公开(公告)号：EP3954747B1

公开(公告)日：2023-11-22

申请号：EP20788241.6

申请日：2020-03-26

发明人： UTA, Akira ,  YASUDA, Shigeki ,  YAMADA, Tetsuro ,  HIROKAMI, Munenao ,  KATAYAMA, Taiki ,  SAKAMOTO, Takafumi

IPC分类号： C09K3/10 ,  C08G77/16 ,  C08G77/18 ,  C08K3/04 ,  C08K3/26 ,  C08K5/5445

公开(公告)号：EP3392314B1

公开(公告)日：2020-12-02

申请号：EP16875785.4

申请日：2016-12-16

申请人： Momentive Performance Materials Japan LLC

发明人： SHIMAKAWA, Masanari

IPC分类号： C08L83/06 ,  C08K3/36 ,  C08K5/14 ,  C08K5/5445 ,  C08K5/56 ,  C08L83/05 ,  C08L83/07 ,  C08G77/12 ,  C08G77/20 ,  C08G81/02 ,  C08G77/08 ,  C08L83/04 ,  C08J3/28

公开(公告)号：EP2123720A4

公开(公告)日：2013-12-18

申请号：EP07851032

申请日：2007-12-21

申请人： KANEKA CORP

发明人： YANO AYAKO ,  MATSUSHITA NORIKO ,  SONODA TAKESHI ,  KOMITSU SHINTARO

IPC分类号： C08L101/10 ,  C08K5/29 ,  C08K5/5445 ,  C08L33/00 ,  C08L71/00 ,  C09J133/06 ,  C09J171/02 ,  C09J201/10 ,  C09K3/10

CPC分类号： C09K3/1018 ,  C08G65/2609 ,  C08G65/2663 ,  C08G65/336 ,  C08G65/337 ,  C08K5/31 ,  C08K5/5425 ,  C08K5/544 ,  C08L43/04 ,  C08L71/00 ,  C08L71/02 ,  C08L2666/22 ,  C09J143/04 ,  C09J171/02

摘要： The present invention has its object to provide a curable composition not containing any organotin type curing catalyst of concern because of the toxic feature thereof, or any volatile compound, excellent in curability and storage stability and, further, capable of providing cured products excellent in strength and elongation. The above object can be achieved by a curable composition which includes: an organic polymer (A) containing a hydrolyzable silyl group in a molecule; an amidine compound (B); a plasticizer (C); and an amino group-containing silane coupling agent (D), wherein the amidine compound (B) is preliminarily mixed and dissolved and/or dispersed in the plasticizer (C) and the amino group-containing silane coupling agent (D), and the resultant mixture is added to the reactive silyl group-containing polymer (A).

摘要翻译： 本发明的目的是提供一种不含有任何有机锡型固化催化剂的可固化组合物，因为其毒性或任何挥发性化合物，固化性和储存稳定性优异，并且进一步能够提供强度优异的固化产物 和伸长率。 上述目的可以通过一种可固化组合物来实现，所述可固化组合物包含：在分子中含有可水解甲硅烷基的有机聚合物（A） 脒化合物（B）; 增塑剂（C）; 和含氨基硅烷偶联剂（D），其中脒化合物（B）预先混合并溶解和/或分散在增塑剂（C）和含氨基硅烷偶联剂（D）中，并且 将所得混合物加入含反应性甲硅烷基的聚合物（A）中。

公开(公告)号：EP4159740A1

公开(公告)日：2023-04-05

申请号：EP22198564.1

申请日：2022-09-29

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： KAWAKAMI, Masato

IPC分类号： C07F7/18 ,  C08K5/5445 ,  C09D7/63 ,  C09D183/00

摘要： A cyclic silazane compound having an alkoxysilyl group, represented by the following general formula (1):

wherein R 1 , R 2 , R 5 and R 6 each independently represent an unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, R 3 represents a divalent hydrocarbon group having 4 to 20 carbon atoms, which may contain a sulfur atom, an ester bond or a urea bond, R 4 represents a hydrogen atom or an unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, m is 0 or 1, and n is 0, 1 or 2.

