-
公开(公告)号：EP4429097A1
公开(公告)日：2024-09-11
申请号：EP21963280.9
申请日：2021-11-05
Inventor： MIYAZAKI, Yuki , SATO, Akira
IPC: H02M7/48
CPC classification number: H02M7/003 , H02M7/4835 , H02M1/0006 , H05K7/20909
Abstract: A sub-module of a power conversion device includes: an IGBT (11a to 14a, 11b to 14b); a drive circuit (40a, 42a, 40b, 42b) that drives the IGBT (11a to 14a, 11b to 14b); a laminated bus bar (22a, 22b) on which the IGBT (11a to 14a, 11b to 14b) is mounted; a substrate (23a, 24a, 23b, 24b) on which the drive circuit (40a, 42a, 40b, 42b) is mounted; a housing frame (55) for accommodating the IGBT (11a to 14a, 11b to 14b), the drive circuit (40a, 42a, 40b, 42b), the laminated bus bar (22a, 22b), and the substrate (23a, 24a, 23b, 24b); and a separation frame (52a, 52b) for separating a space in which the drive circuit (40a, 42a, 40b, 42b) and the substrate (23a, 24a, 23b, 24b) are disposed from a space in which the IGBT (11a to 14a, 11b to 14b) and the laminated bus bar (22a, 22b) are disposed.
-
2.发明公开
公开(公告)号：EP4391755A1
公开(公告)日：2024-06-26
申请号：EP23213634.1
申请日：2023-12-01
Applicant: Friem S.p.a.
Inventor： GIORGI, Marco , BARBERINI, Marcello
IPC: H05K7/20
CPC classification number: H05K7/2089 , H05K7/20909
Abstract: The invention relates to an electronic power converter apparatus (100; 100). The apparatus comprises a box-like body (10; 10') comprising a first base wall (1) and an opposite second base wall (2) joined to each other by a first (3) and a second (4) side wall and by a bottom wall (5) orthogonal to the base walls; the first and second side walls and the bottom wall extend orthogonally from the base walls along a main longitudinal extension direction (L) of the box-like body to delimit a housing compartment (6) accessible from the outside through an insertion opening (7) opposite to the bottom wall.
The apparatus comprises a first (20) and at least a second (30) converter module accommodated in the housing compartment so that the first converter module is proximal to the first base wall and the at least a second converter module is superimposed on the first converter module along the main longitudinal extension direction of the box-like body. The first and the at least a second converter module comprise a first and at least a second electronic circuitry, respectively, adapted to dissipate electrical energy by generating heat inside the box-like body.
The apparatus comprises a forced-ventilation cooling unit, which comprises a first (21) and at least a second (31) heat dissipation device associated with the first and at least second converter modules, respectively. Such first and at least second heat dissipation devices are configured to convey a cooling air flow (F1, F2) entering into the interior of the box-like body and to convey a corresponding heated air flow (Fout) exiting from the box-like body, to cool the first and at least second converter modules by removing the heat generated by the first and at least second electronic circuitry. The apparatus is characterized in that: the first heat dissipation device is housed in the first converter module to be interposed between the first side wall of the box-like body and a median plane (P) of the box-like body parallel to and equally spaced apart from the first and second side walls;
the at least a second heat dissipation device is housed in the at least a second converter module to be interposed between the second side wall of the box-like body and the median plane.-
3.发明公开
公开(公告)号：EP4319524A3
公开(公告)日：2024-05-22
申请号：EP23189439.5
申请日：2023-08-03
Applicant: Siemens Industry, Inc.
Inventor： TITUS, Solomon R.
IPC: H05K7/20
CPC classification number: H05K7/209 , H05K7/20909
Abstract: A solid-state circuit breaker or a residential circuit breaker includes a base housing semiconductors, electronics and advanced software algorithms. The base has a first profile area. It further includes a ventilation system for cooling the solid-state circuit breaker. The ventilation system includes a main cover configured to be mounted on the base by covering the first profile area of the base. The main cover has a second profile area such that the second profile area has an array of holes built-in the main cover. The ventilation system further includes an outer cover configured to be mounted on the main cover by covering the second profile area of the main cover to form an assembly of multi-layered covers. The outer cover has a third profile area such that the third profile area has an array of ribs built-in the outer cover.
