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1.发明公开Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same 审中-公开导电粘合剂材料，方法与材料和半导体器件键合，这已经被胶合到它
公开(公告)号：EP2278032A2
公开(公告)日：2011-01-26
申请号：EP10004458.5
申请日：2010-04-27
发明人： Yasuda, Yuusuke , Morita, Toshiaki , Ide, Eiichi , Inada, Teiichi
CPC分类号： B22F1/0074 , C22C1/05 , H01B1/22 , H01L21/565 , H01L23/049 , H01L23/10 , H01L23/13 , H01L23/142 , H01L23/15 , H01L23/24 , H01L23/3107 , H01L23/3121 , H01L23/34 , H01L23/3735 , H01L23/488 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L23/498 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/05147 , H01L2224/05639 , H01L2224/05655 , H01L2224/27334 , H01L2224/29005 , H01L2224/2901 , H01L2224/29078 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29163 , H01L2224/29164 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29173 , H01L2224/29176 , H01L2224/29178 , H01L2224/29181 , H01L2224/29184 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29309 , H01L2224/29311 , H01L2224/29318 , H01L2224/29324 , H01L2224/29338 , H01L2224/29339 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29363 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/29373 , H01L2224/29376 , H01L2224/29378 , H01L2224/29381 , H01L2224/29384 , H01L2224/29387 , H01L2224/29893 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48739 , H01L2224/48755 , H01L2224/48839 , H01L2224/48855 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/83065 , H01L2224/83075 , H01L2224/832 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/15153 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/3511 , H01L2924/0541 , H01L2924/0501 , H01L2924/00014 , H01L2924/01001 , H01L2924/01018 , H01L2924/01007 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2924/2076 , H01L2924/01202 , H01L2224/83205
摘要： The present invention provides a bonding material and a method of bonding for metal bonding at a bonding interface capable of a higher bonding strength at a lower temperature without application of pressure, compared to a bonding material of metal particles having an average particle size of not greater than 100 nm. An electrically conductive bonding material including (A) silver particles (202), (B) silver oxide (203), and (C) a dispersant including organic material containing not more than 30 carbon atoms as essential components, wherein a total amount of (A) the silver powder, (B) the silver oxide powder, and (C) the dispersant including an organic material containing not more than 30 carbon atoms is in a range of 99.0% to 100% by weight, is provided. In other words, no resin binder is contained.
摘要翻译： 本发明提供的接合材料和接合在能够在没有施压情况下的较低温度高的接合强度的接合界面的金属接合的方法，相比于金属颗粒具有上的不大于平均粒径的接合材料 小于100nm。导电接合材料包括：（a）银颗粒（202），（B）氧化银（203），和（C）的分散剂包含含有不超过30个碳原子作为基本组分的有机材料，worin一个 在由100％的范围内的99.0％重量，提供的总量（A）的银粉末，（B）的氧化银粉末，和（C）的分散剂包含含有不超过30个碳原子的有机材料的 ， 换句话说，没有树脂粘合剂含有。
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公开(公告)号：EP2942129B1
公开(公告)日：2017-07-05
申请号：EP14167030.7
申请日：2014-05-05
发明人： Nachreiner, Jens
CPC分类号： H01L24/83 , B22F1/0055 , B22F1/0062 , B22F7/08 , B22F2001/0066 , H01B1/023 , H01B1/026 , H01B1/22 , H01L24/29 , H01L2224/29124 , H01L2224/29138 , H01L2224/29163 , H01L2224/29294 , H01L2224/293 , H01L2224/8384 , H01L2924/13055 , H01L2924/00
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3.发明公开Electrically conductive bonding material and method of bonding with the same 审中-公开导电粘合剂材料，方法与材料和半导体器件键合，这已经被胶合到它
公开(公告)号：EP2722410A1
公开(公告)日：2014-04-23
申请号：EP13192408.6
申请日：2010-04-27
发明人： YASUDA, Yuusuke , MORITA, Toshiaki , IDE, Eiichi , INADA, Teiichi
