公开(公告)号：EP4223714B1

公开(公告)日：2024-09-25

申请号：EP22172222.6

申请日：2022-05-09

IPC分类号： C03C17/10 ,  G02B5/08 ,  C23C18/28 ,  C23C18/18

CPC分类号： C03C17/10 ,  C03C2217/26820130101 ,  C03C2218/1120130101 ,  C23C18/285 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/42 ,  C23C18/208 ,  C23C18/2086

公开(公告)号：EP2959036A1

公开(公告)日：2015-12-30

申请号：EP14713167.6

申请日：2014-02-21

申请人： Alchimer

发明人： MEVELLEC, Vincent ,  SUHR, Dominique

IPC分类号： C23C18/18 ,  C23C18/16 ,  C23C18/34 ,  C23C18/36 ,  H01L21/28 ,  H01L21/288 ,  C23C18/54

CPC分类号： H01L21/28518 ,  C23C18/1607 ,  C23C18/1639 ,  C23C18/1642 ,  C23C18/1692 ,  C23C18/1696 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/34 ,  C23C18/36 ,  C23C18/54 ,  H01L21/28052 ,  H01L21/288 ,  H01L21/32053 ,  H01L31/022425

摘要： The invention concerns a method for forming nickel silicide or cobalt silicide comprising the steps consisting of: - exposing the surface of a substrate comprising silicon to an aqueous solution containing 0.1 mM to 10 mM of gold ions and 0.6 M to 3.0 M of fluorine ions for a time period of between 5 seconds and 5 minutes, - depositing a layer consisting essentially of nickel or of cobalt on the activated substrate by electroless means, - applying a rapid thermal treatment at a temperature of between 300°C and 750°C, so as to form nickel silicide or cobalt silicide. The aqueous solution contains a surfactant chosen from the compounds comprising at least one anionic or nonionic polar group and an alkyl chain comprising 10 to 16 carbon atoms. This method can be applied, essentially, to the production of NAND memories and photovoltaic cells.

公开(公告)号：EP2912211A1

公开(公告)日：2015-09-02

申请号：EP13849628.6

申请日：2013-10-24

申请人： BYD Company Limited

发明人： Gong, Qing ,  Zhou, Wei ,  Lin, Xinping ,  Miao, Weifeng ,  Chen, Xiaofang

IPC分类号： C23C18/30 ,  C23C18/54

CPC分类号： H05K3/185 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1868 ,  C23C18/1882 ,  C23C18/204 ,  C23C18/2066 ,  H05K1/0373 ,  H05K3/188 ,  Y10T428/24917

摘要： A coating composition, a composite prepared by using the coating composition and a method for preparing the composite are provided. The coating composition includes a solvent, an adhesive, and a catalyst precursor including at least one selected from a group consisting of SnO
2 , ZnSnO
3 and ZnTiO
3 .

公开(公告)号：EP2791388A4

公开(公告)日：2015-08-19

申请号：EP12856639

申请日：2012-03-08

申请人： HENKEL IP & HOLDING GMBH

发明人： CAO JIE ,  HUANG WENHUA ,  XIAO ALLISON YUE

IPC分类号： C23C18/31 ,  C01B31/02 ,  C23C16/06 ,  C23C18/16 ,  C23C18/18 ,  C23C18/44 ,  C23C18/54 ,  H01B1/02 ,  H01B13/00

CPC分类号： H01B13/0026 ,  C23C18/1635 ,  C23C18/1658 ,  C23C18/1882 ,  C23C18/1889 ,  C23C18/44 ,  H01B1/02

摘要： A one-pot process for the electroless-plating of silver onto graphite powder is disclosed. No powder pretreatment steps for the graphite, which typically require filtration, washing or rinsing, are required. The inventive process comprises mixing together three reactant compositions in water: an aqueous graphite activation composition comprising graphite powder and a functional silane, a silver-plating composition comprising a silver salt and a silver complexing agent, and a reducing agent composition.

公开(公告)号：EP2847363A2

公开(公告)日：2015-03-18

申请号：EP13723721.0

申请日：2013-05-07

申请人： Cuptronic Technology Ltd.

发明人： GÖTHE, Sven ,  ATTHOFF, Björn

IPC分类号： C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  C23C18/18

CPC分类号： B05D7/548 ,  B05D3/06 ,  B05D5/00 ,  C08J7/045 ,  C08J2355/02 ,  C08J2369/00 ,  C08J2433/02 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/182 ,  C23C18/1844 ,  C23C18/1868 ,  C23C18/1882 ,  C23C18/2006 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/30 ,  Y10T428/24355

摘要： A process for application of metal on a substrate surface comprises applying a mixture of a solvent, a polymerizable monomer, and a photoinitiator on a substrate surface, wherein the photoinitiator does not form two phases together with the monomer and the solvent, i.e. it forms an amorphous mixture without any crystals. The monomer is able to polymerize to a polymer comprising at least one carboxylic group. Thereafter the solvent is evaporated. Polymerization is induced by irradiating the applied dried mixture. Ions are applied and reduced to metal and thereafter further metal can be deposited. The method can be used in industrial processes, both 2D and 3D surfaces can be coated with metal. Materials sensitive to standard grafting chemicals and/or polymers containing halogen atoms can be coated.

