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    ARRANGEMENT FOR COOLING COMPONENTS OF A SUBSEA ELECTRIC SYSTEM
    1.
    发明公开
    ARRANGEMENT FOR COOLING COMPONENTS OF A SUBSEA ELECTRIC SYSTEM 审中-公开
    ANORDNUNG ZURKÜHLUNGVON KOMPONENTEN EINES ELEKTRISCHEN UNTERWASSERSYSTEMS

    公开(公告)号：EP3127409A1

    公开(公告)日：2017-02-08

    申请号：EP15707639.9

    申请日：2015-03-03

    申请人： ABB Schweiz AG

    发明人： GRADINGER, Thomas ,  LANERYD, Tor

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20263 ,  F28D1/022 ,  F28D15/00 ,  F28F13/12 ,  H05K5/0017 ,  H05K7/20236 ,  H05K7/20245 ,  H05K7/20272 ,  H05K7/20409 ,  H05K7/20927

    摘要： There is presented an arrangement for cooling components of a subsea electric system. The arrangement comprises a tank filled with a dielectric fluid. The arrangement comprises at least one electric component located in the tank. The arrangement comprises a first heat exchanger located outside the tank and in fluid contact with the tank, and during operation arranged to be in thermal contact with sea water. The arrangement comprises a pump arranged to force a flow of the dielectric fluid through the first heat exchanger. The arrangement is configured such that during operation the dielectric fluid receives heat from the at least one electric component, flows from the tank into the first heat exchanger, flows through the first heat exchanger to transfer heat to the sea water, and flows back from the first heat exchanger into the tank through the pump. The flow of the dielectric fluid in the tank and around the at least one electric component is by natural convection.

    摘要翻译： 提出了一种用于海底电气系统的冷却部件的布置。 该装置包括填充有介电流体的罐。 该装置包括位于罐中的至少一个电气部件。 该装置包括位于罐外部并与罐流体接触的第一热交换器，并且在布置成与海水热接触的操作期间。 该装置包括泵，其布置成迫使介电流体流过第一热交换器。 该布置被构造成使得在操作期间，介电流体从至少一个电气部件接收热量，从罐流入第一热交换器，流过第一热交换器以将热量传递给海水，并从 第一个热交换器通过泵进入水箱。 介质流体在罐中和周围的至少一个电气部件的流动是通过自然对流。

    Canister cooling
    3.
    发明公开
    Canister cooling 审中-公开
    Kanisterkühlung

    公开(公告)号：EP2822370A1

    公开(公告)日：2015-01-07

    申请号：EP13175366.7

    申请日：2013-07-05

    申请人： Siemens Aktiengesellschaft

    发明人： Volent, Kjetil Zsolt ,  Kristiansen, Karstein

    IPC分类号： H05K5/06 ,  H05K7/20

    CPC分类号： H05K5/06 ,  H05K7/20127 ,  H05K7/20245

    摘要： The present invention relates to a canister (100) for housing an electronic component (140). The canister (100) comprises a wall section with an inner wall surface which is directed to an inner volume (Vi) of the canister (100), wherein the inner wall surface comprises an air guiding structure with at least one air guiding channel (101) for guiding air inside the inner volume (Vi) along the inner wall surface.

    摘要翻译： 本发明涉及一种用于容纳电子部件（140）的罐（100）。 罐（100）包括壁部分，内壁表面指向罐（100）的内部容积（Vi），其中内壁表面包括具有至少一个空气引导通道（101）的空气引导结构 ），用于沿着内壁表面引导内部容积（Vi）内的空气。

    A DEVICE COMPRISING HEAT PRODUCING COMPONENTS WITH LIQUID SUBMERSION COOLING
    4.
    发明公开
    A DEVICE COMPRISING HEAT PRODUCING COMPONENTS WITH LIQUID SUBMERSION COOLING 审中-公开

    公开(公告)号：EP3380907A1

    公开(公告)日：2018-10-03

    申请号：EP16798513.4

    申请日：2016-11-21

    申请人： Aecorsis B.V.

    发明人： BRINK, Dirk Roelof

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： H05K7/20236 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20245 ,  H05K7/20772

    摘要： A device comprising heat producing electronic components (2), such as server memory boards, processors and/or switches, said device comprising a container (1) wherein said heat producing components are mounted, a liquid in said container in which liquid said components are submerged for extracting heat from said components, at least one heat exchanger (7) having a surface which is in contact with said liquid and arranged to extract heat from said liquid, wherein between said heat exchanger and said components a vertical wall (6) is present for guiding and separating a vertical circulation of said liquid in said container which is caused by a temperature difference in said liquid.

