摘要:
The present invention relates to a specific polyamide polymer which is obtainable by two specific processes according to the invention. The invention further relates to the use of this polyamide polymer as a functional additive and to detergent compositions, cosmetic compositions, cleaning compositions and adhesive compositions comprising this polyamide polymer.
摘要:
A thermosetting resin composition excellent in dimensional stability during curing and adhesiveness, heat resistance, moist heat resistance, electrical insulating properties, flexibility, low dielectric properties and low dissipation factor properties after curing is provided. A thermosetting resin composition according to the present invention is a thermosetting resin composition containing a polyamide (A) made by polymerization of a polybasic acid monomer and a polyamine monomer and having a phenolic hydroxyl group on a side chain, and a compound (B) with a functionality of three or more that can react with the phenolic hydroxyl group. Monomers that form the polyamide (A) include a monomer having a phenolic hydroxyl group and a monomer having a hydrocarbon group with a carbon number of 20 to 60 (excluding an aromatic ring to which the phenolic hydroxyl group bonds) and having a cyclic structure with a carbon number of 5 to 10.
摘要:
The invention relates to a composition for thermoplastic adhesive, said composition comprising an aqueous dispersion of at least one branched copolyamide with unsaturated ends, in the form of particles such that the volume mean diameter d 50 of said particles is less than or equal to 50µm, and comprising more than 50mol% of amine ends out of the total number of moles of amine and acid ends of said branched copolyamide with unsaturated ends, of which certain of said amine ends are at least partially neutralised by a Bronsted acid made from phosphorus such that the molar ratio between [Bronsted acid]/[amine ends] is between 0.1 and 5, said composition further comprising at least one initiator for crosslinking said 1 branched copolyamide with unsaturated ends. The invention also relates to a preparation method and to the uses for such a composition. The invention finally relates to a method for producing a thermoplastic adhesive and to a method for producing an assembly comprising at least a first part and at least one crosslinked bonded joint obtained using such a thermoplastic adhesive or such a composition.
摘要:
wherein R1-R12 are independently selected from H, alkyl, cycloalkyl, aryl, alkylaryl, or arylalkyl, wherein at least one of R1-R6 and at least one of R7-R12 is different from H, wherein A1-A9 are independently selected from linear or branched alkylenes having 2 to 18 carbon atoms, wherein Z1-Z4 are independently selected OH, CH2CH2CH2NH2, NH2, NHR′ or NR′R″, wherein the degree of amination is
摘要:
Articles including a polymer film, a plasticizer and a substrate are included. A method of bonding the film to the substrate includes the use of the plasticizer which provides a durable bond by using a lower temperatures and shorter bonding times than would be required in the absence of the plasticizer.
摘要:
Heat-activatable adhesive tape, in particular for the production and further processing of electronic components and conductor tracks, comprising an adhesive composition which comprises at least a) a polyamide, which is soluble in ethanol, toluene or mixtures thereof and is formed from at least a heterocyclic diamine of the formula (I)(I), where - Z is an NH group or an aliphatic chain having an NH 2 group at the end, - n and m are each, independently of one another, an integer in the range from 1 to 3, - the radicals R and R’ on each carbon atom in the ring are each, independently of one another, a hydrogen atom or an aliphatic alkyl chain, and an aliphatic dicarboxylic acid having at least 4 carbon atoms and b) a compound containing epoxide groups, where the polyamide reacts with the epoxy resin at temperatures of at least 150°C and the weight ratio of a) to b) is in the range from 50:50 to 99:1.
摘要:
A hot-melt adhesive comprises a resin composition comprising (a) from 0.1 to 50 parts by weight of a polyolefin resin obtained by copolymerizing 80% by weight or more of a non-polar alpha -olefin with 20% by weight or less in total of a monomer containing 5% by weight or more of a carboxyl group and a polar alpha -olefin, or with 20% by weight or less in total of a monomer containing 0.5% by weight or more of an acid anhydride group and a polar alpha -olefin, (b) from 0 to 80 parts by weight of a copolymer of ethylene and a non-polar alpha -olefin, or a polyolefin resin containing 20% by weight or less of a polar alpha -olefin, and (c) from 10 to 90 parts by weight of a polyamide, provided that the total amount of the components (a), (b) and (c) is 100 parts by weight, the resin composition having a melt index of 5 g/10 min or more and less than 500 g/10 min. The hot-melt adhesive resin composition of the invention has excellent adhesiveness to both non-polar and polar adherends. A heat recoverable article using the hot-melt adhesive is valuable for processing a joint and an end of electric cables.