公开(公告)号：EP0697612B1

公开(公告)日：2002-06-05

申请号：EP95117264.2

申请日：1992-07-17

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Mignardi, Michael A. ,  Story, Brooks J.

IPC分类号： G02B26/08 ,  G09F9/37

CPC分类号： G09F9/372

公开(公告)号：EP0526784B1

公开(公告)日：1996-10-16

申请号：EP92112230.5

申请日：1992-07-17

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Mignardi, Michael A. ,  Story, Brooks J.

IPC分类号： G09F9/37 ,  G02B26/08

CPC分类号： G09F9/372

公开(公告)号：EP0655781A3

公开(公告)日：1995-10-25

申请号：EP94112032.1

申请日：1994-08-02

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Mignardi, Michael A.

IPC分类号： H01L21/78 ,  G02B26/08

CPC分类号： B81C1/00896 ,  B81B2201/0235 ,  B81B2201/042 ,  B81C99/004 ,  G01P2015/0831 ,  Y10S156/93 ,  Y10T29/49789 ,  Y10T29/49794 ,  Y10T156/11 ,  Y10T156/19

摘要： A method for processing a wafer containing microelectronic mechanical devices that allows all fabrication and test steps to be performed in wafer form instead of device form. The wafer 20 is mounted in a saw frame 24 on dicing tape 22 and the individual devices 27 separated, typically by sawing, prior to completing device fabrication. The devices are left on the dicing tape during the remaining fabrication steps. Some fabrication steps may require covering the adhesive of the dicing tape with a protective cover 44. After all fabrication steps including the application of a protective overcoat and functional testing are completed, the devices are removed from the dicing tape and packaged.

摘要翻译： 一种用于处理含有微电子机械装置的晶片的方法，其允许以晶片形式而不是装置形式来执行所有制造和测试步骤。 在完成器件制造之前，晶片20被安装在切割带22上的锯框架24中，并且单个器件27通常通过锯切被分离。 在剩余的制造步骤中，器件留在切割带上。 一些制造步骤可能需要用保护盖44覆盖切割带的粘合剂。在完成包括施加保护涂层和功能测试的所有制造步骤之后，将器件从切割带移除并包装。

公开(公告)号：EP0510629B1

公开(公告)日：1997-07-30

申请号：EP92106928.2

申请日：1992-04-23

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Mignardi, Michael A. ,  Sampsell, Jeffrey B. ,  Boysel, Mark

IPC分类号： G02B26/02 ,  G02B6/24

CPC分类号： G02B6/3596 ,  G02B6/353 ,  G02B6/3552 ,  G02B6/357 ,  G02B6/3584 ,  G02B26/0841

公开(公告)号：EP0697612A2

公开(公告)日：1996-02-21

申请号：EP95117264.2

申请日：1992-07-17

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Mignardi, Michael A. ,  Story, Brooks J.

IPC分类号： G02B26/08 ,  G09F9/37

CPC分类号： G09F9/372

摘要： In a process of applying color to the mirror elements (14) of a deformable mirror device (10) a layer (26) of material comprising a dye and a resist is formed over the deformable mirror device (10) and the portion of the material not on the desired mirrors is removed.

摘要翻译： 在向可变形反射镜装置（10）的镜元件（14）施加颜色的过程中，包含染料和抗蚀剂的材料层（26）形成在可变形反射镜装置（10）上并且材料的该部分 不在所需的镜子上被去除。 $$

公开(公告)号：EP0657759A3

公开(公告)日：1995-08-09

申请号：EP94109280.1

申请日：1994-06-16

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Gale, Richard O. ,  Mignardi, Michael A.

IPC分类号： G02B26/02 ,  G02B26/08 ,  G09F9/37

CPC分类号： B25B11/005 ,  B28D5/0052 ,  B28D5/0094 ,  B28D5/022 ,  B81C1/00888 ,  G02B26/0841 ,  Y10S148/028 ,  Y10T225/12

摘要： A processing fixture and method of fabricating micromechanical devices, such as digital micromirror devices, that allows fragile structures on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations. The wafer 22 is attached to a vacuum fixture 26 after partially sawing the wafer 22 to create saw kerfs. The backside of the wafer 22 is then ground down to the saw kerfs 24 to separate the devices 32 . Each device 32 is held on the fixture by a vacuum in the headspace above the device 32 . In an alternate embodiment the devices are separated by sawing completely through the wafer while in the fixture.

