PRIMER COMPOSITION, BONDING METHOD, AND ELECTRIC/ELECTRONIC COMPONENT

    公开(公告)号:EP3275955A4

    公开(公告)日:2018-08-01

    申请号:EP16754994

    申请日:2016-02-23

    IPC分类号: C09D183/10 C09D5/00 C09D7/40

    摘要: The primer composition of the present invention comprises: (A) an organosiloxane block copolymer represented by the average unit formula: (R 1 2 SiO 2/2 ) a (R 2 SiO 3/2 ) b , wherein each R 1 and R 2 is independently an alkyl group having a carbon number of 1 to 12, an aryl group having a carbon number of 6 to 20, or an aralkyl group having a carbon number of 7 to 20, "a" is a number in the range of 0.40 to 0.90, "b" is a number in the range of 0.10 to 0.60, and "a + b" = 1.00, and having 0.5 to 35.0 mol% of silicon atom-bonded hydroxyl groups or silicon atom-bonded alkoxy groups, in which resinous siloxane blocks are connected by linear siloxane blocks; (B) a curing catalyst; and (C) an organic solvent. The primer composition of the present invention improves the adhesion of silicone cured products to base materials of optical semiconductor elements, package materials, substrates etc., and can suppress peeling or cracking of said silicone cured products caused by heat cycles.