公开(公告)号：EP2773685B1

公开(公告)日：2018-11-21

申请号：EP12783795.3

申请日：2012-10-29

Applicant: SABIC Global Technologies B.V.

Inventor： GALLUCCI, Robert, Russell ,  ODLE, Roy Ray

IPC: C08G73/10 ,  D01F6/74 ,  D01F6/78 ,  D04H1/4326 ,  D03D15/00 ,  D01D5/08

CPC classification number: C08G73/1071 ,  C08G73/10 ,  C08G73/1017 ,  C08G73/1028 ,  C08G73/1046 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/1064 ,  C08G75/23 ,  C08G77/382 ,  C08L79/08 ,  D01D5/08 ,  D01F6/74 ,  D01F6/78 ,  D04H1/4326 ,  Y10T428/249921 ,  Y10T428/2933 ,  Y10T428/2969

Abstract: The disclosure relates to a process that includes blending a polyimide resin and a primary alky amine organic compound to produce an aryl amine functionalized polyimide, having aryl amine functionality in excess of any anhydride functionality. The polyimide resin can have a weight average molecular weight (Mw) from 5,000 to 100,000 daltons. The organic compound can include at least one primary aliphatic amine without a direct linkage of a nitrogen to an aryl group and without a functionality selected from a halogen functionality, a hydroxyl functionality, a sulfonic acid functionality, a sulfonic acid salt functionality, and combinations thereof. The disclosure also relates to alkyl imide functionalized polyimides also with aryl amine functionalized polyimides, having aryl amine functionality in excess of any anhydride functionality and articles produced therefrom.

公开(公告)号：EP3344703A1

公开(公告)日：2018-07-11

申请号：EP16763964.0

申请日：2016-08-25

Applicant: SABIC Global Technologies B.V.

Inventor： SHAN, Wei ,  SHEN, Liang

IPC: C08L79/08 ,  H01B3/42 ,  H01B7/295

CPC classification number: H01B3/427 ,  C08G73/106 ,  C08G73/1067 ,  C08L67/00 ,  C08L79/08 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/202 ,  C08L2205/02 ,  C08L2205/03 ,  C08L2205/035 ,  C08L2205/06 ,  C08L2207/04 ,  H01B3/28 ,  H01B3/303 ,  H01B3/306 ,  H01B3/423 ,  H01B3/46 ,  H01B7/0275 ,  H01B7/24 ,  H01B7/295 ,  C08L67/025 ,  C08L23/06 ,  C08L63/00 ,  C08L67/02

Abstract: A thermoplastic composition includes a polyetherimide, a thermoplastic polyester elastomer comprising a hard segment comprising a polyester block, and a soft segment comprising a polyether block or a polyester block, and optionally, a polyester, one or more flame retardants, and one or more additives. Articles including the composition can include an extruded part, an injection molded part, or a hot-compressed part. Also described herein is an electrical wire including a conductor wire and a covering disposed over the conductor wire, wherein the covering includes the thermoplastic composition. Articles including the electrical wire are also discussed.

公开(公告)号：EP2636056B1

公开(公告)日：2018-07-04

申请号：EP11775951.4

申请日：2011-10-27

Applicant: BASF SE

Inventor： KIRNER, Hans Jürg ,  KASTLER, Marcel ,  MARTIN, Emmanuel

IPC: H01L21/336 ,  H01L29/786 ,  H01L29/78 ,  H01L51/05 ,  H01L51/00 ,  B32B27/08 ,  B32B27/00 ,  C08J7/04 ,  C09D179/08 ,  C08G73/10 ,  C09B57/00 ,  C09B69/10

CPC classification number: C09D179/08 ,  C08G73/1042 ,  C08G73/106 ,  C08G73/1067 ,  C08G73/1075 ,  C08G73/1082 ,  C08J2477/00 ,  C08J2479/08 ,  C09B57/00 ,  C09B57/004 ,  C09B69/008 ,  C09B69/105 ,  C09B69/109 ,  H01L51/052 ,  H01L51/0545

Abstract: The present invention provides a process for the preparation of a transistor on a substrate, which transistor comprises a layer, which layer comprises polyimide B, which process comprises the steps of i) forming a layer comprising photocurable polyimide A by applying photocur- able polyimide A on a layer of the transistor or on the substrate ii) irradiating the layer comprising photocurable polyimide A with light of a wavelength of > = 360 nm in order to form the layer comprising polyimide B, and a transistor obtainable by that process.

