公开(公告)号：EP2209136A4

公开(公告)日：2013-08-07

申请号：EP08846626

申请日：2008-10-15

申请人： TANAKA ELECTRONICS IND

发明人： TAKADA MITSUO ,  TESHIMA SATOSHI ,  KUWAHARA TAKESHI

IPC分类号： H01L23/49 ,  C22C5/02

CPC分类号： H01L24/85 ,  C22C5/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01105 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/01039 ,  H01L2924/00014 ,  H01L2924/01202 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00015 ,  H01L2924/01049 ,  H01L2924/01006

摘要： [Issues to be solved] To provide Au alloy wire for ball bonding, which is superior wire strength, and also is superior at formability of molten ball and roundness of compressed ball, moreover is superior at stitch bondability; is available for high density wiring of semiconductor divices. [Solution means] Au alloy wire for ball bonding comprising: 15 - 50 wt ppm Mg, 10 - 30 wt ppm Ca, 5 - 20 wt ppm Eu, 5 - 20 wt ppm Y, 5 - 20 wt ppm La and residual Au is more than 99.998 wt % purity, moreover, purity of more than 99.98 wt % Au, mass of additive Ca is less than the value of total amount of additive Eu and additive La, and mass of additive Y is less than the value of total amount of additive Ca and additive Eu, and mass of 20 - 40 wt ppm Mg.

摘要翻译： [待解决的问题]为了提供优良的丝强度的球形接合用Au合金丝，并且在熔融球的成形性和压缩球的圆度方面也优异，而且在针迹结合性方面优异; 可用于半导体分区的高密度布线。 [解决方案]用于球接合的Au合金线包括：15-50重量ppm的Mg，10-30重量ppm的Ca，5-20重量ppm的Eu，5-20重量ppm的Y，5-20重量ppm的La和残余的Au是 纯度大于99.998重量％，此外，纯度高于99.98重量％的Au，添加剂Ca的质量小于添加剂Eu和添加剂La的总量的值，添加剂Y的质量小于总量 的添加剂Ca和添加剂Eu，质量为20-40重量ppm的Mg。

公开(公告)号：EP2204846A4

公开(公告)日：2014-01-15

申请号：EP08790566

申请日：2008-06-23

申请人： TANAKA ELECTRONICS IND

发明人： TAKADA MITSUO ,  TESHIMA SATOSHI ,  KUWAHARA TAKESHI

IPC分类号： C22C5/02 ,  H01L23/49

CPC分类号： H01L24/85 ,  B23K35/3013 ,  B23K2201/36 ,  C22C5/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20106 ,  H01L2924/20752 ,  Y10T428/12 ,  H01L2924/01012 ,  H01L2924/01063 ,  H01L2924/0105 ,  H01L2924/0102 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/00015 ,  H01L2924/01205 ,  H01L2924/01048 ,  H01L2924/00013 ,  H01L2924/01049 ,  H01L2924/01006

摘要： [PROBLEMS] To provide a gold alloy wire which is excellent in the property of forming a melt ball, suitability for stitch bonding, and wire strength and, despite this, gives a press-bonded ball having excellent circularity, and which is usable in high-density wiring for a semiconductor device. [MEANS FOR SOLVING PROBLEMS] The gold alloy wire for use in ball bonding is made of a gold alloy comprising 10-50 mass ppm magnesium (Mg), 5-20 mass ppm europium (Eu), 2-9 mass ppm calcium (Ca), and gold (Au) having a purity of 99.995 mass% or higher as the remainder, wherein the calcium (Ca) content is up to half the europium (Eu) content by mass.

公开(公告)号：EP2413351A4

公开(公告)日：2012-12-05

申请号：EP09842303

申请日：2009-09-01

申请人： TANAKA ELECTRONICS IND

发明人： YAMASHITA TSUTOMU ,  AKIMOTO HIDEYUKI ,  KUWAHARA TAKESHI ,  OKAZAKI JUNICHI

IPC分类号： H01L23/49 ,  B23K35/02 ,  B23K35/30

CPC分类号： B23K35/302 ,  B23K35/0261 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48664 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48864 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85464 ,  H01L2224/85469 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01205 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/01015 ,  H01L2924/01206 ,  H01L2924/01029 ,  H01L2924/01204 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/0105 ,  H01L2224/45639 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45671 ,  H01L2224/45666 ,  H01L2924/01008 ,  H01L2924/01007 ,  H01L2924/01006 ,  H01L2924/01078 ,  H01L2924/20755 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/01203 ,  H01L2924/01046 ,  H01L2924/20309 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01033

摘要： To provide a covered Cu wire for ball bonding which can be avoid inconvenience oxidation of core material of Cu and/or Cu alloy on ball forming after pulling and cutting away. A covered Cu wire comprising: core material of Cu-P alloy, and intermediate layer of Pd or Pt on the core material and surface layer of Au on the intermediate layer.

摘要翻译： 提供一种用于球焊的包覆铜丝，可以避免在拉拔和切割后的球形成时铜和/或铜合金芯材氧化不便。 一种包覆Cu丝，包括：Cu-P合金芯材，以及芯材上的Pd或Pt中间层和中间层Au表面层。