公开(公告)号：EP1760041A3

公开(公告)日：2010-08-11

申请号：EP06300835.3

申请日：2006-07-28

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： Marion, François

IPC: B81C5/00

CPC classification number: B81C1/00269 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/73103 ,  H01L2224/73203 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/10666 ,  H05K2203/1147 ,  Y02P70/613 ,  H01L2924/00012

Abstract: Ce procédé pour encapsuler un composant 3, notamment électrique ou électronique, consiste :
- tout d'abord à ménager une enceinte au sein de laquelle règne le vide ou dont l'atmosphère est contrôlée ;
- puis à positionner sur une surface de mouillabilité 5 mise en place sur un support ou substrat 1 comportant au moins un composant 3, et s'étendant à la périphérie du ou des composants, un cordon de scellement continu 8, réalisé en un métal ou en un alliage métallique,
- à positionner sur le cordon de scellement 8 un boîtier ou capot 2 de dimensions appropriées ;
- et enfin, à élever la température au sein de ladite enceinte afin d'aboutir à la fusion du matériau constitutif du cordon de scellement 8, induisant d'une part, l'abaissement du capot ou boîtier 2 en direction du support 1, et corollairement son scellement étanche et hermétique audit support, propre à assurer l'étanchéité de la cavité interne 9 ainsi définie vis-à-vis de l'extérieur.
La surface de mouillabilité 5 mise en place sur le substrat 1 à la périphérie du ou des composants 3 présente des variations selon une direction du plan dans lequel elle s'inscrit autre que la direction parallèle à la direction d'extension principale du cordon de scellement 8.

公开(公告)号：EP2193697A2

公开(公告)日：2010-06-09

申请号：EP08803865.8

申请日：2008-09-09

Applicant: Robert Bosch GmbH

Inventor： KUGLER, Andreas ,  LIEBING, Gerhard ,  FREUNDT, Dirk

IPC: H05K1/18

CPC classification number: H05K1/188 ,  H01L21/568 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/1461 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/0355 ,  H05K2201/10666 ,  H01L2924/00

Abstract: The invention relates to a method for the production of an electronic assembly (21), particularly for high-frequency applications, comprising at least one electronic component (9) that is mounted on a printed circuit board (45), and at least one conductor structure (15, 25), by means of which the at least one electronic component (9) is contacted. For this purpose, the at least one electronic component (9) is mounted on an insulating layer (5) of a conductive foil (1). The conductive foil (1) having the at least one electronic component (9) mounted thereon is laminated onto a printed circuit board carrier (13). The structuring of the conductive foil (1) and the contacting of the at least one electronic component (9) forms a conductor structure (15). Soldering points (35) are provided to through-platings (33), which are configured in the electronic assembly (21) and lead to the bottom of the electronic assembly (21), and are connected to the conductor structure (15, 25).

公开(公告)号：EP1018146B1

公开(公告)日：2010-04-21

申请号：EP99925964.1

申请日：1999-05-27

Applicant: DET International Holding Limited

Inventor： JITARU, Ionel

IPC: H05K1/16 ,  H05K1/02 ,  H01F27/06 ,  H01L21/00 ,  H05K1/14

CPC classification number: H05K1/0204 ,  H01F27/06 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/141 ,  H05K1/165 ,  H05K1/182 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/086 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2201/10666 ,  H01L2924/00

Abstract: A package for power converters in which a multilayers circuit board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portions of the bottom layers are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic core (26a). The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiments of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The base plate has cutouts or cavities to accomodate the magnetic cores. A thermally conductive material is placed between the magnetic core (26a) and the metal plate on the bottom of the cavity.

