公开(公告)号：EP4137545A1

公开(公告)日：2023-02-22

申请号：EP21787659.8

申请日：2021-02-25

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： HOTTA Masakatsu

IPC分类号： C08L83/07 ,  C08K3/36 ,  C08K5/14 ,  C08K5/5435 ,  C08K5/5465 ,  C08L83/05 ,  C09J11/04 ,  C09J11/06 ,  C09J183/07

摘要： The present invention is an self-adhesive millable silicone rubber composition containing: 100 parts by mass of (A) an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms per molecule and an average polymerization degree of 100 or more; 5 to 50 parts by mass of (B) a reinforcing silica having a specific surface area of 50 m 2 /g or more; 0.1 to 5 parts by mass of (C) an organosilicon compound having an epoxy group and an alkoxy group per molecule; 0.1 to 5 parts by mass of (D) an organosilicon compound having an isocyanate group and an alkoxy group per molecule; and an effective curing amount of (E) a curing agent. The content of an organosilicon compound having a siloxane bond and a benzene ring per molecule is 0 to 0.1 parts by mass, and the content of an organosilicon compound having a siloxane bond and an epoxy group per molecule is 0 to 0.1 parts by mass. This makes it possible to provide a self-adhesive millable silicone rubber composition excellent in productivity and capable of forming a cured product excellent in adhesion.

公开(公告)号：EP3409726B1

公开(公告)日：2021-07-07

申请号：EP17744258.9

申请日：2017-01-25

发明人： ISAGO Hiroyuki ,  YOSHIDA Tomoya ,  SAITOH Kei

IPC分类号： C08J3/12 ,  C08J3/20 ,  C08J3/00 ,  C08L81/04 ,  C08L27/12 ,  C08L27/18 ,  C08L81/02 ,  C08K5/544 ,  C08K5/5455 ,  C08K5/5465

公开(公告)号：EP1945649B1

公开(公告)日：2016-07-13

申请号：EP06810688.9

申请日：2006-09-21

申请人： Dow Corning Toray Co., Ltd.

发明人： TANIGUCHI, Yoshinori ,  IWAI, Makoto ,  WAKITA, Keiji

IPC分类号： C07F7/18 ,  C08K5/00 ,  C08K5/5465

CPC分类号： C08K5/5465 ,  C07F7/1892

公开(公告)号：EP1999187B1

公开(公告)日：2013-06-19

申请号：EP07711537.6

申请日：2007-02-15

申请人： Construction Research & Technology GmbH

发明人： MACK, Helmut

IPC分类号： C08G77/04 ,  C08G77/26 ,  C08K5/5465 ,  C08L83/08 ,  C09D183/08 ,  C09J183/08

CPC分类号： C08G77/26 ,  C08K5/29 ,  C08K5/5465 ,  C08L83/08

公开(公告)号：EP2565046A3

公开(公告)日：2013-05-29

申请号：EP12182158.1

申请日：2012-08-29

申请人： Fujifilm Corporation

发明人： Matsumoto, Yousuke

IPC分类号： B41N1/12 ,  B41C1/05 ,  C08L101/02 ,  C08K5/54 ,  C08L71/00 ,  C08G81/02 ,  C08F8/42 ,  C08F291/06 ,  C08F216/38 ,  C08F220/20 ,  C09D4/06 ,  C08J3/24 ,  C08J3/28 ,  C08G65/336 ,  C07F7/18 ,  C08L71/02 ,  C08K5/544 ,  C08K5/548 ,  C08K5/5465 ,  C08L29/14 ,  C08L87/00 ,  C08F216/06 ,  C08F218/08 ,  C08F261/12

CPC分类号： B41C1/05 ,  B41N1/12 ,  B41N1/22

摘要： Disclosed are a resin composition for laser engraving, a relief printing plate precursor for laser engraving and process for producing the same, a process for making relief printing plate, and a relief printing.
The resin composition for laser engraving comprising: (Component A) a compound represented by following Formula (1), and (Component B) a binder polymer having a functional group that is capable of reacting with a hydrolyzable silyl group and/or a silanol group and thereby forming a crosslinked structure:

wherein in Formula (1), W, X and Y each independently represent a hydrolyzable group selected from the group consisting of an alkoxy group, an aryloxy group, a mercapto group, a halogen atom, an amide group, an acetoxy group, an amino group and an isopropenoxy group, or a hydroxy group; L represents a divalent linking group or a single bond; Z 1 represents a divalent group having 4 to 45 carbon atoms in total and containing at least two of a unit selected from an ethylene oxide unit and a propylene oxide unit; Z 2 represents an alkyl group having 7 or less carbon atoms, or a benzyl group; and the sum of the numbers of carbon atoms of L, Z 1 and Z 2 is 10 to 50.

