公开(公告)号：EP1904264A4

公开(公告)日：2009-05-13

申请号：EP06772731

申请日：2006-06-09

申请人： TEXAS INSTRUMENTS INC

发明人： LANGE BERNHARD P ,  KUMMERL STEVEN ALFRED

IPC分类号： B23K37/00 ,  B23K1/06 ,  B23K20/00 ,  B23K20/10

CPC分类号： B23K20/005 ,  B23K20/004 ,  B23K20/106 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4847 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/2076 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： An apparatus (100) and method for bonding a wire, such as a flat rectangular cross sectioned ribbon wire (104), to a workpiece (106) in semiconductor device fabrication. The wire is fed through a passageway (116) of an ultrasonic bond capillary (102) and clamped against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The wire is bonded to the workpiece along a bonding surface (112) of the bond capillary and penetrated, at least partially, between the bonding surface and the engagement surface of the bond capillary by a cutting tool (124). The cutting tool may comprise an elongate member (126) positioned between the bonding surface and engagement surface, and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool may further comprise a ring cutter, wherein the ribbon wire passes through a ring having a cutting surface defined about an inner diameter thereof.

摘要翻译： 一种用于在半导体器件制造中将诸如扁平矩形横截面带状导线（104）的导线接合到工件（106）的设备（100）和方法。 通过超声波接合毛细管（102）的通路（116）供给金属丝，并通过可操作地联接到接合毛细管的夹爪（118）将金属丝夹紧在接合毛细管的接合表面（120）上。 导线沿着结合毛细管的结合表面（112）结合到工件并且通过切割工具（124）至少部分地穿透结合毛细管的结合表面和结合表面之间。 切割工具可以包括定位在结合表面和接合表面之间的细长构件（126），并且可以具有定位在其远端（130）处的切割刀片（128）。 切割工具可以进一步包括环形切割器，其中带状线穿过具有围绕其内径限定的切割表面的环。

公开(公告)号：EP3198632A4

公开(公告)日：2018-05-09

申请号：EP15844115

申请日：2015-09-28

申请人： TEXAS INSTRUMENTS INC

发明人： COOK BENJAMIN STASSEN ,  HERBSOMMER JUAN ALEJANDRO ,  ROMIG MATTHEW DAVID ,  KUMMERL STEVEN ALFRED ,  SHIH WEI-YAN

IPC分类号： H01L21/60 ,  B33Y10/00 ,  H01L23/485 ,  H01L23/552 ,  H01L23/66

CPC分类号： H01L24/27 ,  H01L21/4867 ,  H01L21/76838 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L2223/6627 ,  H01L2224/24998 ,  H01L2224/2732 ,  H01L2224/27848 ,  H01L2224/29026 ,  H01L2224/29076 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.