公开(公告)号：EP3099746B1

公开(公告)日：2021-05-05

申请号：EP15740359.3

申请日：2015-01-22

发明人： ENAMI, Hiroji

IPC分类号： C08L83/07 ,  C08K5/057 ,  C08K5/07 ,  C08K5/5415 ,  C08K5/5445 ,  C08L83/05 ,  C08L83/06 ,  H01L23/29 ,  H01L23/31

公开(公告)号：EP3099746A1

公开(公告)日：2016-12-07

申请号：EP15740359.3

申请日：2015-01-22

申请人： Dow Corning Toray Co., Ltd.

发明人： ENAMI, Hiroji

IPC分类号： C08L83/07 ,  C08K5/057 ,  C08K5/07 ,  C08K5/5415 ,  C08K5/5445 ,  C08L83/05 ,  C08L83/06 ,  H01L23/29 ,  H01L23/31

CPC分类号： C08G77/44 ,  C08G77/12 ,  C08G77/20 ,  C08K5/0091 ,  C08K5/06 ,  C08K5/5415 ,  C08K5/5425 ,  C08K5/5435 ,  C08K5/549 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： A silicone gel composition for use in sealing or filling of electrical or electronic parts comprising at least one adhesion promoter (Z), and by curing to form a silicone gel having, at 25° C. and a shear frequency of 0.1 Hz, a loss elastic modulus of from 5.0×103 to 1.0×105 dyne/cm2, a complex elastic modulus of from 5.0×104 to 1.0×106 dyne/cm2, and a loss tangent of 0.3 or less. The silicone gel composition is provided, which can suppress the occurrence of air bubbles or cracks in silicone gel that seals or fills an electrical or electronic part and has excellent bonding to the electrical or electronic part even when used under high-temperature conditions as in a power device; and a silicone gel is provided, which can suppress the occurrence of air bubbles or cracks when it seals or fills an electrical or electronic part.

摘要翻译： 一种用于密封或填充包含至少一种粘合促进剂（Z）的电气或电子部件的硅凝胶组合物，并通过固化形成在25℃和剪切频率为0.1Hz的硅胶，具有损失 弹性模量为5.0×10 3〜1.0×10 5达因/ cm 2，复数弹性模量为5.0×10 4〜1.0×10 6达因/ cm 2，损耗角正切为0.3以下。 提供了硅酮凝胶组合物，其可以抑制密封或填充电气或电子部件的硅凝胶中的气泡或裂纹的发生，并且即使在高温条件下使用时也具有与电气或电子部件的良好结合，如 动力装置 并且提供硅胶，其可以在密封或填充电气或电子部件时抑制气泡或裂纹的发生。

公开(公告)号：EP2794732A1

公开(公告)日：2014-10-29

申请号：EP12859899.2

申请日：2012-12-21

申请人： LANXESS International S.A. ,  UNIVERSITY OF WATERLOO

发明人： SIEGERS, Conrad ,  ADKINSON, Dana K. ,  DAVIDSON, Gregory J.E. ,  FERRARI, Lorenzo ,  GAUTHIER, Mario

IPC分类号： C08J3/24 ,  C08K3/28 ,  C08K5/5445 ,  C08L23/26

CPC分类号： C08C19/22 ,  C08J3/24 ,  C08J2300/26 ,  C08J2323/00 ,  C08K5/19 ,  C08K5/28 ,  C08L23/26

摘要： The present invention relates to curing of polymers, particularly to self curing of polymers. The present invention provides a process for curing of copolymers of isoolefins and olefinic monomers. The process includes the step of reacting the copolymer with an azidation reagent to form an azidated copolymer and then heating the azidated copolymer at a suitable temperature to cure the polymer.

