ELECTRIC CONTACT HAVING A MULTILAYERED COATING STRUCTURE

    公开(公告)号:EP4142062A1

    公开(公告)日:2023-03-01

    申请号:EP21193797.4

    申请日:2021-08-30

    IPC分类号: H01R12/58 H01R13/03

    摘要: The invention relates to an electric contact (1) comprising a multilayered coating structure (20) having at least two layers arranged on top of one another, an intermediate layer (32) comprising Bi 3 Ni and a top layer (36) comprising free Bi-grains (40). Furthermore, the invention relates to a method of manufacturing such an electric contact (1), wherein the method comprises the step of first depositing a first layer (24) of nickel and then depositing a second layer (28) of bismuth. The layer of bismuth is at least nine times thicker than nickel.

    ELECTRIC CONTACT HAVING A MULTILAYERED COATING STRUCTURE

    公开(公告)号:EP4142063A1

    公开(公告)日:2023-03-01

    申请号:EP22192741.1

    申请日:2022-08-30

    IPC分类号: H01R12/58 H01R13/03

    摘要: The invention relates to an electric contact (1) comprising a multilayered coating structure (20) having at least two layers arranged on top of one another, an intermediate layer (32) comprising Bi 3 Ni and a top layer (36) comprising free Bi-grains (40). Furthermore, the invention relates to a method of manufacturing such an electric contact (1), wherein the method comprises the step of first depositing a first layer (24) of nickel and then depositing a second layer (28) of bismuth. The layer of bismuth is at least nine times thicker than nickel.

    KÜHLKÖRPER
    6.
    发明公开
    KÜHLKÖRPER 审中-公开

    公开(公告)号:EP2143138A1

    公开(公告)日:2010-01-13

    申请号:EP08735368.6

    申请日:2008-04-23

    申请人: Wieland-Werke AG

    IPC分类号: H01L23/367

    摘要: The invention relates to a cooling body for power electronic modules or for semiconductor elements having a flat metal heat dissipation plate, wherein the heat dissipation plate on the side facing the power electronic module or the semiconductor element comprises a surface structured in the manner of a matrix and having protruding elevations, wherein the heat dissipation plate and surface structured in the manner of a matrix are made out of one piece.

    摘要翻译: 用于功率电子模块或半导体元件的冷却体技术领域本发明涉及一种用于功率电子模块或用于具有扁平金属散热板的半导体元件的冷却体,其中,面对功率电子模块或半导体元件的一侧的散热板包括以矩阵 并具有凸出的突起,其中散热板和以矩阵方式构造的表面由单件制成。

    ELEKTRISCHER KONTAKT
    10.
    发明授权
    ELEKTRISCHER KONTAKT 有权
    电触头

    公开(公告)号:EP1421651B1

    公开(公告)日:2006-11-15

    申请号:EP02794538.5

    申请日:2002-08-02

    IPC分类号: H01R3/00

    CPC分类号: H01R13/03

    摘要: The invention relates to an electric contact comprising a base body consisting of a copper base alloy or stainless steel and a contact layer consisting of a gold base alloy. According to the invention, the contact layer has a thickness of at least 0.3 mu m and consists of gold with between 0.5 and 15 wt % of one or more platinum metals and an intermediate layer consisting of silver, or a silver base alloy, or nickel is provided between the base body and the contact layer. The contact coating is preferably applied to the base body using a physical vapour deposition (PVD) process.