公开(公告)号：EP2034807A3

公开(公告)日：2010-01-20

申请号：EP08105191.4

申请日：2008-09-01

Applicant: Continental Automotive GmbH

Inventor： Wolf, Peter

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H05K3/363 ,  H05K3/368 ,  H05K2201/09627 ,  H05K2201/10666 ,  H05K2203/0455

Abstract: Die Erfindung betrifft einen Leiterplattenstapel (1) bestehend aus zumindest zwei parallel zueinander und zumindest bereichsweise übereinander angeordneten Leiterplatten (2a; 2b; 2c), wobei jeweils zwei benachbarte Leiterplatten (2a; 2b; 2c) mittels zumindest einer Lötverbindung (14) miteinander elektrisch und mechanisch in Verbindung stehen, wobei für eine einfache und kostengünstige Herstellbarkeit die Lötverbindung (14) zwischen den benachbarten Leiterplatten (2a; 2b; 2c) jeweils zwischen einer auf einer Leiterplattenober-und/oder -unterseite (3; 4) vorgesehenen Metallbeschichtung (9; 10; 11; 12) der ersten Leiterplatte (2a; 2c) und einer durchgehenden Durchkontaktierung (5; 6) der zweiten Leiterplatte (2b) besteht, wobei die Durchkontaktierung (5; 6) zu einer der Lötverbindung (14) gegenüberliegenden Leiterplattenseite (3; 4) der zweiten Leiterplatte (2b) hin offen ist.

公开(公告)号：EP1058306B1

公开(公告)日：2008-08-20

申请号：EP00111065.9

申请日：2000-06-02

Applicant: JAPAN RADIO CO., LTD

Inventor： Yatsuda, Hiromi

IPC: H01L23/10 ,  H01L23/04

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/0379 ,  H05K2201/09472 ,  H05K2201/10666 ,  H05K2203/1147 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014

公开(公告)号：EP1776001A2

公开(公告)日：2007-04-18

申请号：EP07100813.0

申请日：1998-01-05

Applicant: IBIDEN CO., LTD.

Inventor： Ishida, Naoto c/o Ibiden Co., Ltd. ,  Asano, Kouji c/o Ibiden Co., Ltd.

IPC: H05K1/14 ,  H05K3/36 ,  H01L23/12

CPC classification number: H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10666 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 greater than an opening diameter of the through hole and forming a joining portion to the opposite party pad, and a leg portion 12 having a size capable of inserting this leg portion into the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. A joining ball approximately having a spherical shape instead of the joining pin can be also joined to the through hole by the conductive material.

Abstract translation: 印刷线路板具有电路基板6，该电路基板6具有导体电路5和通孔60，并且还具有插入该通孔中的连接销1。 接合销是通过使用在加热温度下未熔化的材料将接合销连接到对方垫81而制造的。接合销由比通孔的开口直径大的接合头部11构成，并形成接合 部分连接到对方垫上，并且腿部12具有能够将该腿部插入到通孔中的尺寸。 腿部插入通孔并通过诸如焊接材料20等的导电材料与通孔接合。代替接合销的大致具有球形的接合球也可以接合到通孔 由导电材料制成。

公开(公告)号：EP1724832A2

公开(公告)日：2006-11-22

申请号：EP06010226.6

申请日：2006-05-18

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Kimura,Junichi c/o Matsushita Elec. Ind. Co.,Ltd ,  Honjo,Kazuhiko c/o Matsushita Elec. Ind. Co.,Ltd ,  Kawamoto, Eiji c/o Matsushita Elec. Ind. Co., Ltd. ,  Harada, Shinji c/o Matsushita Elec. Ind. Co., Ltd. ,  Kitagawa, Motoyoshi Matsushita Elec. Ind. Co.,Ltd.