CPC分类号： B22F1/0074 , C22C1/05 , H01B1/22 , H01L21/565 , H01L23/049 , H01L23/10 , H01L23/13 , H01L23/142 , H01L23/15 , H01L23/24 , H01L23/3107 , H01L23/3121 , H01L23/34 , H01L23/3735 , H01L23/488 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L23/498 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/05147 , H01L2224/05639 , H01L2224/05655 , H01L2224/27334 , H01L2224/29005 , H01L2224/2901 , H01L2224/29078 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29163 , H01L2224/29164 , H01L2224/29166 , H01L2224/29169 , H01L2224/29171 , H01L2224/29173 , H01L2224/29176 , H01L2224/29178 , H01L2224/29181 , H01L2224/29184 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29309 , H01L2224/29311 , H01L2224/29318 , H01L2224/29324 , H01L2224/29338 , H01L2224/29339 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29363 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/29371 , H01L2224/29373 , H01L2224/29376 , H01L2224/29378 , H01L2224/29381 , H01L2224/29384 , H01L2224/29387 , H01L2224/29893 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48739 , H01L2224/48755 , H01L2224/48839 , H01L2224/48855 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/83065 , H01L2224/83075 , H01L2224/832 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/15153 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/3511 , H01L2924/0541 , H01L2924/0501 , H01L2924/00014 , H01L2924/01001 , H01L2924/01018 , H01L2924/01007 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2924/2076 , H01L2924/01202 , H01L2224/83205
摘要： According to the present invention an electrically conductive bonding material comprises silver particles (202), silver oxides particles (203), a dispersant comprising an organic material containing not more than 30 carbon atoms, and an organic solvent having a boiling point of not higher than 350°C as essential components. The total amount of the silver particles (202), the silver oxide particles (203), the dispersant, and the organic solvent is 100 mass parts and an amount of the organic solvent is not more than 90 mass parts. The silver particles (202) are in flake form; and the total amount of the silver particles (202), the silver oxide particles (203), the dispersant, and the organic solvent is in a range of 99.0% to 100% by weight.
摘要翻译： 。根据导电接合材料的本发明包括银颗粒（202），银氧化物粒子（203），分散剂包括含有不超过30碳原子的有机材料，和在有机溶剂中具有不高于沸点 350℃作为必须成分。 银粒子（202）的总量中，氧化物的银颗粒（203），分散剂，有机溶剂为100质量份，并且对有机溶剂的量不超过90质量份。 银粒子（202）是薄片形式; 和银颗粒（202）的总量中，氧化物的银颗粒（203），分散剂，有机溶剂是在由范围为99.0％至100％重量。
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公开(公告)号：EP2389337A4
公开(公告)日：2016-09-07
申请号：EP10738898
申请日：2010-01-13
发明人： MONTEZ RUBEN B , PAMATAT ALEX P
CPC分类号： H01L23/10 , B81B2207/097 , B81C1/00269 , B81C2203/0109 , B81C2203/019 , H01L21/50 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2224/02 , H01L2224/022 , H01L2224/036 , H01L2224/0391 , H01L2224/04026 , H01L2224/05558 , H01L2224/05572 , H01L2224/05638 , H01L2224/2745 , H01L2224/27452 , H01L2224/2746 , H01L2224/276 , H01L2224/29013 , H01L2224/29016 , H01L2224/29083 , H01L2224/29111 , H01L2224/29117 , H01L2224/29124 , H01L2224/29138 , H01L2224/29144 , H01L2224/29155 , H01L2224/29157 , H01L2224/29166 , H01L2224/29169 , H01L2224/29181 , H01L2224/29184 , H01L2224/32145 , H01L2224/32225 , H01L2224/32502 , H01L2224/32506 , H01L2224/83193 , H01L2224/83203 , H01L2224/83411 , H01L2224/83424 , H01L2224/83444 , H01L2224/83455 , H01L2224/83457 , H01L2224/83466 , H01L2224/83469 , H01L2224/83481 , H01L2224/83484 , H01L2224/83805 , H01L2224/94 , H01L2924/10157 , H01L2924/15159 , H01L2924/164 , H01L2924/01032 , H01L2924/01014 , H01L2924/01029 , H01L2924/00014 , H01L2924/00012 , H01L2224/83
