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公开(公告)号:EP3380671A1
公开(公告)日:2018-10-03
申请号:EP16810136.8
申请日:2016-11-16
申请人: WestRock MWV, LLC
CPC分类号: D21H27/18 , B32B7/04 , B32B7/12 , B32B27/10 , B32B27/18 , B32B27/22 , B32B27/308 , B32B27/36 , B32B2250/02 , B32B2250/03 , B32B2250/40 , B32B2264/10 , B32B2264/102 , B32B2264/104 , B32B2264/107 , B32B2307/31 , B32B2307/7163 , B32B2307/732 , B32B2307/748 , B32B2439/40 , B65D65/42 , B65D65/466 , D21H19/40 , D21H19/42 , D21H19/56 , D21H19/62 , D21H19/80 , D21H19/82 , D21H27/10 , D21H27/30
摘要: A coating for paperboard includes polylactic acid and an inorganic material. The inorganic material may be talc. The presence of the talc has a beneficial effect on extrusion processing behavior including lower melt temperature, lower head pressure, and lower motor load. Additionally, the presence of talc reduces edge weave and neck-in during extrusion coating processes.
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公开(公告)号:EP3380670A1
公开(公告)日:2018-10-03
申请号:EP16809242.7
申请日:2016-11-16
申请人: WestRock MWV, LLC
IPC分类号: D21H27/10 , B32B27/00 , B32B27/08 , B32B27/20 , B32B27/32 , B32B29/00 , D21H27/18 , D21H27/30 , D21H19/20 , D21H19/22 , D21H19/38 , D21H19/82
CPC分类号: D21H27/10 , B32B27/08 , B32B27/10 , B32B27/18 , B32B27/20 , B32B27/32 , B32B29/002 , B32B2264/10 , B32B2264/102 , B32B2264/104 , B32B2307/31 , B32B2307/732 , B32B2551/00 , B32B2553/00 , D21H19/20 , D21H19/22 , D21H19/38 , D21H19/385 , D21H19/58 , D21H19/82 , D21H19/828 , D21H27/18 , D21H27/30
摘要: A coating for paperboard includes polyethylene outer layers and a polyethylene inner layer with calcium carbonate filler. In addition to the lower cost, benefits include a surprising better heat sealing behavior compared with a coating of polyethylene alone.
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公开(公告)号:EP3370957A1
公开(公告)日:2018-09-12
申请号:EP16798330.3
申请日:2016-11-03
申请人: Westrock MWV, LLC
IPC分类号: B32B27/10 , B32B27/08 , B32B27/30 , B32B27/32 , B32B27/36 , B32B29/00 , D21H27/10 , D21H11/04 , D21H19/20 , D21H19/22 , D21H19/28 , D21H19/30 , D21H19/40 , D21H19/82 , D21H19/84
CPC分类号: B32B27/10 , B32B7/12 , B32B27/08 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/36 , B32B29/00 , B32B29/06 , B32B2255/12 , B32B2255/26 , B32B2307/31 , B32B2307/514 , B32B2307/518 , B32B2307/5825 , B32B2307/75 , B32B2439/00 , B32B2554/00 , D21H11/04 , D21H19/20 , D21H19/22 , D21H19/28 , D21H19/30 , D21H19/40 , D21H19/824 , D21H19/84 , D21H27/10
摘要: A multi-layer paperboard structure may be heat sealed to form a packaging material. The paperboard structure exhibits good sealing strength and improved anti-blocking behavior. The structure may be self-sealed or sealed to plastic blister materials.
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