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1.发明授权METALL/CNT- UND/ODER FULLEREN-KOMPOSIT-BESCHICHTUNG AUF BANDWERKSTOFFEN 有权金属/碳纳米管和/或充分的复合材料涂覆在带状材料上
公开(公告)号：EP2342366B1
公开(公告)日：2018-02-28
申请号：EP09744030.9
申请日：2009-09-03
发明人： SCHMIDT, Helge , BURESCH, Isabell , ADLER, Udo , RODE, Dirk , PRIGGEMEYER, Sonja
CPC分类号： C23C16/26 , C23C16/56 , C23C28/021 , C23C28/023 , C23C28/028 , Y10T428/1234 , Y10T428/12493 , Y10T428/12771
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公开(公告)号：EP2792028B1
公开(公告)日：2019-03-13
申请号：EP12798704.8
申请日：2012-12-05
发明人： BLUMENSCHEIN, Rudi , SCHMIDT, Helge
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公开(公告)号：EP3363271A1
公开(公告)日：2018-08-22
申请号：EP16798848.4
申请日：2016-10-12
发明人： BHARADWAJ, Lavanya , MATHEWS, Barry, C. , FRECKMANN, Dominique , SONEJA, Shallu , OAR, Michael, A. , GULSOY, Gokce , SCHMIDT, Helge , LEIDNER, Michael , SACHS, Soenke
IPC分类号： H05K1/02 , H01L21/324
CPC分类号： B32B15/04 , B32B37/06 , B32B37/08 , B32B2307/554 , B32B2457/00 , H01L21/324 , H05K1/0207 , H05K3/125 , H05K2203/092 , H05K2203/1131
摘要： Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.
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4.发明公开ELECTRICAL CONTACT ELEMENT AND METHOD FOR ALTERING MECHANICAL AND/OR ELECTRICAL PROPERTIES OF AT LEAST ONE AREA OF SUCH 审中-公开电气接触元件和方法，用于至少在一个区域内改变机械和/或电特性
公开(公告)号：EP3304653A1
公开(公告)日：2018-04-11
申请号：EP16727496.8
申请日：2016-06-07
摘要： An electrical contact comprises an electrically conductive contact material and a plurality of particles adhered to an area of the contact material. At least some of the particles have a portion penetrating into the contact material.
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公开(公告)号：EP3262715A1
公开(公告)日：2018-01-03
申请号：EP16716320.3
申请日：2016-02-23
IPC分类号： H01R4/18 , H01R43/048 , H01R4/62
CPC分类号： H01R43/048 , H01R4/183 , H01R4/184 , H01R4/188 , H01R4/62
摘要： A crimping device includes an anvil and a crimp tooling member. The anvil is configured to receive a terminal on a top surface thereof. The crimp tooling member has a forming profile recessed from a bottom side of the crimp tooling member. The forming profile is configured to engage a crimp barrel of the terminal as the crimp tooling member moves towards the anvil during a crimping operation to crimp the crimp barrel into mechanical and electrical engagement with an electrical wire disposed within the crimp barrel. The forming profile defines at least one pocket along a top-forming surface of the forming profile that extends between two side walls of the forming profile. Each pocket is configured to form a corresponding protrusion in the crimp barrel of the terminal during the crimping operation.
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公开(公告)号：EP3262659A1
公开(公告)日：2018-01-03
申请号：EP16708062.1
申请日：2016-02-23
IPC分类号： H01B1/02
CPC分类号： H01B7/0009 , H01B1/023 , H01B13/0036 , H01R43/28
摘要： An electrical wire includes a bundle of electrical conductors that has an end segment that extends to an end of the bundle. Each electrical conductor in the bundle engages at least one other electrical conductor. The electrical wire also includes conductive particles disposed between and engaging at least some of the electrical conductors in the bundle along the end segment. The conductive particles are configured to provide an electrical connection between the corresponding electrical conductors engaged by the conductive particles.
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公开(公告)号：EP2954536B1
公开(公告)日：2016-11-23
申请号：EP14702274.3
申请日：2014-02-03
IPC分类号： H01B7/00
CPC分类号： H01B7/0009
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8.发明授权
公开(公告)号：EP2462261B1
公开(公告)日：2016-05-25
申请号：EP10737335.9
申请日：2010-07-30
CPC分类号： C25D15/00 , C10M125/04 , H01B5/00 , H01R13/03
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公开(公告)号：EP4142063A1
公开(公告)日：2023-03-01
申请号：EP22192741.1
申请日：2022-08-30
摘要： The invention relates to an electric contact (1) comprising a multilayered coating structure (20) having at least two layers arranged on top of one another, an intermediate layer (32) comprising Bi 3 Ni and a top layer (36) comprising free Bi-grains (40). Furthermore, the invention relates to a method of manufacturing such an electric contact (1), wherein the method comprises the step of first depositing a first layer (24) of nickel and then depositing a second layer (28) of bismuth. The layer of bismuth is at least nine times thicker than nickel.
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公开(公告)号：EP3252873B1
公开(公告)日：2019-07-24
申请号：EP16172753.2
申请日：2016-06-02
发明人： LEIDNER, Michael , SCHMIDT, Helge , THOSS, Stefan
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