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公开(公告)号：EP2942129A1
公开(公告)日：2015-11-11
申请号：EP14167030.7
申请日：2014-05-05
发明人： Nachreiner, Jens
CPC分类号： H01L24/83 , B22F1/0055 , B22F1/0062 , B22F7/08 , B22F2001/0066 , H01B1/023 , H01B1/026 , H01B1/22 , H01L24/29 , H01L2224/29124 , H01L2224/29138 , H01L2224/29163 , H01L2224/29294 , H01L2224/293 , H01L2224/8384 , H01L2924/13055 , H01L2924/00
摘要： Metallpaste enthaltend (A) 75 bis 90 Gew.-% wenigstens eines Metalls, das in Form von Partikeln vorliegt, die ein Coating aufweisen, das wenigstens eine organische Verbindung enthält, (B) 0 bis 12 Gew.-% wenigstens eines Metallprecursors, (C) 6 bis 20 Gew.-% eines Gemischs mindestens zweier organischer Lösemittel und (D) 0 bis 10 Gew.-% wenigstens eines Sinterhilfsmittels, dadurch gekennzeichnet, dass das Lösemittelgemisch (C) zu 30 bis 60 Gew.-% aus mindestens einem mit Ausnahme einer Methylsubsitution am vorletzten C-Atom unsubstituierten 1-Hydroxyalkan mit 16-20 C-Atomen besteht.
摘要翻译： 本发明涉及一种含有（A）至少一种重量百分比为75-90％重量的金属的金属糊料，其颗粒形式包括含有至少一种有机化合物的涂层，（B）0-12重量％ 至少一种金属前体，（C）至少两种有机溶剂的混合物重量的6-20％和（D）至少一种辅助烧结剂重量的（D）0-10％，其特征在于溶剂混合物（C） 含有至多一种具有16-20个C原子的至少一个未取代的1-羟基烷烃重量的至多30-60％，除了倒数第二个C原子的甲基取代之外。
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公开(公告)号：EP2389337A2
公开(公告)日：2011-11-30
申请号：EP10738898.5
申请日：2010-01-13
发明人： MONTEZ, Ruben B. , PAMATAT, Alex P.
CPC分类号： H01L23/10 , B81B2207/097 , B81C1/00269 , B81C2203/0109 , B81C2203/019 , H01L21/50 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2224/02 , H01L2224/022 , H01L2224/036 , H01L2224/0391 , H01L2224/04026 , H01L2224/05558 , H01L2224/05572 , H01L2224/05638 , H01L2224/2745 , H01L2224/27452 , H01L2224/2746 , H01L2224/276 , H01L2224/29013 , H01L2224/29016 , H01L2224/29083 , H01L2224/29111 , H01L2224/29117 , H01L2224/29124 , H01L2224/29138 , H01L2224/29144 , H01L2224/29155 , H01L2224/29157 , H01L2224/29166 , H01L2224/29169 , H01L2224/29181 , H01L2224/29184 , H01L2224/32145 , H01L2224/32225 , H01L2224/32502 , H01L2224/32506 , H01L2224/83193 , H01L2224/83203 , H01L2224/83411 , H01L2224/83424 , H01L2224/83444 , H01L2224/83455 , H01L2224/83457 , H01L2224/83466 , H01L2224/83469 , H01L2224/83481 , H01L2224/83484 , H01L2224/83805 , H01L2224/94 , H01L2924/10157 , H01L2924/15159 , H01L2924/164 , H01L2924/01032 , H01L2924/01014 , H01L2924/01029 , H01L2924/00014 , H01L2924/00012 , H01L2224/83
摘要： A method that in one embodiment is useful in bonding a first substrate (103) to a second substrate (303) includes forming a layer including metal over the first substrate. The layer including metal in one embodiment surrounds a semiconductor device, which can be a micro electromechanical system (MEMS) device. On the second substrate (303) is formed a first layer comprising silicon (401). A second layer (403) comprising germanium and silicon is formed on the first layer. A third layer (405) comprising germanium is formed on the second layer. The third layer is brought into contact with the layer including metal. Heat (and pressure in some embodiments) is applied to the third layer and the layer including metal to form a mechanical bond material between the first substrate and the second substrate in which the mechanical bond material is electrically conductive. In the case of the mechanical bond surrounding a semiconductor device such as a MEMS, the mechanical bond can be particularly advantageous as a hermetic seal for protecting the MEMS.
