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    POSITIVE-TYPE PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION
    1.
    发明公开
    POSITIVE-TYPE PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION 有权
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    公开(公告)号：EP1132773A4

    公开(公告)日：2002-09-18

    申请号：EP00931608

    申请日：2000-05-30

    Applicant: TORAY INDUSTRIES

    Inventor： TOMIKAWA MASAO ,  SUWA MITSUHITO ,  FUJITA YOJI

    IPC: C08G73/10 ,  G03F7/022 ,  G03F7/023 ,  C08L77/06 ,  C08L79/08 ,  G03F7/037

    CPC classification number: G03F7/0233 ,  C08G73/10 ,  G03F7/022

    Abstract: A positive-type photosensitive polyimide precursor composition comprising a hydroxylated polyimide precursor and the following photosensitive compound (a) or (b): (a) an ester of a phenol having a dipole moment of 0.1 to 1.6 D with naphthoquinone diazide sulfonic acid, or (b) a mixture or ester of a phenol represented by general formula (8) with naphthoquinone diazide sulfonic acid: wherein R , R , R and R are each alkyl or the like; R is hydroxyl or the like; aa, bb, cc, and dd are each an integer of 0 to 3; and ee is an integer of 1 to 3.

    Abstract translation: 本发明涉及一种正型感光性树脂前体组合物，其特征在于，其含有以下述通式（1）表示的结构单元作为主要成分的聚合物，此外，其具有满足以下条件（ a）和/或（b）。 本发明提供了一种可显影光敏组合物。 （a）包括萘醌二叠氮磺酸的酯和偶极矩0.1至1.6德拜的酚化合物（b）包括由通式（8）表示的酚化合物和萘醌二叠氮磺酸和/或 由通式（8）表示的酚化合物和萘醌二叠氮磺酸的酯（通式（1）中，R 1表示具有至少两个碳原子的二价至八价有机基团， 2>表示具有至少两个碳原子的二价至六价有机基团，R 3表示氢或具有1至10个碳的有机基团，n为10至100,000的整数，m为整数 范围0〜2，p和q为0〜4的整数，p和q不同时为0）（式中，R 23，R 24，R 26 >和R 27各自表示氢原子或C 1-8烷基，烷氧基，羧基或酯基，至少一个R 25是羟基 组，而其余表示氢原子和C 1-8烷基。 aa，bb，cc和dd表示0〜3的整数。但aa +bb≤5，bb +dd≤5，aa + bb> 0e表示1〜3的整数。

    POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
    2.
    发明公开
    POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION 有权
    正感光树脂组合物

    公开(公告)号：EP2520977A4

    公开(公告)日：2013-04-03

    申请号：EP10840850

    申请日：2010-12-07

    Applicant: TORAY INDUSTRIES

    Inventor： MIYABE TOMOTSUGU ,  FUJITA YOJI

    IPC: G03F7/023 ,  C08G73/10 ,  C08G73/22 ,  G03F7/075 ,  H01L21/027

    CPC classification number: C08L79/08 ,  C08G73/10 ,  C08K5/29 ,  C08K5/5425 ,  C08K5/5435 ,  C08L63/00 ,  G03F7/0233 ,  G03F7/0751

    Abstract: Disclosed is a positive-type photosensitive resin composition which has excellent storage stability, particularly excellent sensitivity stability, and can be formed into a cured film having excellent adhesion onto a substrate when heated at 350°C or higher or heated in the air. The positive-type photosensitive resin composition comprises (a) a polymer having, as the main component, at least one structure selected from the group consisting of a polyimide precursor structure, a polybenzoxazole precursor structure, and a polyimide structure, (b) a quinonediazide compound, (c) a silane coupling agent having a styryl group, (d) a silane coupling agent having an epoxy group, an oxetanyl group, a methacryloxy group, an acryloxy group, an amino group, an amide group or mercapto group and an alkoxysilyl group, and (e) a solvent.

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