摘要:
The present invention relates to a contact element (4) comprising an electrically conductive carrier body (10) with at least one contact surface (6, 6a, 6b) for contacting at least one electrical conductor (8, 8a, 8b), wherein the at least one contact surface (6, 6a, 6b) comprises a spray coating (22) made of electrically conductive solid particles (1) distributed over the at least one contact surface (6, 6a, 6b). The presence and distribution of the solid particles (1) lead to a reduction in the contact resistance between the contact element (4) and the at least one conductor (8, 8a, 8b) when the contact element (4) is pressed with the at least one contact surface (6, 6a, 6b) against the at least one conductor (8, 8a, 8b) and the solid particles (1) have there penetrated at least in part into the material of the at least one conductor (8, 8a, 8b). The present invention furthermore relates to a connection assembly (2) with such a contact element (4). The present invention additionally relates to the use of a spray medium (60) as well as to a method for manufacturing such a contact element (4).
摘要:
The invention relates to an electric contact (1) comprising a multilayered coating structure (20) having at least two layers arranged on top of one another, an intermediate layer (32) comprising Bi 3 Ni and a top layer (36) comprising free Bi-grains (40). Furthermore, the invention relates to a method of manufacturing such an electric contact (1), wherein the method comprises the step of first depositing a first layer (24) of nickel and then depositing a second layer (28) of bismuth. The layer of bismuth is at least nine times thicker than nickel.
摘要:
The invention relates to an electric contact (1) comprising a multilayered coating structure (20) having at least two layers arranged on top of one another, an intermediate layer (32) comprising Bi 3 Ni and a top layer (36) comprising free Bi-grains (40). Furthermore, the invention relates to a method of manufacturing such an electric contact (1), wherein the method comprises the step of first depositing a first layer (24) of nickel and then depositing a second layer (28) of bismuth. The layer of bismuth is at least nine times thicker than nickel.