COMPOSITION POUR ADHÉSIF THERMOPLASTIQUE, ADHÉSIF THERMOPLASTIQUE, LEURS PROCÉDÉS DE FABRICATION ET LEURS UTILISATIONS
    3.
    发明公开
    COMPOSITION POUR ADHÉSIF THERMOPLASTIQUE, ADHÉSIF THERMOPLASTIQUE, LEURS PROCÉDÉS DE FABRICATION ET LEURS UTILISATIONS 审中-公开
    组合物POURADHÉSIF热塑性材料,ADHÉSIF热塑性材料,LEURSPROCÉDÉS德制造ET LEURS应用

    公开(公告)号:EP3197974A1

    公开(公告)日:2017-08-02

    申请号:EP15780920.3

    申请日:2015-09-21

    申请人: Arkema France

    摘要: The invention relates to a composition for thermoplastic adhesive, said composition comprising an aqueous dispersion of at least one branched copolyamide with unsaturated ends, in the form of particles such that the volume mean diameter d
    50 of said particles is less than or equal to 50µm, and comprising more than 50mol% of amine ends out of the total number of moles of amine and acid ends of said branched copolyamide with unsaturated ends, of which certain of said amine ends are at least partially neutralised by a Bronsted acid made from phosphorus such that the molar ratio between [Bronsted acid]/[amine ends] is between 0.1 and 5, said composition further comprising at least one initiator for crosslinking said 1 branched copolyamide with unsaturated ends. The invention also relates to a preparation method and to the uses for such a composition. The invention finally relates to a method for producing a thermoplastic adhesive and to a method for producing an assembly comprising at least a first part and at least one crosslinked bonded joint obtained using such a thermoplastic adhesive or such a composition.

    摘要翻译: 本发明涉及一种用于热塑性粘合剂的组合物,所述组合物包含至少一种具有不饱和末端的支化共聚酰胺的水分散体,颗粒形式使得所述颗粒的体积平均直径d50小于或等于50μm,并且 包含多于50摩尔%的胺末端,所述胺的总摩尔数和具有不饱和末端的所述支化共聚酰胺的酸末端中的胺末端,其中某些所述胺末端至少部分地被由磷制成的布朗斯台德酸中和,使得 [布朗斯台德酸] / [胺末端]之间的摩尔比在0.1和5之间,所述组合物进一步包含至少一种用于交联所述具有不饱和末端的1支化共聚酰胺的引发剂。 本发明还涉及一种制备方法和这种组合物的用途。 本发明最后涉及一种用于生产热塑性粘合剂的方法和一种用于生产包括至少第一部分和使用这种热塑性粘合剂或这种组合物获得的至少一个交联粘合接头的组件的方法。

    HITZEAKTIVIERBARES KLEBEBAND INSBESONDERE FÜR DIE VERKLEBUNG VON ELEKTRONISCHEN BAUTEILEN UND LEITERBAHNEN
    9.
    发明公开
    HITZEAKTIVIERBARES KLEBEBAND INSBESONDERE FÜR DIE VERKLEBUNG VON ELEKTRONISCHEN BAUTEILEN UND LEITERBAHNEN 有权
    HITZEAKTIVIERBARES KLEBEBAND INSBESONDEREFÜRDIE VERKLEBUNG VON ELEKTRONISCHEN BAUTEILEN UND LEI​​TERBAHNEN

    公开(公告)号:EP2324088A1

    公开(公告)日:2011-05-25

    申请号:EP09782197.9

    申请日:2009-08-26

    申请人: TESA SE

    IPC分类号: C09J7/00 C09J177/06

    摘要: Heat-activatable adhesive tape, in particular for the production and further processing of electronic components and conductor tracks, comprising an adhesive composition which comprises at least a) a polyamide, which is soluble in ethanol, toluene or mixtures thereof and is formed from at least a heterocyclic diamine of the formula (I)(I), where - Z is an NH group or an aliphatic chain having an NH
    2 group at the end, - n and m are each, independently of one another, an integer in the range from 1 to 3, - the radicals R and R’ on each carbon atom in the ring are each, independently of one another, a hydrogen atom or an aliphatic alkyl chain, and an aliphatic dicarboxylic acid having at least 4 carbon atoms and b) a compound containing epoxide groups, where the polyamide reacts with the epoxy resin at temperatures of at least 150°C and the weight ratio of a) to b) is in the range from 50:50 to 99:1.

    摘要翻译: 可热活化的胶带,特别用于生产和进一步处理电子部件和印制导线,包括粘合剂组合物,其包含至少a)可溶于乙醇,甲苯或其混合物的聚酰胺,并且至少由 式(I)(I)的杂环二胺,其中-Z是NH基团或在末端具有NH 2基团的脂族链,-n和m各自彼此独立地为在该范围内的整数 - 环中每个碳原子上的基团R和R'各自彼此独立地为氢原子或脂族烷基链和具有至少4个碳原子的脂族二羧酸,和b) 含有环氧基团的化合物,其中聚酰胺与环氧树脂在至少150℃的温度下反应并且a)与b)的重量比在50:50至99:1的范围内。