公开(公告)号：EP3315504A1

公开(公告)日：2018-05-02

申请号：EP17001603.4

申请日：2017-09-27

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Urano, Hiroyuki ,  Takemura, Katsuya ,  Iio, Masashi ,  Hasegawa, Koji ,  Funatsu, Kenji

IPC: C07F7/18 ,  C08G73/10 ,  G03F7/037 ,  G03F7/40

CPC classification number: G03F7/0387 ,  C07C69/76 ,  C07F7/081 ,  C07F7/0838 ,  C07F7/1804 ,  C07F7/1892 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/1071 ,  C08G73/121 ,  C08G77/045 ,  G03F7/0045 ,  G03F7/037 ,  G03F7/0757 ,  G03F7/0758 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/325 ,  G03F7/38 ,  G03F7/40

Abstract: The present invention provides a tetracarboxylic acid diester compound represented by the following general formula (1),

wherein, X 1 represents a tetravalent organic group, and R 1 represents a group represented by the following general formula (2),

wherein, the dotted line represents a bonding, Y 1 represents an organic group with a valency of k+1, Rs represents a group containing at least one silicon atom, "k" represents 1, 2 or 3, and "n" represents 0 or 1. There can be provided a tetracarboxylic acid diester compound which can lead a polymer of a polyimide precursor capable of using a base resin of a negative photosensitive resin composition which is capable of forming a fine pattern and giving high resolution, a polymer of a polyimide precursor obtained by using the tetracarboxylic acid diester compound and a method for producing the same.

Abstract translation: 本发明提供由下述通式（1）表示的四羧酸二酯化合物，其中，X 1表示四价有机基团，R 1表示下述通式（2）表示的基团，其中，虚线表示 Y 1表示价数为k + 1的有机基团，R s表示含有至少一个硅原子的基团，“k”表示1,2或3，并且“n”表示0或1.可以提供 能够导出能够使用能够形成微细图案且高分辨率的负型感光性树脂组合物的基础树脂的聚酰亚胺前体的聚合物的四羧酸二酯化合物，使用该四羧酸得到的聚酰亚胺前体的聚合物 二酯化合物及其制备方法。

公开(公告)号：EP3302938A1

公开(公告)日：2018-04-11

申请号：EP16731331.1

申请日：2016-06-02

Applicant: SABIC Global Technologies B.V.

Inventor： KALYANARAMAN, Viswanathan ,  TEUTSCH, Eric ,  HOCKER, Thomas ,  PRICE, Brian

IPC: B29C67/00 ,  C08G73/10

CPC classification number: B29C64/106 ,  B29C64/209 ,  B29K2079/08 ,  B33Y10/00 ,  B33Y70/00 ,  C08G73/1028 ,  C08G73/1032 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/1064 ,  C08G73/1071 ,  C08L79/08

Abstract: A system comprises an extrusion head to selectively extrude a bead of a precursor solution onto a target road on a substrate within a build area, the precursor solution comprising a polyimide precursor compound in a solvent, an actuator coupled to the extrusion head to move the extrusion head, a control system coupled to the actuator to control the extrusion head along the target road and selectively dispense the precursor solution to the extrusion head, and an environmental system configured to accommodate the target road during fabrication, the environmental system configured to expose the dispensed precursor solution to a temperature selected to evaporate solvent from the solution to initiate polymerization of the polyimide precursor compound to form at least a portion of a polyimide part.

公开(公告)号：EP3262123A1

公开(公告)日：2018-01-03

申请号：EP16708053.0

申请日：2016-02-22

Applicant: SABIC Global Technologies B.V.

Inventor： SHETH, Kapil Chandrakant ,  RAMALINGAM, Hariharan

IPC: C08L83/10 ,  H01B3/46

CPC classification number: C08L83/10 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/106 ,  C08G73/1082 ,  C08G77/455 ,  C08K3/013 ,  C08K3/34 ,  C08K2003/265 ,  C08L67/02 ,  C08L79/08 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/20 ,  H01B3/305 ,  H01B3/306 ,  H01B3/421 ,  H01B3/46 ,  C08L67/00

Abstract: A poly(siloxane-etherimide) composition comprising, based on the total weight of the composition, 70 to 90 wt % of a poly(siloxane-etherimide); and an additive comprising a polyester, a filler, or a combination thereof; wherein the filler comprises talc, calcium carbonate, or a combination comprising at least one of the foregoing; and wherein the composition has a number of drops to tracking at 250 volts of greater than or equal to 50 drops determined according to ASTM D-3638-85.

公开(公告)号：EP3134459A4

公开(公告)日：2017-11-15

申请号：EP15782313

申请日：2015-04-23

Applicant: POLYONE CORP

Inventor： DUAN YANNAN ,  AVAKIAN ROGER W

IPC: C08G73/10 ,  C08G73/02 ,  C08G73/12 ,  C08K3/00 ,  C08K5/00 ,  C08L79/08

CPC classification number: C08G73/121 ,  C08G73/105 ,  C08G73/106 ,  C08G73/124 ,  C08G73/125 ,  C08L79/08

公开(公告)号：EP3227376A1

公开(公告)日：2017-10-11

申请号：EP15801081.9

申请日：2015-11-16

Applicant: SABIC Global Technologies B.V.

