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公开(公告)号：EP4423315A1
公开(公告)日：2024-09-04
申请号：EP22839690.9
申请日：2022-12-15
发明人： PINO, Francesco
IPC分类号： C25B1/04 , C25B11/03 , C25B11/052 , C25B11/075 , C25B11/077 , C23C4/00 , C25B11/031 , C25B11/091
CPC分类号： C25B1/04 , C25B11/052 , C25B11/075 , C25B11/077 , C25B11/031 , C25B11/091 , C23C4/06 , C23C4/18 , Y02E60/36
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公开(公告)号：EP4353701A3
公开(公告)日：2024-07-24
申请号：EP24160369.5
申请日：2014-11-05
申请人： RTX Corporation
IPC分类号： C23C4/06 , C23C4/10 , F01D5/28 , C23C28/04 , C04B41/00 , C04B41/50 , C04B41/87 , F01D25/00 , F02C7/24
CPC分类号： C23C4/06 , F01D25/00 , F02C7/24 , F05D2300/228320130101 , F05D2300/226120130101 , F01D5/288 , F05D2300/18220130101 , C04B41/87 , C04B41/009 , C04B41/5061 , C04B41/5068
摘要： A component for high temperature applications includes a substrate, a layer of an aluminum-containing MAX phase material and another material applied to the substrate. The layer provides a MAX phase/metal matrix composite including a first MAX phase material. The first MAX phase material has a particle size of between 1-3 microns. The metal matrix is formed from particles having a particle size of 0.02 to 0.5 microns.
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公开(公告)号：EP4332266A3
公开(公告)日：2024-06-26
申请号：EP23215296.7
申请日：2020-01-27
申请人： Lyten, Inc.
IPC分类号： B22F1/16 , C22C1/05 , C22C1/02 , C22C1/10 , C22C9/00 , B22F3/115 , B22F3/22 , B23K35/02 , B23K35/22 , C22C1/04 , C22C26/00 , C23C4/04 , C23C4/06 , C23C4/134 , B22F1/18 , C22C1/055 , C23C16/26 , C23C16/40 , C23C16/44 , C23C16/513
CPC分类号： C22C1/05 , C22C9/00 , C22C1/02 , B23K35/0255 , B23K35/0244 , B23K35/22 , C23C4/04 , C23C4/06 , C23C4/134 , B22F2207/0120130101 , C22C26/00 , B22F3/225 , B22F3/115 , C22C1/0425 , C22C1/0416 , B22F2202/1320130101 , B22F2999/0020130101 , C22C1/055 , B22F1/16 , B22F1/18 , C23C16/26 , C23C16/4417 , C23C16/513 , C23C16/401
摘要： This disclosure provides a graded composition including at least a first, second, and third material property zone each having a crystallographic configuration distinct from other zones. In some implementations, the graded composition has a first material in the first material property zone including a metal, the first material composed of metallic bonds between metal atoms present in the first material property zone; a second material that at least partially overlaps the first material in the first material property zone including carbon, the second material composed of covalent bonds between the carbon in the second material and the metal in the first material; and, a third material that at least partially overlaps the second material property zone including carbon, the third material composed of covalent bonds between the carbon of the third material. Each crystallographic configuration may include a cubic crystallographic lattice, a hexagonal lattice, a face or body-centered cubic lattice.
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公开(公告)号：EP4377488A1
公开(公告)日：2024-06-05
申请号：EP22740840.8
申请日：2022-06-29
申请人： Sif Holding N.V.
CPC分类号： C23C4/02 , C23C4/06 , C23C4/08 , C23C4/18 , B05B7/20 , F03D13/25 , F05B2280/601120130101 , B05B13/0228 , B05B13/0405 , B05B7/222 , B24C1/06 , B24C3/18 , Y02E10/72
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公开(公告)号：EP4366091A1
公开(公告)日：2024-05-08
申请号：EP23207755.2
申请日：2023-11-03
摘要： The present invention relates to a contact element (4) comprising an electrically conductive carrier body (10) with at least one contact surface (6, 6a, 6b) for contacting at least one electrical conductor (8, 8a, 8b), wherein the at least one contact surface (6, 6a, 6b) comprises a spray coating (22) made of electrically conductive solid particles (1) distributed over the at least one contact surface (6, 6a, 6b). The presence and distribution of the solid particles (1) lead to a reduction in the contact resistance between the contact element (4) and the at least one conductor (8, 8a, 8b) when the contact element (4) is pressed with the at least one contact surface (6, 6a, 6b) against the at least one conductor (8, 8a, 8b) and the solid particles (1) have there penetrated at least in part into the material of the at least one conductor (8, 8a, 8b). The present invention furthermore relates to a connection assembly (2) with such a contact element (4). The present invention additionally relates to the use of a spray medium (60) as well as to a method for manufacturing such a contact element (4).