公开(公告)号：EP0510629A1

公开(公告)日：1992-10-28

申请号：EP92106928.2

申请日：1992-04-23

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Mignardi, Michael A. ,  Sampsell, Jeffrey B. ,  Boysel, Mark

IPC分类号： G02B26/02 ,  G02B6/24

CPC分类号： G02B6/3596 ,  G02B6/353 ,  G02B6/3552 ,  G02B6/357 ,  G02B6/3584 ,  G02B26/0841

摘要： A device comprising a micro-mechanical switch which includes an electrode (38a, 38b) a gap between the electrode and an individually deflectable element (32), which has a vertical shutter (40) attached to its underside. When the electrode is addressed the movement of the deflectable element (32) causes the shutter to raise or lower. Such a device can be used in switching. One embodiment of such a use in waveguides is disclosed along with the method of manufacture.

摘要翻译： 一种包括微机械开关的装置，其包括电极（38a，38b），电极和单独可偏转元件（32）之间的间隙，其具有连接到其下侧的垂直快门（40）。 当电极被寻址时，可偏转元件（32）的移动使得快门升高或降低。 这样的设备可以用于切换。 在波导中使用这种用途的一个实施例与制造方法一起公开。

公开(公告)号：EP0783124B1

公开(公告)日：2002-04-17

申请号：EP96120171.2

申请日：1996-12-13

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Knipe, Richard L. ,  Strumpell, Mark H. ,  Mignardi, Michael A.

IPC分类号： G02B26/08

CPC分类号： G02B26/0825 ,  G02B26/0841

公开(公告)号：EP0783124A1

公开(公告)日：1997-07-09

申请号：EP96120171.2

申请日：1996-12-13

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Knipe, Richard L. ,  Strumpell, Mark H. ,  Mignardi, Michael A.

IPC分类号： G02B26/08

CPC分类号： G02B26/0825 ,  G02B26/0841

摘要： A micromechanical device (50) with spring tips (60) and its method of manufacture. A micromechanical device (50) is formed such that there is a deflectable element (36) suspended by at least one hinge (24a) over an air gap, at the bottom of which are landing stops (34a). The element (36) deflects on said hinge and comes into contact with the landing stops (34a) via at least one small metal protrusion (60), or spring tip. The spring tip flexes upon contact allowing more even distribution of forces and less wear and adhesion. The spring tips are formed in standard semiconductor processing steps with the addition of patterning the metal layer (64) from which the hinges are formed to create separated metal elements. When the deflectable element is formed, the metal forming that element bonds to the separated metal elements at the tips, thereby forming the spring tips.

摘要翻译： 具有弹簧顶端（60）的微机械装置（50）及其制造方法。 微机械装置（50）被形成为使得存在由空气间隙上的至少一个铰链（24a）悬挂的可偏转元件（36），其底部是着陆挡块（34a）。 元件（36）在所述铰链上偏转并经由至少一个小金属突起（60）或弹簧尖端与着陆挡块（34a）接触。 弹簧尖端在接触时弯曲，允许更均匀的力分布和更少的磨损和粘附力。 在标准半导体加工步骤中形成弹簧尖端，其中添加图案化金属层（64），形成铰链以形成分离的金属元件。 当形成可偏转元件时，形成该元件的金属在尖端处与分离的金属元件结合，从而形成弹簧顶端。

公开(公告)号：EP0655781A2

公开(公告)日：1995-05-31

申请号：EP94112032.1

申请日：1994-08-02

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Mignardi, Michael A.

IPC分类号： H01L21/78 ,  G02B26/08

CPC分类号： B81C1/00896 ,  B81B2201/0235 ,  B81B2201/042 ,  B81C99/004 ,  G01P2015/0831 ,  Y10S156/93 ,  Y10T29/49789 ,  Y10T29/49794 ,  Y10T156/11 ,  Y10T156/19

摘要： A method for processing a wafer containing microelectronic mechanical devices that allows all fabrication and test steps to be performed in wafer form instead of device form. The wafer 20 is mounted in a saw frame 24 on dicing tape 22 and the individual devices 27 separated, typically by sawing, prior to completing device fabrication. The devices are left on the dicing tape during the remaining fabrication steps. Some fabrication steps may require covering the adhesive of the dicing tape with a protective cover 44. After all fabrication steps including the application of a protective overcoat and functional testing are completed, the devices are removed from the dicing tape and packaged.

摘要翻译： 微电子器件 方法包括（a）安装晶片， 部分制造的装置，在切割胶带的粘合剂侧上; （b）细分晶片以分离保持安装在切割带上的装置; （c）在切割带的粘合剂侧的暴露部分上放置保护盖; 和（d）继续制造分离的装置，并将保护盖放在适当位置。 还要求的是用于制造数字微镜装置和加速度计的类似方法。