公开(公告)号：EP2368929A1

公开(公告)日：2011-09-28

申请号：EP09833468.3

申请日：2009-12-17

申请人： Panasonic Electric Works Co., Ltd.

发明人： NISHINO, Mitsuyoshi ,  SATOU, Fuminori ,  FUJINO, Kentaro ,  NAKAMURA, Yoshihiko

IPC分类号： C08G59/20 ,  C08J5/24 ,  C08K3/00 ,  C08K5/5435 ,  C08K5/5465 ,  C08L63/00

CPC分类号： C08J5/24 ,  C08G59/308 ,  C08G59/329 ,  C08G59/621 ,  C08J2363/00 ,  C08K3/013 ,  C08K5/54 ,  C08K5/5435 ,  C08K5/5465 ,  C08K5/548 ,  C08L63/00 ,  H05K1/0373 ,  H05K3/389 ,  Y10T156/10 ,  Y10T428/31511 ,  Y10T428/31515

摘要： The present invention provides an epoxy resin composition having a high heat resistance such as a thermal decomposition temperature, as well as a high adhesive strength, in particular inner layer adhesive strength, and also provides a prepreg, a laminate board and a multi-layer board using the composition.
The epoxy resin composition according to the present invention contains an epoxy resin containing nitrogen and bromine in the molecule, a curing agent having a phenolic hydroxyl group, and a silane compound having no cure acceleration action and having reactivity with the epoxy resin. The bromine content in a resin component of the epoxy resin composition is 10 mass% or greater.

摘要翻译： 本发明提供具有耐热性如热分解温度以及高粘合强度，特别是内层粘合强度的环氧树脂组合物，并且还提供预浸料，层压板和多层板 使用组合。 本发明的环氧树脂组合物含有分子中含有氮和溴的环氧树脂，具有酚羟基的固化剂和不具有固化促进作用并与环氧树脂具有反应性的硅烷化合物。 环氧树脂组合物的树脂成分中的溴含量为10质量％以上。

公开(公告)号：EP1788018B1

公开(公告)日：2009-08-26

申请号：EP06002285.2

申请日：2006-02-02

申请人： Nitrochemie Aschau GmbH

发明人： Knott, Thomas, Dr. ,  Schmidt, Gerhard, Dr. ,  Ederer, Theodor, Dr. ,  Pichl, Ulrich ,  Waldmann, Ludwig

IPC分类号： C08K5/5465

CPC分类号： C08K5/5465 ,  C08L83/06

公开(公告)号：EP1452535A4

公开(公告)日：2006-02-08

申请号：EP02765355

申请日：2002-08-27

申请人： NIKKO MATERIALS CO LTD

发明人： KUMAGAI MASASHI ,  OUCHI TAKASHI ,  TSUCHIDA KATSUYUKI

IPC分类号： C08L63/00 ,  C07F7/18 ,  C08G59/42 ,  C08K5/5465 ,  C08K5/549 ,  C09D7/12 ,  C09D163/00 ,  C08G59/40

CPC分类号： C08G59/4238 ,  C07F7/1836

摘要： The invention provides a composition which is solid at room temperatures and excellent in storage stability and functions as an effective additive for epoxy resins, and a process for the preparation of the composition. The composition comprises a salt of a basic silane coupling agent with an organic carboxylic acid and is prepared by reacting a basic silane coupling agent with an organic carboxylic acid to form a salt of the agent with the acid, and then mixing under heating the resulting product with a compound which has a high affinity for the agent or the acid and a softening or melting point of 40 DEG C or above.

公开(公告)号：EP4077522B1

公开(公告)日：2024-08-07

申请号：EP19957040.9

申请日：2019-12-17

IPC分类号： C08K5/5465 ,  C08L83/04 ,  C09J183/06

CPC分类号： C08L83/04 ,  C08K5/0016 ,  C08G77/18 ,  C08G77/04 ,  Y02E10/50

公开(公告)号：EP4303258A1

公开(公告)日：2024-01-10

申请号：EP22763179.3

申请日：2022-02-28

申请人： Kaneka Corporation

发明人： HE, Yuku

IPC分类号： C08K5/5465 ,  C08L33/08 ,  C08L33/12 ,  C09J133/08 ,  C09J133/12 ,  C09J171/02 ,  C08L71/02

摘要： An embodiment of the present invention relates to a curable composition containing (A) a polyoxyalkylene-based polymer having a silicon-containing reactive group, (B) a (meth)acrylic ester-based polymer having a trialkoxysilyl group, and (C) a specific silane compound having a guanidine group. Because a nonorganotin-based catalyst is used for the curable composition of an embodiment of the present invention, the curable composition has excellent miscibility among the components, tends less to suffer a defect caused by transfer of a catalyst, is excellent in curability and adhesiveness, and, when cured, yields a cured product having excellent mechanical performance.