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公开(公告)号：EP3185279A1
公开(公告)日：2017-06-28
申请号：EP16204644.5
申请日：2016-12-16
IPC分类号： H01L21/20
CPC分类号： H01L24/83 , H01L21/2007 , H01L21/31051 , H01L21/31105 , H01L21/321 , H01L21/32132 , H01L24/27 , H01L24/29 , H01L2224/275 , H01L2224/2781 , H01L2224/27831 , H01L2224/27845 , H01L2224/29082 , H01L2224/29138 , H01L2224/29187 , H01L2224/29188 , H01L2224/29193 , H01L2224/29194 , H01L2224/83011 , H01L2224/83048 , H01L2224/8309 , H01L2224/83193 , H01L2224/83896 , H01L2924/01014 , H01L2924/05442
摘要： Ce procédé comporte les étapes a) fournir la première structure (10, 11) et la seconde structure (20, 21), la première structure (10, 11) comportant une surface sur laquelle est formée une couche de silicium ; b) bombarder la couche de silicium par un faisceau (F) d'espèces configuré pour atteindre la surface de la première structure (10, 11), et pour conserver une partie (3a) de la couche de silicium avec une rugosité de surface inférieure à 1 nm RMS à l'issue du bombardement; c) coller la première structure (10, 11) et la seconde structure (2) par une adhésion directe entre la partie (3a) de la couche de silicium conservée lors de l'étape b) et la seconde structure (20, 21), les étapes b) et c) étant exécutées au sein d'une même enceinte soumise à un vide inférieur à 10 -2 mbar.
摘要翻译： 该方法包括以下步骤：a）提供第一结构（10,11）和第二结构（20,21），第一结构（10,11）具有在其上形成有硅层的表面; b）用配置成到达第一结构（10,11）的表面的物质束（F）轰击硅层，并且保持硅层的一部分（3a）具有较低的表面粗糙度 在轰击结束时在1nm RMS; c）通过步骤b）中保留的硅层的部分（3a）与第二结构（20,21）之间的直接粘合将第一结构（10,11）和第二结构（2） 步骤b）和c）在真空度小于10 -2毫巴的同一腔室内进行。
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公开(公告)号：EP2606509A4
公开(公告)日：2015-09-16
申请号：EP11819399
申请日：2011-08-16
发明人： LIU YINGCE , HUO DONGMING , SUN TIANBAO
CPC分类号： H01L33/40 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L33/0079 , H01L33/641 , H01L2224/04026 , H01L2224/05073 , H01L2224/05138 , H01L2224/05147 , H01L2224/05166 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/27472 , H01L2224/27622 , H01L2224/27831 , H01L2224/29011 , H01L2224/2908 , H01L2224/29082 , H01L2224/29101 , H01L2224/29111 , H01L2224/29113 , H01L2224/29116 , H01L2224/29138 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/83193 , H01L2224/83203 , H01L2224/83345 , H01L2224/83805 , H01L2924/01322 , H01L2924/12041 , H01L2924/00 , H01L2924/00014 , H01L2224/29018 , H01L2924/00012 , H01L2924/01014 , H01L2924/01048 , H01L2924/01034
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9.发明公开
公开(公告)号：EP1774589A1
公开(公告)日：2007-04-18
申请号：EP05782182.9
申请日：2005-06-29
发明人： MORICEAU, Hubert , FEUILLET, Guy , POCAS, Stéphane
IPC分类号： H01L21/98 , H01L25/065 , H01L21/18