    AN IMMERSION COOLING SYSTEM
    5.
    发明公开
    AN IMMERSION COOLING SYSTEM 审中-公开

    公开(公告)号：EP3357312A1

    公开(公告)日：2018-08-08

    申请号：EP16777786.1

    申请日：2016-10-03

    申请人： Iceotope Limited

    发明人： HOPTON, Peter ,  DEAKIN, Keith ,  BENT, Jason ,  EDMUNDS, Neil ,  AMOS, David

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20772 ,  H05K7/1492 ,  H05K7/20236 ,  H05K7/20245 ,  H05K7/20263 ,  H05K7/203 ,  H05K7/20809 ,  H05K7/209

    摘要： A cooling system for cooling of a heat generating electrical component, in particular to reduce the likelihood of overheating of electrical components or chemical breakdown of coolant fluid. The cooling system has a coolant liquid to absorb excess energy from the heat generating electrical component, the coolant liquid having an energy input threshold above which chemical breakdown of the coolant liquid occurs. A cooling module defines a volume containing the coolant liquid, wherein the heat generating electrical component is mounted within the volume and immersed in the coolant liquid. A power input is arranged to supply power into the cooling module to the heat generating electrical component, and a power regulator is provided external to the volume of the cooling module and connected to the power input so as to regulate the power supplied into the cooling module. Cooling systems are also described having coolant liquid comprising dissolved oxygen, having at least one element arranged within the volume comprising aluminium and/or aluminium oxide, and/or having a sealed volume with at least one seal which opens at a predetermined pressure or temperature corresponding to a temperature below the temperature at which the coolant liquid breaks down.

    Subsea electronic system
    6.
    发明授权
    Subsea electronic system 有权
    海底电子系统

    公开(公告)号：EP2487326B1

    公开(公告)日：2018-03-28

    申请号：EP11153780.9

    申请日：2011-02-09

    申请人： Siemens Aktiengesellschaft

    发明人： Boe, Ove

    IPC分类号： E21B41/00 ,  E21B47/01 ,  H05K7/20

    CPC分类号： E21B47/011 ,  E21B41/0007 ,  H05K7/20236 ,  H05K7/20245 ,  H05K7/20927

    摘要： A subsea electronic system is provided. The system comprises a pressure resistant enclosure (11) adapted to maintain a predetermined pressure inside the enclosure (11) when the system (10) is deployed under water, a heat generating electronic component (12) arranged in the enclosure (11), the electronic component (12) generating heat in operation, and a dielectric liquid (13) which at least partially fills said enclosure (11). The subsea electronic system (10) is configured such that when the subsea electronic system (10) is deployed under water in an operating state, the electronic component (12) is at least partially submerged in the dielectric liquid (13) and the dielectric liquid (13) is in contact with at least one wall (17) of the enclosure (11) so as to enable a transfer of heat from the heat generating electronic component (12) to the at least one wall (17) of the enclosure (11) via the dielectric liquid (13).

    Double-loop thermosiphon for cooling of electric and electronic components
    7.
    发明公开
    Double-loop thermosiphon for cooling of electric and electronic components 审中-公开
    多宝贝热iph on on ile ile ile ile ile ile ile ile ile ile ile ile ile ile ile

    公开(公告)号：EP2552182A1

    公开(公告)日：2013-01-30

    申请号：EP11175915.5

    申请日：2011-07-29

    申请人： ABB Research Ltd.

    发明人： Bergamini, Alessio ,  Agostini, Francesco ,  Habert, Mathieu ,  Besana, Stefano ,  Kaufmann, Lilian ,  Malinowski, Lukasz

    IPC分类号： H05K7/20 ,  F25B7/00 ,  F28D15/02

    CPC分类号： H05K7/20245 ,  F25B7/00 ,  F25B23/006 ,  F28D1/0308 ,  F28D1/0477 ,  F28D7/0025 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2013/005 ,  H05K7/20336 ,  H05K7/20809