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公开(公告)号：EP4355935A1
公开(公告)日：2024-04-24
申请号：EP22825961.0
申请日：2022-06-20
申请人： Maxterial, Inc.
发明人： HAGHDOOST, Atieh , KARGAR, Mehdi , ILGAR, Ersan , CHURCH, Daniel
CPC分类号： C22C27/04 , C23C4/06 , C23C30/00 , C23C4/02 , C23C4/18 , C23C4/129 , C23C28/341 , C23C28/345 , C23C28/32 , C23C28/321 , C23C28/02 , C23C28/021 , C25D7/00 , C25D5/18 , C25D11/34 , C25D11/26 , C25D11/08 , C23C18/32 , C23C18/1653 , C25D5/14
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公开(公告)号：EP3385995A1
公开(公告)日：2018-10-10
申请号：EP18166428.5
申请日：2018-04-09
发明人： Chan, Chung Pui , Lai, Lai Fan , Choi, Wing Hong , Zhang, Bin , Ho, Kwok Keung Paul , Chung, Chien , Lee, Chun Pong
IPC分类号： H01L31/0224 , H01L31/05 , H05K3/20 , H01B13/00
CPC分类号： C23C14/16 , C08K3/08 , C08K2003/0806 , C09D133/02 , C23C4/06 , C25D5/022 , C25D5/54 , C25D7/12 , H01B1/22 , H01L31/022425 , H01L31/0516 , H01L51/0023 , H01L51/003 , H01L51/0097 , H01L51/42 , H05K3/207 , Y02E10/549
摘要： The present invention provides a transparent conductive thin film which is flexible for suiting substantially all kinds of electronic and optoelectronic devices or display panel. The present conductive thin film includes at least one transparent substrate, a deformable layer and a conductive network pattern having a high aspect ratio such that at least one surface of the conductive network being exposed out of the deformable layer or the transparent substrate for contacting with an external structure while a large proportion thereof stays firmly integrated into the substrate. The present invention also relates to methods of fabricating a transparent conductive thin film including the structural features of the transparent conductive thin film of the present invention. Various optimizations of the present methods are also provided in the present invention for facilitating large area thin film fabrication and large scale production.
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公开(公告)号：EP3050997B1
公开(公告)日：2018-07-18
申请号：EP13894771.8
申请日：2013-09-25
发明人： NISHIDA, Hidetaka
CPC分类号： C23C4/12 , C21D9/08 , C21D9/50 , C21D2251/00 , C23C4/06 , C23C4/10 , C23C4/11 , C23C4/16 , C23C4/18 , Y10T428/12576 , Y10T428/12583 , Y10T428/1259 , Y10T428/12931
摘要： A creep reinforcement material containing one or a plurality of elements selected from B, W, Cr, Mo, Nb, V, Hf, Zr, Ti, Cu, and Co is coated or thermally sprayed onto a surface of a heat-resistant metal member manufactured using a heat-resistant metal material, and a section coated or thermally sprayed with the creep reinforcement material is covered by a heat-resistant covering member and secured so as to contact the section. The heat-resistant metal member covered by the heat-resistant covering member is heated to a temperature of 1000°C or greater, and thus compressive force accordingly acts on the heat-resistant metal member as it thermally expands in a direction toward the outer periphery, restraining thermal expansion of the heat-resistant metal member in the direction toward the outer periphery, and enabling the creep reinforcement material on the surface of the heat-resistant metal member to be efficiently diffused and permeated into the heat-resistant metal member.
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