Abstract:
A transversely-coupled distributed feedback laser diode, which can be processed without overgrowth, is disclosed. The laser is made from an epitaxial heterostructure including a core layer located between two cladding layers, a cap layer, and at least one Al-rich layer. The lateral waveguide is formed by selective oxidation of the Al-rich layer. A surface corrugated grating is formed above the waveguide. The heteroepitaxial structure is designed so that the core layer is placed in close proximity to the top of the laser structure to provide a required overlap between the light and the grating. In order to avoid inadmissible optical losses, there is no metallization above the waveguide. Instead, the metal contacts are offset at some distance, so that the current has to spread in the cap layer before vertical injection into the core layer.
Abstract:
A semiconductor laser device (20) has a multilayer structure including an n-InP clad layer (22), a SCH-MQW active layer (23), a first p-InP clad layer (24), a multilayer film (25) of p-AllInAs layer/p-AlAs layer, a second p-InP clad layer (26), and a p-GaInAs contact layer (27), all formed in multilayer on an n-InP substrate (21). The multilayer film (25) has a structure in which p-AllInAs layers (25a) and p-AlAs layers (25b) are alternated. Of the multilayer structure, the upper portion of the first p-InP clad layer, the multilayer film, the second p-InP clad layer, and the p-GaInAs contact layer are formed into stripelike ridges (32) having widths of about 10 µm. The side walls of the ridges of the multilayer film is an Al oxide layer (28) formed by selective oxidation of Al in the multilayer film. Thus, a semiconductor laser device having a current/optical confinement structure by virtue of an Al oxide layer on an InP substrate is provided.
Abstract:
Waveguide designs and fabrication methods provide adiabatic waveguide eigen mode conversion and can be applied to monolithic vertical integration of active and passive elements in PICs. An advantage of the designs and methods is a simple fabrication procedure with only a single etching step in combination with subsequent well-controllable selective oxidation. As a result, improved manufacturability and reliability can be achieved.
Abstract:
A photosemiconductor device comprises a plurality of quantum dots 22, the plural quantum dots 22 having non-uniform sizes. Quantum dots of non-uniform size are formed in a low area ratio, whereby the photosemiconductor device can have a wide gain band.
Abstract:
A distributed feedback semiconductor laser device including an active layer (18), a diffraction grating disposed in a vicinity of the active layer (18) and having a substantially uniform space period and a distributed feedback function, and a functional layer (28a and 32) disposed in a vicinity of the diffraction grating and the active layer (18) and having a function of controlling a refractive index of the active layer (18), whereby the functional layer controls a lasing wavelength of the active layer (18). The functional layer of controlling the refractive index of the distributed feedback semiconductor laser device can generate a plurality of the lasing wavelengths different among one another and easily controllable.
Abstract:
A distributed feedback semiconductor laser device including an active layer (18), a diffraction grating disposed in a vicinity of the active layer (18) and having a substantially uniform space period and a distributed feedback function, and a functional layer (28a and 32) disposed in a vicinity of the diffraction grating and the active layer (18) and having a function of controlling a refractive index of the active layer (18), whereby the functional layer controls a lasing wavelength of the active layer (18). The functional layer of controlling the refractive index of the distributed feedback semiconductor laser device can generate a plurality of the lasing wavelengths different among one another and easily controllable.
Abstract:
A semiconductor photonic element is provided, which realize low threshold current and satisfactory characteristics in the high temperatures and/or high output operating condition. This element is comprised of (a) a semiconductor substrate; (b) a mesa structure formed on a first surface of the substrate to extend in a specific direction; the mesa structure including an active layer and a pair of p- and n-type cladding layers located respectively at top and bottom sides of the active layer, forming a double heterojunction; (c)a current-constricting structure for constricting an injection current formed at each side of the mesa structure to expose a top of the mesa structure from the current-constricting structure; the current-constricting structure comprising a first current-blocking part and a second current-blocking part; the first current-blocking part having a dielectric current-blocking layer that extends to the mesa structure; the dielectric current-blocking layer being contacted with top edges of the mesa structure; the second current-blocking part having a semiconductor current-blocking layer; and (d) a semiconductor burying layer formed to cover the mesa structure and the multilayer current-constricting structure; the semiconductor burying layer being contacted with the top of the mesa structure.
Abstract:
A ridge waveguide semiconductor laser structure fabricated by etching and wet oxidation. The upper cladding layer is partially etched forming a ridge and a native oxide layer is wet oxidized from the remaining upper cladding layer and the active region outside the ridge. The deep native oxide layer provides strong optical confinement to the ridge waveguide. Alternately, the active region can be narrower than the ridge waveguide in the laser structure. The ridge waveguide semiconductor laser structures with native oxide layers can also be curved geometry lasers such as ring lasers.