摘要:
The invention relates to a resistless lithography method for producing fine structures. According to said method, a semiconductor mask layer (HM) is formed on a carrier material (TM, HM'), and a selective ion implantation (I) is carried out in order to dope selected regions (1) of the semiconductor mask layer (HM). A semiconductor mask which can be used for further structuring is obtained by removing the non-doped regions of the semiconductor mask layer (HM) by means of a wet-chemical process. The invention thus provides a simple and highly precise resistless lithography method for producing structures smaller than 100 nm.
摘要:
A medium is retained in the predetermined mutual spaced relation in a gap between two plane faces on respective bodies. The bodies are mutually displaceable in a direction substantially perpendicular to the gap and biassed in the direction of displacement. One of the bodies is connected with a compressed air source providing through a plurality of outlets in the plane face of the respective body an air cushion between the face and the medium.
摘要:
An apparatus for the illumination of points on a medium comprises a perforated wall which is illuminated by substantially collimated optical energy at a centre wavelength (μ). The optical energy passes through the perforations and illuminates the medium which is arranged at a distance (L) therefrom. The perforations have a cross section such that the optical energy is diffracted, and diverging bundles of rays are created. The medium is located in a region around the transition between the Fresnel region and the Fraunhofer region of the bundles of rays. Points on the surface of the medium are illuminated selectively by a source of light through a large number of illumination channels. Each of these channels comprises an optical lens element for intensifying the optical energy received from the light source, a selectively controlled optical valve permitting or preventing optical energy from propagating through the channel, and a channel outlet which, together with the other elements in the means, defines the size of the point formed by the channel. The channels are controlled individually by the central control unit, which is electrically connected to each of the selectively controlled optical valves for selective control of the energy transmission of each channel.
摘要:
The invention relates to a resistless lithography method for producing fine structures. According to said method, a semiconductor mask layer (HM) is formed on a carrier material (TM, HM'), and a selective ion implantation (I) is carried out in order to dope selected regions (1) of the semiconductor mask layer (HM). A semiconductor mask which can be used for further structuring is obtained by removing the non-doped regions of the semiconductor mask layer (HM) by means of a wet-chemical process. The invention thus provides a simple and highly precise resistless lithography method for producing structures smaller than 100 nm.
摘要:
A medium is retained in the predetermined mutual spaced relation in a gap between two plane faces on respective bodies. The bodies are mutually displaceable in a direction substantially perpendicular to the gap and biassed in the direction of displacement. One of the bodies is connected with a compressed air source providing through a plurality of outlets in the plane face of the respective body an air cushion between the face and the medium.
摘要:
Das Verfahren zur Herstellung von photostrukturierten Schichten durch Belichtung eines positiv arbeitenden Photoresists durch ein lichtundurchlässiges, gelochtes Material erspart die aufwendige Herstellung von Filmvorlagen für Lötstopplacke.
摘要:
A method irradiates a wafer and an apparatus provides for a wafer to be irradiated. A plurality of radiation emitters emit radiation. A mask permits a portion of the electromagnetic radiation from the plurality of radiation emitters to pass and blocks a further portion of said electromagnetic radiation from passing.
摘要:
An apparatus for the illumination of points on a medium comprises a perforated wall which is illuminated by substantially collimated optical energy at a centre wavelength (μ). The optical energy passes through the perforations and illuminates the medium which is arranged at a distance (L) therefrom. The perforations have a cross section such that the optical energy is diffracted, and diverging bundles of rays are created. The medium is located in a region around the transition between the Fresnel region and the Fraunhofer region of the bundles of rays. Points on the surface of the medium are illuminated selectively by a source of light through a large number of illumination channels. Each of these channels comprises an optical lens element for intensifying the optical energy received from the light source, a selectively controlled optical valve permitting or preventing optical energy from propagating through the channel, and a channel outlet which, together with the other elements in the means, defines the size of the point formed by the channel. The channels are controlled individually by the central control unit, which is electrically connected to each of the selectively controlled optical valves for selective control of the energy transmission of each channel.
摘要:
Ce procédé se caractérise en ce qu'il consiste à choisir la longueur d'onde de l'onde plane incidente pour qu'il n'existe que deux ordres diffractés pour chacun des deux demi-espaces qui sont situés de part et d'autre du plan moyen du masque, et à régler l'angle d'incidence de l'onde plane de telle sorte que l'ordre diffracté réfléchi qui n'est pas l'ordre spéculairement réfléchi se propage dans la direction de l'onde incidente mais en sens inverse. Circuits intégrés, lignes de retard, photolithogravure.
摘要:
The present invention relates to a method of forming a desired pattern on a substrate comprising the steps of a) generating an atomic or molecular beam, in particular a beam of He atoms; b) providing a mask having a desired pattern such as a Fourier transform of the desired pattern on the substrate; c) directing the atomic or molecular beam through the patterned mask onto a substrate, whereby a pattern is formed on the substrate by interaction with the proportion of the atomic or molecular beam which penetrates through the mask, which pattern is based on the pattern of the mask, wherein the patterned mask is prepared by a method comprising d) providing a porous starting mask material having openings of a size which allow the atomic or molecular beam to penetrate through; e) creating the desired pattern on the mask by filling a proportion of the openings of the mask which thereby become non-transparent for the atomic or molecular beam. The method of the present invention is useful for preparing conducting circuit structures (micro-chips) or microelectromechanical systems (MEMS) or structures for micro/nano fluidics or nanostructured surfaces in general, ie. hydrophobic or hydrophilic surfaces or reflective/antireflective surfaces.