CPC分类号： H01L24/29 , H01L24/32 , H01L24/83 , H01L27/14634 , H01L27/1469 , H01L2224/04026 , H01L2224/05009 , H01L2224/29082 , H01L2224/29117 , H01L2224/29138 , H01L2224/29155 , H01L2224/29164 , H01L2224/83193 , H01L2224/83801 , H01L2224/8381 , H01L2224/8383 , H01L2224/83894 , H01L2224/9202 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01057 , H01L2924/01058 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/10329 , Y10T156/10 , H01L2924/01014 , H01L2924/01028 , H01L2924/01049 , H01L2924/01031 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to a method for assembling, by molecular adhesion, a first substrate and a second substrate along the contact faces, the contact face of the first substrate having an electrically conductive layer on at least a portion of its surface. The inventive method comprises the following steps: depositing a connecting layer on at least a portion of the electrically conductive layer, said connecting layer being capable of ensuring a molecular adhesion with an area of the contact face of the second substrate and capable of being combined with the electrically conductive layer in order to form a conductive alloy; placing the connecting layer of the first substrate in contact with the area of the contact face of the second substrate and bonding it by molecular adhesion; transforming, on all or a portion of its width, all or part of the electrically conductive layer with all or part of the connecting layer and with at least a portion of the width of the area of the contact face over all or part of the surface of the second substrate in order to form a conductive alloy area.
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10.发明公开ELEKTRONISCHES BAUTEIL SOWIE HALBLEITERWAFER UND BAUTEILTRÄGER ZUR HERSTELLUNG DES BAUTEILS 审中-公开电子元件和半导体晶片和分量载波用于生产COMPONENT
公开(公告)号：EP1629530A1
公开(公告)日：2006-03-01
申请号：EP04738559.6
申请日：2004-05-26
发明人： JEREBIC, Simon , THEUSS, Horst , POHL, Jens
CPC分类号： H01L24/71 , H01L23/4827 , H01L23/562 , H01L23/564 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/0401 , H01L2224/04026 , H01L2224/05599 , H01L2224/274 , H01L2224/278 , H01L2224/29138 , H01L2224/29155 , H01L2224/29157 , H01L2224/2916 , H01L2224/29187 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/75733 , H01L2224/83121 , H01L2224/83143 , H01L2224/83193 , H01L2224/839 , H01L2224/92247 , H01L2224/94 , H01L2224/95144 , H01L2924/00014 , H01L2924/0101 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01052 , H01L2924/01064 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01105 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2924/3512 , H01L2924/35121 , H01L2224/85399 , H01L2224/45099 , H01L2924/00 , H01L2224/27 , H01L2924/00012
摘要： The invention relates to an electronic component as well as a semiconductor wafer and a component support for producing said component. The inventive electronic component comprises a semiconductor chip (1) encompassing a top face (2) that is provided with an integrated circuit and a bottom face (3) which is provided with a magnetic layer (7). The top face (5) of a chip support is also provided with a magnetic layer (8). At least one of the two layers (7, 8) is permanently magnetic such that the semiconductor chip is magnetically fixed to the chip support (5).
摘要翻译： 一种电子部件，包括具有顶侧芯片集成电路和芯片背面的半导体芯片。 该芯片背面侧包括磁性层。 该电子部件还包括在其顶侧载体的磁性层的芯片载体。 至少两个磁性层中的一个是永磁检查所做的半导体芯片被磁性固定在芯片载体上。
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