    摘要： The present invention relates to the cooling of power electric and/or electronic components, in particular to a heat exchanger system (200) for moving heat from a heat source (120) comprising at least one of an electric and an electronic component (120). The heat exchanger system (200) comprises a first cooling circuit (210) that is formed as a loop-type thermo siphon comprising a first coolant with at least partially changes phases between the liquid state and a vaporous state in an operating state of the first cooling circuit (210) when heated up above a vaporization point of the first coolant. The first cooling circuit (210) has a first interface (212) for receiving a thermal load from the heat source (120) that is thermally connected to the first interface (212) and has a second interface (214) for releasing a major portion of said thermal load. The first interface (212) acts as a first evaporator (131) and the second interface (214) acts as a first condenser (133) in an operating state of the first cooling circuit (210). The heat exchanger system (200) further comprises a second cooling circuit (212) that is formed as a loop-type thermo siphon comprising a second coolant which at least partially changes phases between a liquid state and a vapor state, an operating state of the second cooling circuit (220) when heated up above a vaporization point of the second coolant. The second cooling circuit (212) has a third interface (216) that is thermally connected to the second interface (214). The second cooling circuit (220) has a fourth interface (218) for releasing the major portion of said thermal load taken up at the third interface (216). The third interface (216) acts as a second evaporator (212) and the fourth interface (218) acts as a second condenser (222) in an operating state of the second cooling circuit (212).

    摘要翻译： 本发明涉及功率电和/或电子部件的冷却，特别是涉及一种用于从包括电和电子部件（120）中的至少一个的热源（120）移动热量的热交换器系统（200） 。 热交换器系统（200）包括形成为环形热虹吸管的第一冷却回路（210），所述第一冷却回路包括第一冷却剂，所述第一冷却剂在第一冷却剂的第一冷却回路的运行状态下至少部分地改变液体状态和蒸汽状态之间的相位 冷却回路（210）当被加热到高于第一冷却剂的汽化点时。 第一冷却回路（210）具有用于从热源（120）接收热负荷的第一接口（212），其热连接到第一接口（212）并且具有用于释放主要部分的第二接口（214） 的所述热负荷。 在第一冷却回路（210）的运行状态下，第一接口（212）用作第一蒸发器（131），第二接口（214）用作第一冷凝器（133）。 热交换器系统（200）还包括第二冷却回路（212），其形成为环形热虹吸管，其包括至少部分地改变液体状态和蒸气状态之间的相位的第二冷却剂， 第二冷却回路（220）在第二冷却剂的蒸发点上方加热时。 第二冷却回路212具有热连接到第二接口214的第三接口216。 第二冷却回路（220）具有用于释放在第三接口（216）处被吸收的所述热负荷的主要部分的第四接口（218）。 在第二冷却回路（212）的运行状态下，第三接口（216）用作第二蒸发器（212），第四接口（218）用作第二冷凝器（222）。

    AIR CONDITIONING SYSTEM
    9.
    发明公开
    AIR CONDITIONING SYSTEM 审中-公开
    KLIMAANLAGENSYSTEM

    公开(公告)号：EP2811366A1

    公开(公告)日：2014-12-10

    申请号：EP13837834.4

    申请日：2013-09-13

    申请人： GAC Corporation

    发明人： OKI, Junichi ,  YAMAGUCHI, Shoichi

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： H05K7/20718 ,  F24F2011/0006 ,  G06F1/20 ,  H05K7/20245 ,  H05K7/20745 ,  H05K7/20763 ,  H05K7/2079 ,  H05K7/20827

    摘要： An air-conditioning system includes: an interior heat exchanging system that partitions a hot area side of a rack row, where a plurality of racks, in which heat generating equipment is held, are aligned in a lateral direction, along the rack row to form a cold air buffer area to the outside of the hot area; a supplying fan that supplies cold air from the cold air buffer area to a cold area side of the rack row via an underfloor side of a double floor on which the rack row has been disposed; and an exterior heat exchanging system, a refrigerant circulating between the exterior heat exchanging system and the interior heat exchanging system via a piping system. It is possible to provide an air-conditioning system with low power consumption suited to air conditioning of a server room.

    摘要翻译： 一种空调系统包括：内部热交换系统，其分隔架架排的热区域，其中保持有发热设备的多个机架沿着横向方向沿着齿条排排列以形成 一个冷空气缓冲区到热区外面; 供应风扇，其经由冷空气缓冲区域的冷空气区域经由已经布置有齿条排的双层地板的底板侧供应到齿条排的冷区侧; 以及外部热交换系统，通过管道系统在外部热交换系统和内部热交换系统之间循环的制冷剂。 可以提供适合于服务器室的空调的低功耗的空调系统。