摘要:
The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.
摘要:
The present invention relates to a resin composition comprising (a) an unsaturated polyester resin and/or a methacrylate functional resin, wherein the resin composition further comprises an aromatic amine (b) according to formula (1) in which P 1 is an organic residue, R 1 =H or a C 1 -C 6 alkyl, R 2 = H or CH 3 .
摘要:
The present invention relates to a laminated product comprising a first substrate and a second substrate that adhere to each other only by means of a cured and crosslinked layer of a polymeric adhesive containing no organic solvent, characterized in that: a) the polymeric material of either or both of the first and second substrates is a polyether block copolymer; and b) the polymeric adhesive is a moisture-crosslinkable hot-melt adhesive based on a polyurethane prepolymer or on a blend of polyurethane prepolymers containing free isocyanate (-N=C=O) functional groups. The present invention also relates to a process for manufacturing such a laminate and to its use in the shoe industry, especially for the manufacture of soles and most particularly sports shoe soles.
摘要:
The present application relates to a cured product and the use thereof. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and cracking resistance, etc. The cured product, for example, may be applied as an encapsulant or an adhesive material of a semiconductor device to provide a device having high long-term reliability.
摘要:
A process for the production of a lignin based polyurethane products is provided. The process comprises mixing at least one dried lignin and at least one isocyanate to form a lignin-isocyanate mixture, and submitting the lignin-isocyanate mixture to a polymerization reaction. The polymerization reaction may include heating the lignin-isocyanate mixture, adding at least one catalyst to the lignin-isocyanate mixture, or mixing the lignin-isocyanate mixture with a resin comprising at least one polyol, in the presence of at least one catalyst. The lignin based polyurethane products obtained by the process may be rigid foams, flexible foams, rigid boards, rigid blocks, coatings, packagings, adhesives, binders, sealants, elastomers, Thermoplastic Polyurethanes or Reaction Injection Moldings. There is also provided a mixture comprising at least one dried lignin and at least one isocyanate for use in the production of a lignin based polyurethane products.
摘要:
A process for the production of a lignin based polyurethane products is provided. The process comprises mixing at least one dried lignin and at least one isocyanate to form a lignin-isocyanate mixture, and submitting the lignin-isocyanate mixture to a polymerization reaction. The polymerization reaction may include heating the lignin-isocyanate mixture, adding at least one catalyst to the lignin-isocyanate mixture, or mixing the lignin-isocyanate mixture with a resin comprising at least one polyol, in the presence of at least one catalyst. The lignin based polyurethane products obtained by the process may be rigid foams, flexible foams, rigid boards, rigid blocks, coatings, packagings, adhesives, binders, sealants, elastomers, Thermoplastic Polyurethanes or Reaction Injection Moldings. There is also provided a mixture comprising at least one dried lignin and at least one isocyanate for use in the production of a lignin based polyurethane products.
摘要:
A heat-activable powder adhesive composition for use in bonding a component to a surface such as glass is disclosed. The composition of the disclosed invention includes at least two polymers, at least one solid di- or poly-isocyanate in powder form, and a catalyst. The two polymers each have a melting point above 40 °C and are selected from the group consisting of di-functional polymers and multi¬ functional polymers. The preferred method of preparing the composition of the disclosed invention includes first forming three parts, including a first melted part comprising the polymers, a second melted part comprising the polymers and a catalyst, and a third part comprising the isocyanate. Once cooled, each of the first and second parts forms solid blocks which are fragmented and sieved. The three dry parts are then brought together to form the adhesive powder of the disclosed invention. The adhesive powder can be pre-applied to the attachment surface of a component to be bonded. The composition does not require either a deactivating agent or a blocking agent for deactivating the isocyanate or the catalyst nor does it require either a deactivated isocyanate or a deactivated catalyst.