公开(公告)号：EP2698448A1

公开(公告)日：2014-02-19

申请号：EP12772017.5

申请日：2012-04-11

申请人： Nissan Chemical Industries, Ltd.

发明人： KOJIMA, Keisuke

IPC分类号： C23C18/18 ,  C08F12/14 ,  C08G61/00

CPC分类号： C09D125/06 ,  C08F12/26 ,  C08F12/30 ,  C08F12/32 ,  C08F2438/03 ,  C08G83/006 ,  C08J7/047 ,  C08J2367/02 ,  C08J2400/202 ,  C08L101/005 ,  C23C18/1608 ,  C23C18/1831 ,  C23C18/1834 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/285 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C23C18/52 ,  Y10T428/12063

摘要： There is provided a novel, environmentally friendly primer for use in the pretreatment steps in electroless plating, which can be easily used in fewer steps with a lower cost. A primer for forming a metallic plating film on a substrate by electroless plating, the primer comprising: a hyperbranched polymer having an ammonium group at a molecular terminal and a weight-average molecular weight of 500 to 5,000,000; and a metal fine particle.

摘要翻译： 提供了一种用于化学镀中的预处理步骤的新型环保底漆，其可以以较低成本容易地以较少的步骤使用。 一种用于通过无电解电镀在基板上形成金属镀膜的底漆，所述底漆包括：在分子末端具有铵基并且重均分子量为500至5,000,000的超支化聚合物; 和金属微粒。

公开(公告)号：EP1538237B1

公开(公告)日：2009-09-30

申请号：EP03788697.5

申请日：2003-08-05

申请人： Nippon Mining & Metals Co., Ltd.

发明人： IMORI, Toru, c/o Nikko Materials Co., Ltd. ,  YABE, Atsushi, c/o Nikko Materials Co., Ltd.

IPC分类号： C23C18/18

CPC分类号： C23C18/1879 ,  C23C18/1882 ,  C23C18/31 ,  C23C18/40

摘要： A method for metal plating, characterized in that it comprises admixing or reacting a noble metal compound and an organic acid salt of a silane coupling agent having an azole moiety in a molecule thereof, such as a coupling agent which is an equimolar reaction product of imidazole with gamma-glycidoxypropyltrialkoxysilane, to form a fluid, subjecting an article to be treated to a surface treatment with the fluid, and then subjecting the resultant article to electroless plating. The method allows the metal plating of a resin or the like which cannot be metal-plated by a conventional method, with an easy and simple manner.

公开(公告)号：EP1760171A4

公开(公告)日：2008-01-23

申请号：EP04799625

申请日：2004-11-11

申请人： NIPPON MINING CO

发明人： KAWAMURA TOSHIFUMI ,  SUZUKI JUN ,  IMORI TORU

IPC分类号： C23C18/18 ,  C23C18/28

CPC分类号： C23C18/31 ,  C23C18/1651 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/2066 ,  C23C18/30

摘要： A pretreating agent for electroless plating that is soluble in organic solvents and is stable; a method of electroless plating realizing excellent adhesion wherein use is made of the pretreating agent; and a product of electroless plating. Plating object is pretreated with a pretreating agent for electroless plating, comprising a noble metal soap of C5-C25 fatty acid, preferably further comprising a silane coupling agent with metal trapping capability, such as an imidazole silane coupling agent, and subjected to electroless plating. Palladium soap is preferably used as the noble metal soap.

公开(公告)号：EP1629703A1

公开(公告)日：2006-03-01

申请号：EP04738625.5

申请日：2004-06-04

申请人： JENOPTIK Automatisierungstechnik GmbH

发明人： SCHRÖDNER, Mario ,  ROTH, Hans-Klaus ,  NASMUTDINOVA, Gulnara

IPC分类号： H05K3/18 ,  C23C18/16

CPC分类号： C23C18/1608 ,  C23C18/1612 ,  C23C18/182 ,  C23C18/1831 ,  C23C18/1834 ,  C23C18/1851 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/24 ,  C23C18/30 ,  H05K3/185 ,  H05K2203/121

摘要： The invention relates to a method for producing highly adhesive conductive structures on non-conductive supports, especially for use in electric circuits, and a surface activating compound which is used in said method. The inventive method comprises the following steps: a surface activating compound is applied and is selectively irradiated; and the irradiated areas are then metal-coated in a currentless manner so as to form metallic structures.

公开(公告)号：EP0647729B1

公开(公告)日：1997-06-18

申请号：EP94202868.9

申请日：1994-10-04

申请人： PHILIPS ELECTRONICS N.V.

发明人： Willard, Nicolaas Petrus ,  van den Boogaard, Henricus Johannes Adrianus P. ,  van den Brekel, Cornelis Hendricus Joannes ,  van der Sluis-van der Voort, Elisabeth

IPC分类号： C23C18/16

CPC分类号： B82Y30/00 ,  C23C18/1612 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/1893 ,  G02F1/133512 ,  H05K3/185