-
4.发明公开
公开(公告)号：EP4369879A1
公开(公告)日：2024-05-15
申请号：EP23193189.0
申请日：2023-08-24
Applicant: Sungrow Power Supply Co., Ltd.
Inventor： Lu, Zheng , Liu, Long , Li, Yonghong , Zhu, Qiyao
IPC: H05K7/20
CPC classification number: H05K7/202 , H05K7/20909
Abstract: A heat exchange structure of a power electronic apparatus, a heat dissipation air passage and a power electronic apparatus are provided. The heat exchange structure of a power electronic apparatus includes a case and at least one heat exchanger. A first cavity and a second cavity are arranged in the case. The first cavity is configured to accommodate a heating device, and the first cavity is a closed cavity. The at least one heat exchanger is arranged in the first cavity, and has a heat exchange air passage communicated with the second cavity. In the heat exchange structure of a power electronic apparatus, by arranging a heat exchange air passage in the heat exchanger, a heat exchange area is increased compared to a heat exchange plate in the conventional technology. Moreover, the heat exchanger is arranged in the first cavity, the heat exchange air passage is in communication with the second cavity, and thus the heat exchanger is designed in an embedded manner. Compared to the heat exchange plate in the conventional technology, the heat exchange air passage has a greater length, further increasing the heat exchange area. Therefore, the heat exchange area is increased effectively with the heat exchange structure of a power electronic apparatus, thereby improving heat dissipation capacity and heat dissipation effect.
-
公开(公告)号：EP3379711A1
公开(公告)日：2018-09-26
申请号：EP18151198.1
申请日：2018-01-11
Applicant: LSIS Co., Ltd.
Inventor： YANG, Chun-Suk , BAE, Tae-Suk
CPC classification number: H05K7/20945 , H02H5/04 , H02H7/0833 , H02H7/0852 , H02H7/122 , H02M7/537 , H02M2001/327 , H02P6/28 , H02P29/68 , H05K7/20909
Abstract: Disclosed is a managing device for cooling an inverter. The managing device for cooling an inverter includes a fan controller configured to provide an electric current flowing in a cooling fan; and a controller configured to determine whether the current flowing in the cooling fan is out of a preset range, and, when the current is out of the preset range, configured to control the cooling fan with a control voltage different from an operating voltage of the cooling fan.
-
Patent Agency Ranking
公开(公告)号：EP2988004B1
公开(公告)日：2018-08-08
申请号：EP15178756.1
申请日：2015-07-29
Applicant: G. Cartier Technologies
Inventor： BREHERET, Jean-Luc , PIGNAL-JACQUARD, Marcel
CPC classification number: H05K7/209 , B60H1/00828 , F04D19/002 , F04D25/068 , F04D29/5813 , H02K11/33 , H05K7/20909
-
公开(公告)号：EP2677847A3
公开(公告)日：2018-05-16
申请号：EP13171490.9
申请日：2013-06-11
Applicant: General Electric Company
Inventor： Shepard, Mark Eugene
CPC classification number: H05K7/1432 , H02M7/003 , H02M7/487 , H05K7/20909
Abstract: A phase leg 150 for a three-level power converter 114 includes a heat sink device 222 that includes a first surface 224 and a second surface 225 opposite the first surface 224. The phase leg 150 also includes a first portion including at least one semiconductor switching device coupled to the first surface 224. The phase leg 150 further includes a second portion including at least one semiconductor switching device coupled to the second surface 225.
Abstract translation: 用于三电平功率转换器114的相脚150包括散热装置222，散热装置222包括第一表面224和与第一表面224相对的第二表面225.相脚150还包括第一部分，第一部分包括至少一个半导体开关 装置耦合到第一表面224.相腿150还包括第二部分，第二部分包括耦合到第二表面225的至少一个半导体开关装置。
-
公开(公告)号：EP2642131B1
公开(公告)日：2018-05-02
申请号：EP13160039.7
申请日：2013-03-19
Applicant: Hamilton Sundstrand Corporation
Inventor： Pal, Debabrata
CPC classification number: F04D29/5813 , F04D25/068 , H05K7/20909
Abstract: An air cooled motor controller, 100, includes a substrate, 101, and at least one inductor assembly, 103, arranged on the substrate, 101. The at least one inductor assembly, 103, includes a outer cylindrical housing, 201, a wound inductor core, 203, arranged within the outer cylindrical housing, 201, and a inner cylindrical housing, 204, arranged within the wound inductor core, 203, wherein the inner cylindrical housing, 204, defines an inner cylindrical cavity, 205, configured to transmit air, and wherein the cylindrical housing, 201, and the inner cylindrical housing, 204, define at least one cylindrical gap, 221, in fluid communication with the inner cylindrical cavity, 205, and configured to transmit air. The motor controller, 100, also includes at least one air source in fluid communication with the at least one cylindrical gap, 221.
