公开(公告)号：EP3112394A4

公开(公告)日：2017-08-16

申请号：EP15754960

申请日：2015-02-24

Applicant: TORAY INDUSTRIES

Inventor： TOMIKAWA MASAO ,  WATANABE TAKUO ,  LEE CHUNGSEO

IPC: C08G73/10 ,  B32B7/12 ,  B32B27/28 ,  B32B27/34 ,  C08G77/455 ,  C08K5/06 ,  C08L79/08 ,  C09J7/00 ,  C09J7/02 ,  C09J11/06 ,  C09J179/08 ,  H01L21/304 ,  H01L21/683 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L21/6836 ,  B32B7/12 ,  B32B27/281 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2457/00 ,  B32B2457/14 ,  C08G73/1039 ,  C08G73/1046 ,  C08G73/106 ,  C08G73/1082 ,  C08G77/455 ,  C08G2170/00 ,  C08L61/28 ,  C09J7/28 ,  C09J7/29 ,  C09J179/08 ,  C09J2203/326 ,  H01L21/304 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are: a polyimide resin which has high heat resistance and is capable of uniformly performing temporary adhesion over a large area with no void or the like; a resin composition using the same; and a laminated film. The polyimide resin of the present invention has at least an acid anhydride residue and a diamine residue and contains a residue of a polysiloxane diamine in an amount of not less than 60% by mole in the total amount of the diamine residue.

Abstract translation: 本发明提供一种聚酰亚胺树脂，其具有高耐热性并且能够在没有空隙等的大面积上均匀地执行临时粘合; 使用其的树脂组合物; 和层压膜。 本发明的聚酰亚胺树脂至少具有酸酐残基和二胺残基，并且在二胺残基的总量中含有不少于60摩尔％的聚硅氧烷二胺残基。