Inventor： GALLUCCI, Robert Russell ,  APPEL, Pamela J.

IPC: C08K5/523 ,  C08L79/08

CPC classification number: C08L79/08 ,  C08G73/1042 ,  C08G73/106 ,  C08G73/1082 ,  C08K5/523 ,  C09D179/08

Abstract: A polyetherimide-siloxane composition including 70 to 99.9 weight percent of a polyetherimide-siloxane copolymer having a weight average molecular weight of 5,000 to 80,000 Daltons and having a polysiloxane content of 10 to 50 weight percent, preferably 15 to 40 weight percent, more preferably 20 to 35 weight percent, and 0.1 to 30 weight percent of an aryl phosphate having a molecular weight from 500 to 1,200 Daltons, wherein weight percent is based on the total weight of the composition, is disclosed. The composition has a melt flow at least 10% greater than the melt flow of the same polyetherimide-siloxane composition without the aryl phosphate, measured according to ASTM D1238 at 300° C. under a 5.0 kilogram load.

Abstract translation: 一种聚醚酰亚胺 - 硅氧烷组合物，其包含70至99.9重量％的重均分子量为5,000至80,000道尔顿并且聚硅氧烷含量为10至50重量％，优选15至40重量％，更优选20重量％的聚醚酰亚胺 - 硅氧烷共聚物 至35重量百分比，和0.1至30重量百分比的分子量为500至1,200道尔顿的芳基磷酸酯，其中重量百分比基于组合物的总重量。 根据ASTM D1238在300℃和5.0千克负荷下测量，组合物的熔体流动速率比不含磷酸芳基酯的相同聚醚酰亚胺 - 硅氧烷组合物的熔体流动速度高至少10％。

公开(公告)号：EP3112394A4

公开(公告)日：2017-08-16

申请号：EP15754960

申请日：2015-02-24

Applicant: TORAY INDUSTRIES

Inventor： TOMIKAWA MASAO ,  WATANABE TAKUO ,  LEE CHUNGSEO

IPC: C08G73/10 ,  B32B7/12 ,  B32B27/28 ,  B32B27/34 ,  C08G77/455 ,  C08K5/06 ,  C08L79/08 ,  C09J7/00 ,  C09J7/02 ,  C09J11/06 ,  C09J179/08 ,  H01L21/304 ,  H01L21/683 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L21/6836 ,  B32B7/12 ,  B32B27/281 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2457/00 ,  B32B2457/14 ,  C08G73/1039 ,  C08G73/1046 ,  C08G73/106 ,  C08G73/1082 ,  C08G77/455 ,  C08G2170/00 ,  C08L61/28 ,  C09J7/28 ,  C09J7/29 ,  C09J179/08 ,  C09J2203/326 ,  H01L21/304 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are: a polyimide resin which has high heat resistance and is capable of uniformly performing temporary adhesion over a large area with no void or the like; a resin composition using the same; and a laminated film. The polyimide resin of the present invention has at least an acid anhydride residue and a diamine residue and contains a residue of a polysiloxane diamine in an amount of not less than 60% by mole in the total amount of the diamine residue.

Abstract translation: 本发明提供一种聚酰亚胺树脂，其具有高耐热性并且能够在没有空隙等的大面积上均匀地执行临时粘合; 使用其的树脂组合物; 和层压膜。 本发明的聚酰亚胺树脂至少具有酸酐残基和二胺残基，并且在二胺残基的总量中含有不少于60摩尔％的聚硅氧烷二胺残基。

公开(公告)号：EP3134459A1

公开(公告)日：2017-03-01

申请号：EP15782313.9

申请日：2015-04-23

Applicant: PolyOne Corporation

Inventor： DUAN, Yannan ,  AVAKIAN, Roger W.

IPC: C08G73/10 ,  C08G73/02 ,  C08L79/08 ,  C08K3/00 ,  C08K5/00

CPC classification number: C08G73/121 ,  C08G73/105 ,  C08G73/106 ,  C08G73/124 ,  C08G73/125 ,  C08L79/08

Abstract: Aliphatic polyimides are synthesized by a 2:1 molar ratio reaction of an unsaturated monoanhydride or an unsaturated diacid with a diamine. Bio-derived monomers are particularly useful in the synthesis of the aliphatic polyimides.

Abstract translation: 不饱和单酐的摩尔比为2:1反应或与二胺的不饱和二酸：脂肪族聚酰亚胺由2合成。 生物衍生的单体是在脂肪族聚酰亚胺的合成中特别有用。