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1.发明公开Resin component for encapsulating semiconductor and semiconductor device using it 有权对于含有它们的半导体和半导体器件的封装树脂组合物
公开(公告)号：EP1265280A1
公开(公告)日：2002-12-11
申请号：EP02011955.8
申请日：2002-05-29
发明人： Toyoda, Junichi, c/o Sony Corporation , Okayama, Katsumi, c/o Sony Corporation , Igarashi, Kazumasa, c/o Nitto Denko Corporation
CPC分类号： H01L23/3121 , H01L23/295 , H01L23/552 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A resin component for encapsulating a semiconductor includes magnetic powder and silica powder whose average particle diameter is smaller than the average particle diameter of the magnetic powder. Thus, the curing body of the resin component for encapsulating a semiconductor has an electromagnetic wave shielding function by the magnetic powder. Since the spaces of the magnetic powder are filled with the silica powder whose average particle diameter is small, the moldability of the curing body is improved and the insulating characteristics thereof are enhanced. Such a resin component for encapsulating a semiconductor is employed, there can be produced a preferably formed and encapsulated semiconductor device having the electromagnetic wave shielding function and having no malfunction generated due to leakage current from a semiconductor element.
摘要翻译： 用于封装半导体的树脂组分包括磁性粉末和二氧化硅粉末的平均粒径比所述磁性粉末的平均粒径小。 因此，半导体封装用的树脂成分的固化体具有由磁性粉末电磁波屏蔽功能。 由于磁性粉末的空间被填充有二氧化硅粉末的平均粒径小，固化体的成型性得到改善，其绝缘特性得到提高。 这样的用于封装半导体的，采用的树脂成分，可以制造具有电磁波屏蔽功能和不具有由半导体元件产生的，由于泄漏电流故障一个优选形成并封装的半导体器件。
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2.发明授权Resin component for encapsulating semiconductor and semiconductor device using it 有权对于含有它们的半导体和半导体器件的封装树脂组合物
公开(公告)号：EP1265280B1
公开(公告)日：2008-02-13
申请号：EP02011955.8
申请日：2002-05-29
发明人： Toyoda, Junichi, c/o Sony Corporation , Okayama, Katsumi, c/o Sony Corporation , Igarashi, Kazumasa, c/o Nitto Denko Corporation
CPC分类号： H01L23/3121 , H01L23/295 , H01L23/552 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A resin component for encapsulating a semiconductor includes magnetic powder and silica powder whose average particle diameter is smaller than the average particle diameter of the magnetic powder. Thus, the curing body of the resin component for encapsulating a semiconductor has an electromagnetic wave shielding function by the magnetic powder. Since the spaces of the magnetic powder are filled with the silica powder whose average particle diameter is small, the moldability of the curing body is improved and the insulating characteristics thereof are enhanced. Such a resin component for encapsulating a semiconductor is employed, there can be produced a preferably formed and encapsulated semiconductor device having the electromagnetic wave shielding function and having no malfunction generated due to leakage current from a semiconductor element.
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3.发明授权Resin component for encapsulating semiconductor and semiconductor device using it 有权用于封装半导体的树脂组件和使用它的半导体器件
公开(公告)号：EP1265280B9
公开(公告)日：2008-08-27
申请号：EP02011955.8
申请日：2002-05-29
发明人： Toyoda, Junichi, c/o Sony Corporation , Okayama, Katsumi, c/o Sony Corporation , Igarashi, Kazumasa, c/o Nitto Denko Corporation
CPC分类号： H01L23/3121 , H01L23/295 , H01L23/552 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A resin component for encapsulating a semiconductor includes magnetic powder and silica powder whose average particle diameter is smaller than the average particle diameter of the magnetic powder. Thus, the curing body of the resin component for encapsulating a semiconductor has an electromagnetic wave shielding function by the magnetic powder. Since the spaces of the magnetic powder are filled with the silica powder whose average particle diameter is small, the moldability of the curing body is improved and the insulating characteristics thereof are enhanced. Such a resin component for encapsulating a semiconductor is employed, there can be produced a preferably formed and encapsulated semiconductor device having the electromagnetic wave shielding function and having no malfunction generated due to leakage current from a semiconductor element.
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