IPC: H01L23/538 ,  H01L23/498 ,  H01L25/10

CPC classification number: H05K1/144 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0237 ,  H05K1/185 ,  H05K3/0052 ,  H05K3/3436 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/09181 ,  H05K2201/10371 ,  H05K2201/10666 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A multilayer module which includes parts-containing module (32) whose circuit board (1) has been mounted at one surface with electronic component (2a) and the electronic component is covered with resin layer (39). Connection terminals (34a), (34b) have been provided either at resin layer (39) or at the other surface of circuit board (1), also through hole (46) has been provided for connection between the two surfaces of module (32). Also included is module (33), which has been provided with connection terminal (35a), (35b) at a place corresponding to connection terminal (34a), (34b), and through hole (47) for connection between the connection terminal (35a), (35b) and electronic component (2b). Disposed between conductor layer (34) and conductor layer (35) is insulation layer (36), which insulation layer having conductive bond (37) for connection between connection terminals (34a), (34b) and connection terminals (35a), (35b), respectively. In the above-described configuration, places of through hole (47) and electronic component (2b) in module (33) are not restricted by a location of through hole (46).

Abstract translation: 一种多层模块，其包括模块（32），其电路板（1）被安装在与电子元件（2a）的一个表面上，所述电子部件用树脂覆盖层（39）含有份-。 连接端子（34A），（34B）已被提供或者在树脂层（39），或在电路板的另一表面（1），即通孔（46），已经提供了（32模块的两个表面之间的连接 ）。 所以包括的是模块（33），其已经提供有连接端子（35A），（35B）中的一个位置对应于连接端子（34A），（34B）和通孔（47），用于连接端子之间的连接（ 35A），（35B）和电子部件（2B）。 导体层（34）和导体层（35）之间设置绝缘层（36），其中具有用于，（34B）和连接端子（35A）的连接端子之间的连接（34A）导电键（37）的绝缘层，（35B ）表示。 另外，在上述的构成中，在模块（33）至（47）和电子部件（2b）的孔的孔的地方都没有通过的位置通过（46）的限制。

公开(公告)号：EP1342294A4

公开(公告)日：2006-03-08

申请号：EP01964214

申请日：2001-08-20

Applicant: DT INC DI ,  ROY APURBA

Inventor： ROY APURBA

IPC: H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K5/00 ,  H01R13/46

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10666 ,  H05K2201/10856 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49211 ,  H01L2924/00

Abstract: A low impedance surface mount connector (20) having an I-shaped cross section for connecting between the first and second circuit boards (51, 61).

公开(公告)号：EP0678917B1

公开(公告)日：2003-06-25

申请号：EP95105834.6

申请日：1995-04-19

Applicant: NEC CORPORATION

Inventor： Shimada, Yuzo ,  Suyama, Takayuki ,  Tanaka, Yoshimasa

IPC: H01L23/433 ,  H01L23/40 ,  H01L23/498

CPC classification number: H01L21/486 ,  H01L23/4006 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/50 ,  H01L2023/4043 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H05K1/0201 ,  H05K3/301 ,  H05K3/3457 ,  H05K3/363 ,  H05K2201/062 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10568 ,  H05K2201/10666 ,  H05K2201/10681 ,  H01L2924/00

公开(公告)号：EP1093082A3

公开(公告)日：2002-06-12

申请号：EP00307934.0

申请日：2000-09-13

Applicant: FUJITSU LIMITED

Inventor： Kaiya, Hiroshi, c/o Fujitsu Limited ,  Honda, Toshiyuki, c/o Fujitsu Limited

IPC: G06K19/077

CPC classification number: G06K19/07747 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07769 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/182 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/10477 ,  H05K2201/10666 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A module of a combination card can be incorporated into a card body with solder being easily melted, and heat transmission to portions other than the antenna connection terminals is reduced. A card body (1) is provided with an antenna. The module (20) includes a substrate (7) which has a terminal surface on which at least one external connection terminal (4) is formed and a mounting surface opposite to the terminal surface. An IC chip (8) is mounted on the mounting surface. The module includes at least one antenna connection terminal (21a, 21b) located on the mounting surface. The antenna connection terminal (21a) is connected to the antenna, and at least a part (21b) of the antenna connection terminal (21a, 21b) is exposed on the terminal surface.