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305 条记录 (耗时 0.018 秒)

    VAPOR DEPOSITION FILM PRODUCTION DEVICE
    1.
    发明公开
    VAPOR DEPOSITION FILM PRODUCTION DEVICE 审中-公开

    公开(公告)号：EP4455359A1

    公开(公告)日：2024-10-30

    申请号：EP23817935.2

    申请日：2023-05-29

    申请人： Machine Technology Co., Ltd.

    发明人： KASEBE, Tsuyoshi ,  MIYAKE, Toru

    IPC分类号： C23C14/56 ,  C23C14/50 ,  H01G13/00

    摘要： Provided is a vapor deposition film manufacturing apparatus (1) which is partitioned into an upper chamber (10U) and a lower chamber (10D) with a can-roller (cooling roller) (201) provided therebetween, including: a lower-chamber vacuum unit (500); an upper-chamber vacuum unit (400); an electron supply chamber (601) which houses therein a hollow cathode (611); a valve (621) configured to supply gas for ionization while maintaining an inside of the electron supply chamber (601) at a predetermined vacuum degree; and a power supply (603) configured to ionize gas inside the electron supply chamber (601). A slit (613) is provided in the electron supply chamber (601) so as to be opened toward a surface of the roller (201). A diffusion preventing cover (604) is provided to prevent rebound electrons from diffusing from the roller (201) side. Adhesiveness of the film is enhanced by properly charging the surface of the roller (201).

    INTAGLIO JIG FOR MANUFACTURING ELECTRONIC COMPONENT
    3.
    发明公开
    INTAGLIO JIG FOR MANUFACTURING ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：EP4325540A1

    公开(公告)日：2024-02-21

    申请号：EP22788012.7

    申请日：2022-03-28

    申请人： Creative Coatings Co., Ltd.

    发明人： SATO, Eiji ,  SAKAMOTO, Hitoshi

    IPC分类号： H01G13/00 ,  H01F41/10 ,  H01G4/30

    摘要： An intaglio jig (100, 300) for manufacturing an electronic component (10, 200) having an external electrode (30 to 38, 240, 250) by applying a conductive paste (P) to an electronic component body (20, 210) includes an elastic body (110, 310), and a recessed portion (120, 320) that is formed in the elastic body and in which the conductive paste is contained. The recessed portion includes an opening (121, 321) having an opening width (W2, W6) that conforms to a width (W1, W5) of the external electrode, a bottom surface (122, 322) at a predetermined depth (D) from the opening, and at least one protrusion portion (130 to 132, 330) in which a protrusion height (H1, H2) locally protruding from the bottom surface is less than the predetermined depth (D).

    NEGATIVE-PRESSURE PACKAGING METHOD FOR ALUMINUM ELECTROLYTIC CAPACITOR
    4.
    发明公开
    NEGATIVE-PRESSURE PACKAGING METHOD FOR ALUMINUM ELECTROLYTIC CAPACITOR 审中-公开

    公开(公告)号：EP4276863A1

    公开(公告)日：2023-11-15

    申请号：EP22202983.7

    申请日：2022-10-21

    申请人： Capxon Electronic Technology Co., Ltd

    发明人： CHEN, Qirui ,  LIN, Yizhu ,  LUO, Jiaxian

    IPC分类号： H01G13/00 ,  H01G9/00 ,  H01G9/10 ,  H01M50/147 ,  H01M50/183 ,  H01G9/08 ,  H01G9/06

    摘要： A negative-pressure packaging method for aluminum electrolytic capacitors including: penetratedly arranging a capacitor element in a seal; placing the capacitor element, the seal and a case at an inner chamber of an accommodating mechanism; sealing the accommodating mechanism; vacuumizing the accommodating mechanism to allow the inner chamber to be in a negative pressure state; subjecting the seal and the case to packaging, such that the seal is located at a first depth of the case; and subjecting the seal and the case to pressing, such that the seal is located at a second depth of the case, where the second depth is closer to a bottom of the case with respect to the first depth. The defect in the prior art that the sliding distance of the seal on the inner wall of the case is too long is overcome, reducing the generation of friction heat, and preventing the melting of the seal. Therefore, the packaging method provided herein can ensure a reliable air tight seal between the seal and the case, improving the product stability and service life.

    METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
    5.
    发明公开
    METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：EP4145478A1

    公开(公告)日：2023-03-08

    申请号：EP21797325.4

    申请日：2021-04-23

    申请人： Shoei Chemical Inc.

    发明人： ESAKI, Soichiro

    IPC分类号： H01G13/00 ,  H01G4/30 ,  H01G9/055

    摘要： A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.

    ELECTROCONDUCTIVE RESIN COMPOSITION AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT
    6.
    发明公开
    ELECTROCONDUCTIVE RESIN COMPOSITION AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：EP4144801A1

    公开(公告)日：2023-03-08

    申请号：EP21797474.0

    申请日：2021-04-23

    申请人： Shoei Chemical Inc.

    发明人： ESAKI Soichiro

    IPC分类号： C08L83/04 ,  C08L83/06 ,  C08L63/00 ,  H01G13/00 ,  H01B1/22 ,  C08K3/08 ,  H01G4/232 ,  H01G4/30 ,  H01G9/042 ,  H01G9/055

    摘要： A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a metal powder, a resin binder, and an organic solvent, wherein 20.0% by mass or more of the metal powder is a flaky metal powder, and 70.0% by mass or more of the resin binder is a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.

    CAPACITOR ASSEMBLY MANUFACTURING APPARATUS AND CAPACITOR ASSEMBLY MANUFACTURING METHOD USING SAME
    9.
    发明公开
    CAPACITOR ASSEMBLY MANUFACTURING APPARATUS AND CAPACITOR ASSEMBLY MANUFACTURING METHOD USING SAME 审中-公开

    公开(公告)号：EP4020509A1

    公开(公告)日：2022-06-29

    申请号：EP21856044.9

    申请日：2021-06-15

    申请人： Samwha Electric Co., Ltd.

    发明人： PARK, Jong On ,  KIM, Tae Yun ,  JOO, Eun Kyun ,  KWON, Young Jin ,  KIM, Jin Ho ,  CHA, Geun Ju ,  JEON, Chan Ser

    IPC分类号： H01G13/00 ,  H01G9/00 ,  H01G9/008 ,  H01G9/15

    摘要： Disclosed are a capacitor assembly manufacturing apparatus and a capacitor assembly manufacturing method using the same. The capacitor assembly manufacturing apparatus comprises: a processing module for mechanically and electrically coupling a capacitor and a bracket to form a capacitor assembly; an inspection module for inspecting whether or not the manufactured capacitor assembly is operating normally; and a conveyor module in which the capacitor assembly is arranged to move in one direction and a processing process and an inspection process are sequentially performed. The present invention can precisely detect whether or not the capacitor assembly is defective through two or more inspections, and can reduce the possibility of mechanical failure and improve productivity by controlling a portion of the processing module when a plurality of mechanical defects occur.