-
公开(公告)号：EP3297021A1
公开(公告)日：2018-03-21
申请号：EP17190518.5
申请日：2017-09-12
Applicant: JTEKT CORPORATION
Inventor： KOJIMA, Yoshihiro
IPC: H01L23/367 , H01L23/42 , H05K1/02
CPC classification number: H05K7/20909 , H01L23/36 , H01L23/367 , H01L23/3675 , H01L23/3677 , H01L23/42 , H05K1/0206 , H05K1/114 , H05K3/0061 , H05K2201/0959 , H05K2201/10166
Abstract: An electronic control device (1) includes a heating element (10), a circuit substrate (20), a heat radiation plate (30), and a heat radiation material (40). Connection terminals (13) of the heating element (10) are fixed to wiring patterns (21) on a circuit principal surface (20a) of the circuit substrate (20) with solder (14). Through holes (22) are provided in the circuit substrate (20) at portions spaced away from the distal ends of the connection terminals (13) of the heating element (10) by a distance (T2) equal to or smaller than a thickness (Tl) of the circuit substrate (20). The heat radiation material (40) applied between a circuit principal surface (20b) of the circuit substrate (20) and the heat radiation plate (30) is exposed to the circuit principal surface (20a) via the through holes (22). The heat radiation material (40) exposed to the circuit principal surface (20a) covers the distal ends of the connection terminals (13) fixed with the solder (14). When a heat radiation material is interposed between the heating element (10) and a heat radiation plate, the condition of the heat radiation material can be checked by providing through holes in the heat radiation plate.
Abstract translation: 电子控制装置（1）具备发热体（10），电路基板（20），散热板（30）以及散热材料（40）。 利用焊料（14）将加热元件（10）的连接端子（13）固定到电路基板（20）的电路主表面（20a）上的布线图案（21）。 在电路基板（20）的与加热元件（10）的连接端子（13）的远端隔开等于或小于厚度（T）的距离（T2）的部分设置有通孔（22） T1）的电路基板（20）。 施加在电路基板20的电路主面20b与散热板30之间的散热材料40经由贯通孔22向电路主面20a露出。 暴露于电路主表面（20a）的散热材料（40）覆盖固定有焊料（14）的连接端子（13）的末端。 当散热材料介于加热元件（10）和散热板之间时，可以通过在散热板上设置通孔来检查散热材料的状况。
-
公开(公告)号：EP2645840A3
公开(公告)日：2018-03-21
申请号：EP13161920.7
申请日：2013-04-02
Applicant: Rockwell Automation Technologies, Inc.
Inventor： Morris, Garron Koch , Weiss, Bruce William , Michalski, Robert Michael
IPC: H05K7/20
CPC classification number: H05K7/20909 , H05K7/20172
Abstract: Embodiments of the present disclosure are directed towards an electrical equipment system including an electrical equipment component, a thermal management system configured to direct air over features of the electrical equipment component, a rectangular fan housing of the thermal management system, and a fan disposed within the fan housing, wherein an axis of rotation of the fan is offset relative to a geometric center point of the rectangular fan housing.
Abstract translation: 本公开的实施例针对一种电气设备系统，该电气设备系统包括电气设备部件，配置成将空气引导到电气设备部件的特征之上的热管理系统，热管理系统的矩形风扇壳体以及设置在 风扇外壳，其中风扇的旋转轴线相对于矩形风扇外壳的几何中心点偏移。
-
-
-
-
-
-
-
-
-
Search Results
239
records
(took 0.02 seconds)
