公开(公告)号：EP3979500B1

公开(公告)日：2025-02-19

申请号：EP21190651.6

申请日：2021-08-10

Inventor： BARDSLEY, Scott G. ,  DINC, Huseyin

IPC: H03K17/0412

公开(公告)号：EP3971968B1

公开(公告)日：2024-10-30

申请号：EP21197241.9

申请日：2021-09-16

Inventor： Oran, Ekrem ,  Kocer, Fatih ,  Kudtarkar, Santosh ,  Poelker, John ,  Yeh, Po-Hao ,  O'Neill, Christopher ,  Steinbrecher, Christoph

IPC: H01L23/552 ,  H03J3/20 ,  H01L23/538

公开(公告)号：EP4398293A1

公开(公告)日：2024-07-10

申请号：EP23217754.3

申请日：2023-12-18

Applicant: Analog Devices, Inc.

Inventor： Kudtarkar, Santosh Anil ,  Raj, Arun ,  Vidyarthy, Sharad ,  Goida, Thomas M.

IPC: H01L23/15 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/15 ,  H01L23/49827 ,  H01L23/5384 ,  H01L23/49816 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/66 ,  H01L25/16

Abstract: An integrated device package may include a glass interposer having one or more conductive vias extending through the glass interposer from a top side of the glass interposer to a bottom side of the glass interposer, the bottom side of the glass interposer comprising one or more contact pads. The device package may include an integrated device die mounted and electrically connected to the top side of the glass interposer. The device package may also include an encapsulating material disposed over at least a side surface of the glass interposer, a portion of the top surface of the glass interposer, and a side surface of the integrated device die.

公开(公告)号：EP3474441B1

公开(公告)日：2024-02-14

申请号：EP18201951.3

申请日：2018-10-23

Inventor： Min, Byungmoo ,  Chiesa, John A.

IPC: H03B5/12 ,  H03B5/18

公开(公告)号：EP2741234B1

公开(公告)日：2023-03-29

申请号：EP13195573.4

申请日：2013-12-03

Inventor： Krishnamoorthy, Venkatesan

IPC: G06V10/40 ,  G06V40/10 ,  G06V10/50

公开(公告)号：EP3478166B1

公开(公告)日：2022-04-20

申请号：EP17821210.6

申请日：2017-06-29

Inventor： DEMIRTAS, Sefa ,  KING, Jason D. ,  ADAMS, Robert ,  AKL, Tony Joseph ,  BERNSTEIN, Jeffrey G.

IPC: A61B5/02 ,  A61B5/024 ,  A61B5/11 ,  A61B5/00 ,  G16H50/70 ,  G16H50/30

公开(公告)号：EP3182598B1

公开(公告)日：2022-03-09

申请号：EP16202962.3

申请日：2016-12-08

Inventor： Silva, Jose Barreiro ,  Paterson, Donald W.

IPC: H03M3/00

公开(公告)号：EP3146670B8

公开(公告)日：2021-09-22

申请号：EP15795660.8

申请日：2015-05-22

Inventor： WALSH, John ,  WALLRABENSTEIN, John Ross ,  TIMKO, Charles

IPC: G09C1/00 ,  H04L9/32 ,  H04L9/08 ,  H04L9/30

公开(公告)号：EP3188368B1

公开(公告)日：2021-07-07

申请号：EP16204137.0

申请日：2016-12-14

Inventor： Zhao, Jialin ,  Meng, Qingdong ,  Dong, Yunzhi ,  Silva, Jose Barreiro

IPC: H03M1/10 ,  H03M1/38 ,  H03M3/00 ,  H03M1/16

公开(公告)号：EP3414845B1

公开(公告)日：2021-03-03

申请号：EP17704830.3

申请日：2017-02-08

Inventor： POSSELT, Adrian ,  BOEHM, Christian

IPC: H04B1/525