摘要:
The subject of the present invention is the use of a porous or non-porous organosilicon material for eliminating radionuclides, mineral anions, anionic molecular entities and negatively charged dyes or active principles from an aqueous solution, characterized in that the structure of said organosilicon material is formed of repeat units, each repeat unit comprising at least one positively charged entity selected from an ammonium entity, an imidazolium entity, a guanidinium entity, a pyridinium entity and a phosphonium entity and being incorporated into a silicon network by at least two silicon-carbon bonds. The invention also relates to a specific novel organosilicon material, comprising at least one benzyl group, one 4‑phenylbenzyl group or one styrene group in each repeat unit.
摘要:
Novel block copolymers comprising at least one (poly)2-C1-3alkyl-2-oxazoline block and at least one (poly)dimethyl siloxane block, having at least one end group X which includes both an —NH2 group and an —NH— group, have been found to be particularly suitable for forming vesicles. The vesicles may be used to form filtration membranes.
摘要:
Disclosed herein are inventive blocky cationic organopolysiloxanes and consumer product compositions comprising such organopolysiloxanes. Such compositions can deposit effectively onto target substrates to deliver consumer-desired benefits such as conditioning, anti-wrinkle, softness, and anti-static.
摘要:
The invention provide a class of actinically-crosslinkable amphiphilic prepolymers which comprise at least one polysiloxane segment, at least one polyoxazoline segment, and two terminal ene groups. The present invention is also related to a medical device comprising a silicone hydrogel material obtained from step-growth polymerization of a polymerizable material comprising a prepolymer of the invention and to a method for producing contact lenses from a prepolymer of the invention.
摘要:
Provided are a process for producing a compatibilized resin including reacting a cyanate compound, a siloxane resin having a hydroxyl group at an end thereof, and an epoxy resin at a specified rate of reaction; a thermosetting resin composition containing (A1) a compatibilized resin produced by the foregoing process or (A2) a thermosetting resin obtained by reacting a cyanate compound and a siloxane resin having a hydroxyl group at an end thereof at a specified rate of reaction, and (B) fused silica having been subjected to a surface treatment with a trimethoxysilane compound; and a prepreg, a laminate, and a wiring board each using the same. The foregoing thermosetting resin composition is excellent in terms of all of low thermal expansion, adhesiveness to copper foil, heat resistance, flame retardancy, copper-clad heat resistance (T-300), dielectric characteristics, and drillability, achieves the high density and high reliability of wiring boards required at present, and can be widely used for production of electronic appliances and the like.
摘要:
The present application relates to organosilicones and compositions such as consumer products comprising such organosilicones, as well as processes for making and using such organosilicones and such compositions. Such compositions comprising such organosilicones are easier to formulate, and provide more economical and superior care benefits when compared to current silicone containing compositions.