEY, Thomas , LIN, Yuanbo , DYER, Dwight
IPC分类号： C04B37/00 , C04B37/02 , E21B10/573
CPC分类号： C04B37/006 , C04B37/026 , C04B2235/6567 , C04B2235/96 , C04B2237/02 , C04B2237/083 , C04B2237/12 , C04B2237/121 , C04B2237/122 , C04B2237/123 , C04B2237/124 , C04B2237/125 , C04B2237/16 , C04B2237/361 , C04B2237/363 , C04B2237/401 , C04B2237/592 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C04B2237/72 , Y10T428/12542 , Y10T428/12576 , Y10T428/12625
摘要： The present disclosure relates to brazed coated diamond-containing materials and methods of producing brazed coated diamond-containing materials. The method for brazing the coated diamond-containing material may include bringing a braze metal into contact with the refractory metal layer and a substrate; heating at least the braze metal above the melting temperature of the braze metal; and bringing the braze metal into contact with the substrate to form a braze metal layer to join the diamond-containing material, braze metal layer, and substrate together. An advantage of the method may include that the brazing step may be performed in air, under ambient pressure, and without the need for a protective layer.
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公开(公告)号：EP2101090B1
公开(公告)日：2014-04-23
申请号：EP09002680.8
申请日：2009-02-25
发明人： Ogawa, Junpei , Kondou, Takaaki , Miyazawa, Tomonori , Iguchi, Toyoki , Suzuki, Takuma , Makita, Takeshi , Ogawa, Katsuaki , Okazaki, Takahiro
CPC分类号： F16J9/26 , C22C38/02 , C22C38/04 , C22C38/18 , C22C38/22 , C22C38/24 , C22C38/26 , C22C38/28 , C22C38/54 , Y10T428/12576 , Y10T428/12583 , Y10T428/1259 , Y10T428/12625 , Y10T428/12854 , Y10T428/12972 , Y10T428/12993 , Y10T428/31678
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公开(公告)号：EP1974073B1
公开(公告)日：2013-08-21
申请号：EP07717815.0
申请日：2007-01-10
CPC分类号： C23C14/226 , C23C28/322 , C23C28/34 , C23C28/3455 , C23C28/347 , C23C28/36 , C23C28/42 , F01D5/288 , F05D2230/313 , F05D2300/614 , Y10T428/12542 , Y10T428/12549 , Y10T428/12576 , Y10T428/12611 , Y10T428/12618 , Y10T428/12632 , Y10T428/12875 , Y10T428/24058 , Y10T428/24174 , Y10T428/24355 , Y10T428/24413
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公开(公告)号：EP2405723B1
公开(公告)日：2013-06-05
申请号：EP11007897.9
申请日：2005-12-05
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/32225 , H01L2224/48091 , H01L2224/48235 , H01L2224/73265 , H01L2224/92247 , H01L2924/1301 , H05K1/0274 , H05K1/0306 , H05K1/092 , H05K1/183 , H05K3/246 , H05K3/403 , H05K2201/0347 , H05K2201/09781 , H05K2201/10106 , H05K2201/2054 , Y10T428/12361 , Y10T428/12528 , Y10T428/12576 , Y10T428/12611 , Y10T428/12639 , Y10T428/12806 , Y10T428/12819 , Y10T428/12826 , Y10T428/1284 , Y10T428/12861 , Y10T428/12868 , Y10T428/12875 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/12944 , Y10T428/131 , Y10T428/1317 , Y10T428/26 , Y10T428/265 , H01L2924/00014 , H01L2924/00
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公开(公告)号：EP2551560A1
公开(公告)日：2013-01-30
申请号：EP12006986.9
申请日：2009-02-25
发明人： Ogawa, Junpei , Kondou, Takaaki , Miyazawa, Tomonori , Iguchi, Toyoki , Suzuki, Takuma , Makita, Takeshi , Ogawa, Katsuaki , Okazaki, Takahiro
CPC分类号： F16J9/26 , C22C38/02 , C22C38/04 , C22C38/18 , C22C38/22 , C22C38/24 , C22C38/26 , C22C38/28 , C22C38/54 , Y10T428/12576 , Y10T428/12583 , Y10T428/1259 , Y10T428/12625 , Y10T428/12854 , Y10T428/12972 , Y10T428/12993 , Y10T428/31678
摘要： A piston ring (R) includes: a refined steel including: carbon C in a range of 0.20 % mass to 0.90 % mass, silicon Si in a range of 0.10 % mass to less than 0.60 % mass, manganese Mn in a range of 0.20 % mass to 1.50 % mass, chromium Cr in a range of 0.30 % mass to 2.00 % mass, and iron Fe as balance and unavoidable impurity. A parameter A calculated from the following expression (1) based on contents of the Si, Mn and Cr is 9.0 or less: parameter A = 8.8 Si + 1.6 Mn + 1.7 Cr --- expression (1). A parameter B calculated from the following expression (2) based on contents of the C, Si, Mn and Cr is 10.8 or more: parameter B = 36 C + 4.2 Si + 3.8 Mn + 4.5 Cr --- expression (2), wherein the piston ring (R) has a hardness of 26 HRC or more after a refining including a quench hardening and a tempering, and the piston ring (R) has a thermal conductivity of 36 W/m·K or more after the refining including the quench hardening and the tempering.
摘要翻译： 活塞环（R）包括精炼钢，该精炼钢包括：0.20质量％至0.90质量％范围内的碳C，0.10质量％至小于0.60质量％范围内的硅Si，0.20范围内的锰Mn 质量％至1.50％质量，0.30％质量至2.00％质量范围内的铬Cr以及余量的铁Fe和不可避免的杂质。 根据Si，Mn和Cr的含量由以下表达式（1）计算的参数A为9.0或更小：参数A = 8.8Si + 1.6Mn + 1.7Cr ......表达式（1）。 根据C，Si，Mn和Cr的含量由以下表达式（2）计算的参数B为10.8或更大：参数B = 36C + 4.2Si + 3.8Mn + 4.5Cr ......表达式（2）， 其特征在于，所述活塞环（R）在包含淬火和回火的精炼后的硬度为26HRC以上，所述精炼后的所述活塞环（R）的导热率为36W / m·K以上 淬火和回火。
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