公开(公告)号：EP0712266A2

公开(公告)日：1996-05-15

申请号：EP95308071.0

申请日：1995-11-10

Applicant: VLT CORPORATION

Inventor： Pullen, Stephen R. ,  Hedlund III,Walter R.

IPC: H05K5/00 ,  H05K7/20

CPC classification number: H05K7/20463 ,  H01L2224/05553 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0052 ,  H05K3/0061 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K3/42 ,  H05K5/0095 ,  H05K7/209 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49179 ,  Y10T29/49211

Abstract: A structure comprising a baseplate, a circuit board parallel and adjacent to the baseplate, and an electronic component is described. The circuit board has an edge with a scallop formed in the edge, and the scallop is plated with a conductive material. The electronic component includes a power-dissipating surface and a pad for making electrical connection. The electronic component is mounted with the power-dissipating surface in contact with the baseplate and the pad electrically connected to the conductive material.

公开(公告)号：EP0712266B1

公开(公告)日：2000-10-11

申请号：EP95308071.0

申请日：1995-11-10

Applicant: VLT CORPORATION

Inventor： Pullen, Stephen R. ,  Hedlund III,Walter R.

IPC: H05K5/00 ,  H05K7/20 ,  H05K3/40

CPC classification number: H05K7/20463 ,  H01L2224/05553 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0052 ,  H05K3/0061 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K3/42 ,  H05K5/0095 ,  H05K7/209 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49179 ,  Y10T29/49211

公开(公告)号：EP0712266A3

公开(公告)日：1996-06-26

申请号：EP95308071.0

申请日：1995-11-10

Applicant: VLT CORPORATION

Inventor： Pullen, Stephen R. ,  Hedlund III,Walter R.

IPC: H05K5/00 ,  H05K7/20

CPC classification number: H05K7/20463 ,  H01L2224/05553 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0052 ,  H05K3/0061 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K3/42 ,  H05K5/0095 ,  H05K7/209 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49179 ,  Y10T29/49211

Abstract: A structure comprising a baseplate, a circuit board parallel and adjacent to the baseplate, and an electronic component is described. The circuit board has an edge with a scallop formed in the edge, and the scallop is plated with a conductive material. The electronic component includes a power-dissipating surface and a pad for making electrical connection. The electronic component is mounted with the power-dissipating surface in contact with the baseplate and the pad electrically connected to the conductive material.

Abstract translation: 描述了一种结构，包括基板，与基板平行且相邻的电路板以及电子部件。 电路板的边缘有一个边缘，边缘形成扇贝，扇贝镀有导电材料。 电子组件包括功率消耗表面和用于进行电连接的焊盘。 电子元件安装成使功率消散表面与基板接触并且焊盘电连接到导电材料。