公开(公告)号：EP3661996B1

公开(公告)日：2022-07-20

申请号：EP18840151.7

申请日：2018-07-30

发明人： HUANG, Yanxia ,  GUO, Yi ,  CHEN, Xu

IPC分类号： C08G77/08 ,  C08G77/00 ,  C08L83/00 ,  C08K5/5445 ,  C09J183/12 ,  C08G77/458 ,  C08L83/10 ,  C08L83/12

公开(公告)号：EP3926097A1

公开(公告)日：2021-12-22

申请号：EP20740890.7

申请日：2020-01-14

申请人： Nippon Chemical Paint Co., Ltd.

发明人： HIGASHINO Takaaki ,  KATO Kenji

IPC分类号： E02D5/08 ,  C08K5/5445 ,  C08L1/08 ,  C08L33/02 ,  C08L83/06 ,  C09K3/10 ,  C08L71/00 ,  C08L71/02

摘要： A curable water-swelling water stop material including: 100 parts by mass of a resin component which includes 40 to 100 parts by mass of a curable resin having a hydrolysable alkoxysilyl group and 0 to 60 parts by mass of a polyether polyol; 0.3 to 25 parts by mass of an aminosilane coupling agent; 20 to 250 parts by mass of a water-absorbent resin; and 0 to 160 parts by mass of an extender pigment, in which the hydrolysable alkoxysilyl group having a structure represented by Formula (1) -X-CH 2 -SiR 1 Y (OR 2 ) 3-Y , in which X is a bonding functional group having a heteroatom with an unshared electron pair and bonding to a methylene group bonding to a silicon atom of a hydrolysable silicon group, R 1 and R 2 are C 1 -C 3 alkyl groups respectively, and Y is 0, 1 or 2.

公开(公告)号：EP3099746A4

公开(公告)日：2017-09-27

申请号：EP15740359

申请日：2015-01-22

申请人： DOW CORNING TORAY CO LTD

发明人： ENAMI HIROJI

IPC分类号： C08L83/07 ,  C08K5/057 ,  C08K5/07 ,  C08K5/5415 ,  C08K5/5445 ,  C08L83/05 ,  C08L83/06 ,  H01L23/29 ,  H01L23/31

CPC分类号： C08G77/44 ,  C08G77/12 ,  C08G77/20 ,  C08K5/0091 ,  C08K5/06 ,  C08K5/5415 ,  C08K5/5425 ,  C08K5/5435 ,  C08K5/549 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： A silicone gel composition for use in sealing or filling of electrical or electronic parts comprising at least one adhesion promoter (Z), and by curing to form a silicone gel having, at 25° C. and a shear frequency of 0.1 Hz, a loss elastic modulus of from 5.0×103 to 1.0×105 dyne/cm2, a complex elastic modulus of from 5.0×104 to 1.0×106 dyne/cm2, and a loss tangent of 0.3 or less. The silicone gel composition is provided, which can suppress the occurrence of air bubbles or cracks in silicone gel that seals or fills an electrical or electronic part and has excellent bonding to the electrical or electronic part even when used under high-temperature conditions as in a power device; and a silicone gel is provided, which can suppress the occurrence of air bubbles or cracks when it seals or fills an electrical or electronic part.

摘要翻译： 一种用于密封或填充包含至少一种增粘剂（Z）的电气或电子部件的有机硅凝胶组合物，并且通过固化以形成在25℃和0.1Hz的剪切频率下具有损失 弹性模量为5.0×103-1.0×105达因/厘米2，复数弹性模量为5.0×104-1.0×106达因/厘米2，损耗角正切为0.3或更小。 提供了这样的有机硅凝胶组合物，其可以抑制密封或填充电气或电子部件的硅凝胶中的气泡或裂纹的发生，并且即使在高温条件下使用时也具有与电气或电子部件的优异结合 功率器件; 并且提供了硅凝胶，其在密封或填充电气或电子部件时可抑制气泡或裂缝的发生。