专利检索 cpc:"H01L2924/1517420130101" 第 1 页

1.

发明授权
SEMICONDUCTOR PACKAGE STRUCTURE 有权转让

公开(公告)号：EP3671831B1

公开(公告)日：2024-09-18

申请号：EP19213567.1

申请日：2019-12-04

IPC分类号： H01L23/498 , H01L23/00

CPC分类号： H01L23/5383 , H01L23/49816 , H01L23/562 , H01L23/36 , H01L23/13 , H01L23/3128 , H01L23/3135 , H01L2924/1531120130101 , H01L2224/1622520130101 , H01L2924/1517420130101

2.

发明授权
SEMICONDUCTOR PACKAGE STRUCTURE HAVING A FRAME WITH TRUNCATED CORNERS 有权转让

公开(公告)号：EP3624181B1

公开(公告)日：2024-07-03

申请号：EP19196606.8

申请日：2019-09-11

IPC分类号： H01L23/10 , H01L23/16 , H01L23/31 , H01L23/498 , H01L25/065

CPC分类号： H01L25/0655 , H01L23/3185 , H01L23/10 , H01L23/16 , H01L2224/1210520130101 , H01L23/49827 , H01L23/49822 , H01L23/49816 , H01L2924/1515120130101 , H01L2924/17120130101 , H01L2924/1517420130101 , H01L2924/18120130101 , H01L2224/1622520130101 , H01L2924/1531120130101 , H01L2924/1816120130101 , H01L2224/7320420130101 , H01L2224/3222520130101 , H01L24/96 , H01L24/81 , H01L2224/9212520130101 , H01L24/92 , H01L2224/291920130101 , H01L24/29 , H01L24/32 , H01L24/16 , H01L2924/0001420130101

3.

发明公开
SEMICONDUCTOR PACKAGE STRUCTURE 审中-公开

公开(公告)号：EP4439648A2

公开(公告)日：2024-10-02

申请号：EP24194476.8

申请日：2019-12-04

申请人： MediaTek Inc.

发明人： CHANG, Chia-Cheng , LIN, Tzu-Hung , PENG, I-Hsuan , LIN, Yi-Jou

IPC分类号： H01L23/00

CPC分类号： H01L23/5383 , H01L23/49816 , H01L23/562 , H01L23/36 , H01L23/13 , H01L23/3128 , H01L23/3135 , H01L2924/1531120130101 , H01L2224/1622520130101 , H01L2924/1517420130101

摘要： A semiconductor package structure is provided. The semiconductor package structure includes a substrate (101), a semiconductor die (115a, 115b) and a frame (113). The semiconductor die (115a, 115b) is disposed over the substrate (101). The frame (113) is disposed over the substrate (101), wherein the frame (113) is adjacent to the semiconductor die (115a, 115b), and the upper surface of the frame (113) is lower than the upper surface of the semiconductor die (115a, 115b). The semiconductor package structure further comprises a heat sink (130) disposed on the semiconductor die (115a, 115b) and a passive component (140) disposed on the substrate (101) between the frame (113) and the semiconductor die (115a, 115b).