公开(公告)号：EP3060377A1

公开(公告)日：2016-08-31

申请号：EP14803247.7

申请日：2014-10-20

申请人： Zephyros Inc.

发明人： MEYER, Francis ,  CHENE, Morgan

IPC分类号： B29C44/44 ,  B29C44/18 ,  C08J9/228

CPC分类号： B29C44/186 ,  B29C44/445 ,  B29K2063/00 ,  B29K2105/0005 ,  B29K2105/0872 ,  B29L2031/608 ,  B32B3/12 ,  B32B27/065 ,  B32B27/08 ,  B32B27/20 ,  B32B27/38 ,  B32B2250/40 ,  B32B2305/022 ,  B32B2305/024 ,  B32B2307/3065 ,  B32B2307/558 ,  B32B2307/702 ,  B32B2605/18 ,  C08J9/10 ,  C08J9/232 ,  C08J2203/04 ,  C08J2207/00 ,  C08J2300/24 ,  C08J2363/00 ,  C08J2363/02

摘要： Spherical heat foamable pellets (2) are used for reinforcing honeycomb structures (4). The pellets are preferably of average diameter from 0.5 mm to 0.9 mm and preferably at least 80% of the pellets have a diameter in this range. The pellets can form a free flowing stream which can be poured into the cells (5) of the honeycomb where they can be foamed by heating to form a reinforcing foam which can also bond the honeycomb structure to facing sheets. It is preferred that the pellets are based on a thermosetting resin and contain a curing agent that can cure the foamed resin to produce an integral rigid reinforcing foam within the cells of the honeycomb.

公开(公告)号：EP3122831A1

公开(公告)日：2017-02-01

申请号：EP15720448.8

申请日：2015-03-30

申请人： Zephyros Inc.

发明人： CHENE, Morgan ,  HENRY, Christophe

IPC分类号： C09J5/06 ,  C09J5/08 ,  C09J9/00 ,  C09J163/00

CPC分类号： C09J5/06 ,  B05D1/06 ,  C08G2650/56 ,  C08L51/04 ,  C08L63/00 ,  C09J5/08 ,  C09J9/00 ,  C09J163/00 ,  C09J2463/00

摘要： An adhesive comprising a solvent free powder of average particle size in the range 20 to 300 preferably 20 to 150 microns is heat activated at a temperature in the range 140° C. to 220° C., is flowable at a temperature below the heat activation temperature and is dry and non-tacky to the touch at ambient temperature, the use of a powdered adhesive is particularly useful for bonding of non-planar surfaces with complex contours.

摘要翻译： 包含平均粒度在20至300范围内，优选20至150微米范围内的无溶剂粉末的粘合剂在140℃至220℃的温度下热活化，可在低于热活化的温度下流动 温度，并且在环境温度下是干燥的和不粘的触摸，使用粉末粘合剂对于具有复杂轮廓的非平面表面的结合特别有用。

公开(公告)号：EP3122831B1

公开(公告)日：2018-09-19

申请号：EP15720448.8

申请日：2015-03-30

申请人： Zephyros Inc.

发明人： CHENE, Morgan ,  HENRY, Christophe

IPC分类号： C09J5/06 ,  C09J5/08 ,  C09J9/00 ,  C09J163/00 ,  C08L51/04 ,  C08L63/00

CPC分类号： C09J5/06 ,  B05D1/06 ,  C08G2650/56 ,  C08L51/04 ,  C08L63/00 ,  C09J5/08 ,  C09J9/00 ,  C09J163/00 ,  C09J2463/00

摘要： An adhesive comprising a solvent free powder of average particle size in the range 20 to 300 preferably 20 to 150 microns is heat activated at a temperature in the range 140° C. to 220° C., is flowable at a temperature below the heat activation temperature and is dry and non-tacky to the touch at ambient temperature, the use of a powdered adhesive is particularly useful for bonding of non-planar surfaces with complex contours.

公开(公告)号：EP3024871A1

公开(公告)日：2016-06-01

申请号：EP14750802.2

申请日：2014-07-25

申请人： Zephyros Inc.

发明人： AWKAL, Michel ,  CHENE, Morgan

IPC分类号： C08G59/02 ,  C09J5/06 ,  C09J7/02 ,  C09J163/00

CPC分类号： C09J7/043 ,  C08J5/128 ,  C08J2363/00 ,  C08J2367/00 ,  C08J2463/00 ,  C09J5/00 ,  C09J5/06 ,  C09J7/00 ,  C09J7/21 ,  C09J7/35 ,  C09J163/00 ,  C09J171/08 ,  C09J2201/122 ,  C09J2201/128 ,  C09J2205/114 ,  C09J2451/00 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2463/006 ,  C09J2467/006 ,  C09J2471/00 ,  C09J2477/006 ,  C09J2479/086

摘要： Flexible films of thermosetting adhesive materials which are non-tacky to the touch are storage stable at room temperature and can be cured at elevated temperature with a short cure time and can be cured to produce a tough flexible adhesive layer including bonding to oily surfaces, the materials are particularly useful in bonding together dissimilar substrates.