公开(公告)号：EP2763163A2

公开(公告)日：2014-08-06

申请号：EP14152487.6

申请日：2014-01-24

Applicant: Analog Devices, Inc.

Inventor： Goida, Thomas M. ,  Xue, Xiaojie

IPC: H01L23/04

CPC classification number: H01L23/49575 ,  G01P1/023 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3107 ,  H01L24/03 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00

Abstract: Various embodiments of an integrated device package are disclosed herein. The package may include a leadframe having a first side and a second side opposite the first side. The leadframe can include a plurality of leads surrounding a die mounting region. A first package lid may be mounted on the first side of the leadframe to form a first cavity, and a first integrated device die may be mounted on the first side of the leadframe within the first cavity. A second integrated device die can be mounted on the second side of the leadframe. At least one lead of the plurality of leads can provide electrical communication between the first integrated device die and the second integrated device die.

Abstract translation: 本文公开了集成器件封装的各种实施例。 封装可以包括具有第一侧和与第一侧相对的第二侧的引线框架。 引线框架可以包括围绕模具安装区域的多个引线。 第一封装盖可以安装在引线框架的第一侧上以形成第一腔，并且第一集成器件裸片可以安装在第一腔内的引线框架的第一侧上。 第二集成器件管芯可以安装在引线框架的第二侧上。 多个引线中的至少一个引线可以在第一集成器件管芯和第二集成器件管芯之间提供电连通。

公开(公告)号：EP4398293A1

公开(公告)日：2024-07-10

申请号：EP23217754.3

申请日：2023-12-18

Applicant: Analog Devices, Inc.

Inventor： Kudtarkar, Santosh Anil ,  Raj, Arun ,  Vidyarthy, Sharad ,  Goida, Thomas M.

IPC: H01L23/15 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/15 ,  H01L23/49827 ,  H01L23/5384 ,  H01L23/49816 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/66 ,  H01L25/16

Abstract: An integrated device package may include a glass interposer having one or more conductive vias extending through the glass interposer from a top side of the glass interposer to a bottom side of the glass interposer, the bottom side of the glass interposer comprising one or more contact pads. The device package may include an integrated device die mounted and electrically connected to the top side of the glass interposer. The device package may also include an encapsulating material disposed over at least a side surface of the glass interposer, a portion of the top surface of the glass interposer, and a side surface of the integrated device die.

公开(公告)号：EP2947692B1

公开(公告)日：2020-09-23

申请号：EP14199059.8

申请日：2014-12-18

Applicant: Analog Devices, Inc.

Inventor： Goida, Thomas M. ,  Xue, Xiaojie

IPC: H01L29/06 ,  H01L21/78 ,  H01L23/31 ,  H05K1/02 ,  H05K1/18

公开(公告)号：EP2947692A3

公开(公告)日：2016-01-13

申请号：EP14199059.8

申请日：2014-12-18

Applicant: Analog Devices, Inc.

Inventor： Goida, Thomas M. ,  Xue, Xiaojie

IPC: H01L29/06 ,  H01L21/78 ,  H01L23/31 ,  H05K1/02 ,  H05K1/18

Abstract: An integrated device die and package is disclosed. The integrated device die includes a unitary body. The unitary body can have an upper portion comprising one or more active components. The upper portion can have first and second opposing lateral sides defining at least a portion of a periphery of the upper portion such that an upper surface of the upper portion is disposed between upper edges of the first and second opposing lateral sides. The unitary body can also have a lower portion monolithically formed with the upper portion. The lower portion can comprise a pedestal extending downwardly from the upper portion. The pedestal can be laterally inset from lower edges of the first and second opposing lateral sides. The pedestal can include a distal end portion configured to couple to a carrier.

Abstract translation: 公开了一种集成器件管芯和封装。 集成器件管芯包括一个整体。 整体可以具有包括一个或多个活性组分的上部部分。 上部可以具有限定上部的周边的至少一部分的第一和第二相对侧边，使得上部的上表面设置在第一和第二相对的侧面的上边缘之间。 整体也可以具有与上部一体地形成的下部。 下部可以包括从上部向下延伸的基座。 基座可以从第一和第二相对侧面的下边缘侧向插入。 基座可以包括配置成联接到托架的远端部分。

公开(公告)号：EP2947692A2

公开(公告)日：2015-11-25

申请号：EP14199059.8

申请日：2014-12-18

Applicant: Analog Devices, Inc.

Inventor： Goida, Thomas M. ,  Xue, Xiaojie

IPC: H01L29/06 ,  H01L21/78 ,  H01L23/31 ,  H05K1/02 ,  H05K1/18

Abstract: An integrated device die and package is disclosed. The integrated device die includes a unitary body. The unitary body can have an upper portion comprising one or more active components. The upper portion can have first and second opposing lateral sides defining at least a portion of a periphery of the upper portion such that an upper surface of the upper portion is disposed between upper edges of the first and second opposing lateral sides. The unitary body can also have a lower portion monolithically formed with the upper portion. The lower portion can comprise a pedestal extending downwardly from the upper portion. The pedestal can be laterally inset from lower edges of the first and second opposing lateral sides. The pedestal can include a distal end portion configured to couple to a carrier.

公开(公告)号：EP2763163A3

公开(公告)日：2015-11-18

申请号：EP14152487.6

申请日：2014-01-24

Applicant: Analog Devices, Inc.

Inventor： Goida, Thomas M. ,  Xue, Xiaojie

IPC: H01L23/04 ,  H01L23/10 ,  H01L23/31 ,  G01P1/02 ,  H01L23/495

CPC classification number: H01L23/49575 ,  G01P1/023 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3107 ,  H01L24/03 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00

Abstract: Various embodiments of an integrated device package are disclosed herein. The package may include a leadframe having a first side and a second side opposite the first side. The leadframe can include a plurality of leads surrounding a die mounting region. A first package lid may be mounted on the first side of the leadframe to form a first cavity, and a first integrated device die may be mounted on the first side of the leadframe within the first cavity. A second integrated device die can be mounted on the second side of the leadframe. At least one lead of the plurality of leads can provide electrical communication between the first integrated device die and the second integrated device die.