公开(公告)号：EP3198632A4

公开(公告)日：2018-05-09

申请号：EP15844115

申请日：2015-09-28

申请人： TEXAS INSTRUMENTS INC

发明人： COOK BENJAMIN STASSEN ,  HERBSOMMER JUAN ALEJANDRO ,  ROMIG MATTHEW DAVID ,  KUMMERL STEVEN ALFRED ,  SHIH WEI-YAN

IPC分类号： H01L21/60 ,  B33Y10/00 ,  H01L23/485 ,  H01L23/552 ,  H01L23/66

CPC分类号： H01L24/27 ,  H01L21/4867 ,  H01L21/76838 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L2223/6627 ,  H01L2224/24998 ,  H01L2224/2732 ,  H01L2224/27848 ,  H01L2224/29026 ,  H01L2224/29076 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.