公开(公告)号：EP3216046A1

公开(公告)日：2017-09-13

申请号：EP15856201.7

申请日：2015-11-06

申请人： Texas Instruments Incorporated

发明人： GUO, Honglin ,  TAYLOR, Tim, A. ,  WEST, Jeff, A. ,  JACKSON, Ricky, A. ,  WILLIAMS, Byron

IPC分类号： H01L21/02 ,  H01L21/033 ,  H01L51/05 ,  H01L51/56

CPC分类号： H01L21/02118 ,  H01G4/14 ,  H01G4/18 ,  H01G4/224 ,  H01G4/236 ,  H01G4/33 ,  H01L21/02164 ,  H01L21/02178 ,  H01L21/0228 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3192 ,  H01L23/564 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L28/40 ,  H01L51/00 ,  H01L2224/02166 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/04042 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2224/45099

摘要： It has been discovered that poor TDDB reliability of microelectronic device capacitors with organic polymer material in the capacitor dielectric is due to water molecules infiltrating the organic polymer material when the microelectronic device is exposed to water vapor in the operating ambient. Water molecule infiltration from water vapor in the ambient is effectively reduced by a moisture barrier comprising a layer of aluminum oxide formed by an atomic layer deposition (ALD) process. A microelectronic device includes a capacitor with organic polymer material in the capacitor dielectric and a moisture barrier with a layer of aluminum oxide formed by an ALD process.

摘要翻译： 已经发现，当微电子器件暴露于工作环境中的水蒸汽时，电容器电介质中具有有机聚合物材料的微电子器件电容器的差的TDDB可靠性是由于水分子渗入有机聚合物材料。 通过包括通过原子层沉积（ALD）工艺形成的氧化铝层的防潮层有效地降低环境中水蒸气的水分子渗透。 微电子器件包括在电容器电介质中具有有机聚合物材料的电容器以及具有通过ALD工艺形成的氧化铝层的防潮层。