公开(公告)号：EP4370938A1

公开(公告)日：2024-05-22

申请号：EP22842763.9

申请日：2022-07-12

申请人： Smiths Interconnect Americas, Inc.

发明人： ELMADBOULY, Khaled ,  ZHOU, Jiachun

IPC分类号： G01R1/04 ,  G01R31/28 ,  H01R12/00 ,  H01R13/20 ,  H01R13/24 ,  H05K7/10

CPC分类号： G01R1/0433 ,  G01R1/07314

公开(公告)号：EP4316216A1

公开(公告)日：2024-02-07

申请号：EP22782381.2

申请日：2022-03-14

申请人： Jabil Inc.

发明人： TIMMINS, Ian, Jeffery ,  RAFIE, Babak, Zarrin ,  FINNELL, John

IPC分类号： H05K1/11 ,  H05K1/02 ,  H01R12/00 ,  H01R12/51

公开(公告)号：EP4184702A1

公开(公告)日：2023-05-24

申请号：EP22205466.0

申请日：2022-11-04

申请人： Prime Planet Energy & Solutions, Inc.

发明人： ABE, Kosyo ,  TAKEDA, Takahide ,  TSUCHIDA, Yasushi ,  KOBAYASHI, Keiichiro ,  OCHI, Makoto ,  TAKENO, Mio ,  KOIKE, Masaki ,  WATANABE, Koji ,  SUZUKI, Yuzo ,  SAKURAMOTO, Seiichi ,  IKEDA, Yasuo ,  IWASE, Kosuke

IPC分类号： H01M50/502 ,  H01M50/298 ,  H01M50/505 ,  H01M50/51 ,  H01M50/209 ,  H01M10/42 ,  H01M10/052 ,  G01R31/00 ,  H01R12/00

摘要： A battery module (100) includes: a plurality of battery cells (11) stacked in a predetermined direction and electrically connected together; a plurality of bus bars (50) that electrically connect the plurality of battery cells (11) together; and a plurality of voltage detection wires (92) each connected to one set of two or more battery cells (11) electrically connected together. According to the battery module (100), the number of the voltage detection wires is reduced, thereby attaining reduced sizes of the bus bars, productivity improved by improved workability, and reduced cost.

公开(公告)号：EP3806717A1

公开(公告)日：2021-04-21

申请号：EP19732896.6

申请日：2019-06-14

申请人： Coloplast A/S

发明人： HANSEN, Jais Ask ,  LARSEN, Lars Erup ,  HVID, Niels

IPC分类号： A61B5/00 ,  A61F13/42 ,  H01R12/00

公开(公告)号：EP3587711A1

公开(公告)日：2020-01-01

申请号：EP19160610.2

申请日：2019-03-04

申请人： GEZE GmbH

发明人： Benchokroun, Adnane

IPC分类号： E05B47/00 ,  H01R12/73 ,  H01R9/26 ,  H01R12/00 ,  H02J1/10 ,  G06F1/26 ,  G07C9/00

摘要： Die Erfindung betrifft eine Elektronikeinheit für eine elektrisch schaltbare Zuhaltevorrichtung, mit einer Energieversorgung zur Versorgung einer Auswerte- und Steuereinheit und eines elektrischen Antriebs der elektrisch schaltbaren Zuhaltevorrichtung. Erfindungsgemäß ist die Elektronikeinheit modular aufgebaut, wobei die Auswerte- und Steuereinheit und die Energieversorgung ein Grundmodul mit einem ersten Kontaktierbereich ausbilden, welches mit mindestens einem Erweiterungsmodul mit einem zweiten Kontaktierbereich erweiterbar ist, wobei der erste Kontaktierbereich des Grundmoduls und der zweite Kontaktierbereich des mindestens einen Erweiterungsmoduls über einen Leiterplattenverbinder mechanisch und elektrisch miteinander verbindbar sind.

公开(公告)号：EP3518261A1

公开(公告)日：2019-07-31

申请号：EP19152068.3

申请日：2015-12-16

申请人： Hamilton Sundstrand Corporation

发明人： PAL, Debabrata ,  HOROWY, John

IPC分类号： H01H1/58 ,  H01H50/12 ,  H01H50/14 ,  H01R12/00 ,  H02B1/056

摘要： A contactor mounting system (100) is disclosed herein. A contactor (105) is directly mounted to the printed wire board (120). Pins (150) may be coupled to an exposed end portion of a first stationary lead (110) and a second stationary lead (115) of the contactor (105). Pins (150) may be configured to interconnect the contactor (105) to the printed wire board (120).

公开(公告)号：EP2865051B1

公开(公告)日：2019-01-09

申请号：EP13807045.3

申请日：2013-06-20

申请人： Ideal Industries, Inc.

发明人： ZANTOUT, Alan E. ,  BREEN, Dennis M., IV ,  SWEDBERG, Benjamin D.

IPC分类号： H01R12/00 ,  H01R12/73 ,  H01R12/89 ,  H01R12/70 ,  H01R12/75 ,  H01R31/08

公开(公告)号：EP3381245A1

公开(公告)日：2018-10-03

申请号：EP16810543.5

申请日：2016-11-22

申请人： Mercury Systems, Inc.

发明人： MCKENNEY, Darryl J. ,  METHRATTA, Absu ,  OUELLETTE, Erica

IPC分类号： H05K1/11 ,  H01R12/00 ,  H05K3/30

CPC分类号： H01R12/58 ,  H01R4/028 ,  H01R9/091 ,  H01R12/526 ,  H01R12/714 ,  H01R12/716 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/421 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10878 ,  H05K2201/10901 ,  Y02P70/611

摘要： An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.

公开(公告)号：EP3360204A1

公开(公告)日：2018-08-15

申请号：EP16854059.9

申请日：2016-09-15

申请人： Advanced Micro Devices, Inc.

发明人： HENG, Stephen, F. ,  HARDIKAR, Mahesh, S. ,  DANDIA, Sanjay

IPC分类号： H01R12/51 ,  H01R12/00 ,  H01R4/64 ,  H01R13/518

CPC分类号： H01R12/88 ,  H01R12/7076 ,  H01R43/205 ,  H05K3/32 ,  H05K7/1007

摘要： Various apparatus and methods of electrically connecting a packaged integrated circuit to a circuit board are disclosed. In one aspect, an apparatus includes a first frame to be mounted on the circuit board and having a first end. An insulating housing is adapted to be mounted on the circuit board and positioned in the first frame. A second frame is pivotally coupled to the first frame. The second frame includes two spaced-apart rail members and a cross member coupled to and between the rail members opposite the first end of the second frame. The rail members are operable to receive the packaged integrated circuit. The second frame has at least one engagement member to engage a first portion of the insulating housing when the second frame is pivoted toward the insulating housing. A third frame is pivotally coupled to the first frame to apply force to the packaged integrated circuit.

公开(公告)号：EP2614856B8

公开(公告)日：2017-08-02

申请号：EP13162812.5

申请日：2008-04-07

申请人： Bal Seal Engineering, Inc.

发明人： Sjostedt, Robbie J. ,  Dilmaghanian, Farshid ,  Ghasiri, Majid ,  Twork, Steve ,  Huang, Jay

IPC分类号： A61N1/375 ,  H01R12/00 ,  A61N1/05 ,  H01R105/00 ,  H01R24/58 ,  H01R13/24

CPC分类号： A61N1/05 ,  A61N1/0551 ,  A61N1/3752 ,  H01R13/2421 ,  H01R24/58 ,  H01R2105/00 ,  H01R2201/12 ,  Y10T29/49208 ,  Y10T29/49826