公开(公告)号：EP3160734A4

公开(公告)日：2018-03-14

申请号：EP15814784

申请日：2015-06-29

申请人： IMMUNOLIGHT LLC

发明人： FATHI ZAKARYAE ,  BOURKE FREDERIC A JR ,  WALDER HAROLD

IPC分类号： C09J5/02 ,  B32B5/02 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B25/10 ,  B32B25/12 ,  B32B25/14 ,  C09J4/00 ,  C09J7/00 ,  C09J107/00 ,  C09J121/00

CPC分类号： B32B7/12 ,  B32B5/024 ,  B32B7/06 ,  B32B15/08 ,  B32B25/10 ,  B32B25/12 ,  B32B25/14 ,  B32B2307/748 ,  B32B2437/00 ,  B32B2457/14 ,  C08F2/48 ,  C08K3/00 ,  C09J4/00 ,  C09J5/02 ,  C09J7/10 ,  C09J107/00 ,  C09J121/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/31 ,  C09J2400/22 ,  C09J2407/00 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/0383 ,  H01L2224/03831 ,  H01L2224/04026 ,  H01L2224/05791 ,  H01L2224/05887 ,  H01L2224/2711 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/27436 ,  H01L2224/27618 ,  H01L2224/27622 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/83009 ,  H01L2224/83591 ,  H01L2224/83687 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/94 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781

摘要： A method of and system for adhesive bonding. The method and system a) treat a surface of an element to be bonded to provide an adherent structure including one or more rubber compounds on the surface; b) place a polymerizable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with the adherent structure and two or more components to be bonded to form an assembly, c) irradiated the assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material, to a second wavelength capable of activating the at least one photoinitiator to produce from the polymerizable adhesive composition a cured adhesive composition; and d) adhesively join the two or more components by way of the adherent structure and the cured adhesive composition.

公开(公告)号：EP2606509A4

公开(公告)日：2015-09-16

申请号：EP11819399

申请日：2011-08-16

申请人： BYD CO LTD ,  SHENZHEN BYD AUTO R & D CO LTD

发明人： LIU YINGCE ,  HUO DONGMING ,  SUN TIANBAO

IPC分类号： H01L21/58 ,  H01L33/40

CPC分类号： H01L33/40 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/0079 ,  H01L33/641 ,  H01L2224/04026 ,  H01L2224/05073 ,  H01L2224/05138 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/27472 ,  H01L2224/27622 ,  H01L2224/27831 ,  H01L2224/29011 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29138 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83345 ,  H01L2224/83805 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29018 ,  H01L2924/00012 ,  H01L2924/01014 ,  H01L2924/01048 ,  H01L2924/01034

公开(公告)号：EP3160734A1

公开(公告)日：2017-05-03

申请号：EP15814784.3

申请日：2015-06-29

申请人： Immunolight, LLC.

发明人： FATHI, Zakaryae ,  BOURKE, Frederic A. Jr. ,  WALDER, Harold

IPC分类号： B32B7/12

CPC分类号： B32B7/12 ,  B32B5/024 ,  B32B7/06 ,  B32B15/08 ,  B32B25/10 ,  B32B25/12 ,  B32B25/14 ,  B32B2307/748 ,  B32B2437/00 ,  B32B2457/14 ,  C08F2/48 ,  C08K3/00 ,  C09J4/00 ,  C09J5/02 ,  C09J7/10 ,  C09J107/00 ,  C09J121/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/31 ,  C09J2400/22 ,  C09J2407/00 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/0383 ,  H01L2224/03831 ,  H01L2224/04026 ,  H01L2224/05791 ,  H01L2224/05887 ,  H01L2224/2711 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/27436 ,  H01L2224/27618 ,  H01L2224/27622 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/83009 ,  H01L2224/83591 ,  H01L2224/83687 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/94 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781

摘要： A method of and system for adhesive bonding. The method and system a) treat a surface of an element to be bonded to provide an adherent structure including one or more rubber compounds on the surface; b) place a polymerizable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with the adherent structure and two or more components to be bonded to form an assembly, c) irradiated the assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material, to a second wavelength capable of activating the at least one photoinitiator to produce from the polymerizable adhesive composition a cured adhesive composition; and d) adhesively join the two or more components by way of the adherent structure and the cured adhesive composition.

摘要翻译： 粘合剂粘合的方法和系统。 该方法和系统a）处理要粘合的元件的表面以提供在表面上包括一种或多种橡胶化合物的粘合结构; b）将包含至少一种光引发剂和至少一种能量转换材料的可聚合粘合剂组合物放置成与粘附结构和待粘合的两种或更多种组分接触以形成组件，c）用辐射在第一 波长，能够被所述至少一种能量转换材料转化为能够激活所述至少一种光引发剂的第二波长，以从所述可聚合粘合剂组合物产生固化的粘合剂组合物; 和d）通过粘附结构和固化的粘合剂组合物粘合地连接两种或更多种组分。

公开(公告)号：EP2606509A1

公开(公告)日：2013-06-26

申请号：EP11819399.4

申请日：2011-08-16

申请人： BYD Company Limited ,  Shenzhen BYD Auto R&D Company Limited

发明人： LIU, Yingce ,  HUO, Dongming ,  SUN, Tianbao

IPC分类号： H01L21/58 ,  H01L33/48

CPC分类号： H01L33/40 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/0079 ,  H01L33/641 ,  H01L2224/04026 ,  H01L2224/05073 ,  H01L2224/05138 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/27472 ,  H01L2224/27622 ,  H01L2224/27831 ,  H01L2224/29011 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29138 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83345 ,  H01L2224/83805 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29018 ,  H01L2924/00012 ,  H01L2924/01014 ,  H01L2924/01048 ,  H01L2924/01034

摘要： A semiconductor chip assembly and a method for forming the same are provided. The semiconductor chip assembly comprises: a semiconductor chip (20), a substrate (10), a first layer (203) formed on a surface of the substrate (10), in which one of the first layer (203) and the second layer (204) has an opening (205) therein; and a second layer (204) formed on a surface of the semiconductor chip (20) and connected to the first layer (203) by eutectic bonding.